SMT Solder Paste Manufacturers.
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Domestic solder paste has achieved key breakthroughs in the field of temperature-stabilized solder paste. With 0307/305 alloy powder T4-grade fineness, ROL0-grade ultra-low halogen residue and rosin-based system, Jiajinyuan LFP-JJY5RQ and 5RNTT series have demonstrated excellent temperature recovery stability and delamination resistance in actual tests where the QFN solder climbing rate is nearly 100% and the void rate after reflow is below 8%, making them a cost-effective choice for replacing imported products in SMT solder paste production lines.
Published: 2009-03-12Dispensing solder paste, dot solder paste, and domestic solder paste must strictly match the process
Published: 2009-03-10Communication motherboards have extremely high requirements for solder paste's wetting ability, residue transparency, and halogen control. The 8MNTTP/5RNTT series communication board solder paste launched by domestic solder paste brand Jiajinyuan contains only 100~200ppm halogen, with minimal and transparent residue. It is compatible with high-density packages such as QFN/DFN, and achieves high-reliability solder paste performance when paired with 00507BN/T5 ultra-fine powder. It has been batch-verified on 5G base station motherboards.
Published: 2009-03-08To meet the high-reliability soldering requirements of automotive electronics, this paper recommends several domestic solder pastes suitable for key working conditions such as QFN/DFN solder climbing, low void rate, and zero halogen. Covering 8MQP/5RQ, 8M9P/5RR and other series, it balances high-temperature reflow stability and residue transparency, providing a selection basis for automotive solder pastes that can be directly introduced into production lines for the domestic substitution of electronic solders.
Published: 2009-03-06For R&D sample prototyping scenarios, multiple small-packaged domestic solder pastes are recommended, covering types such as halogen-free lead-free high-temperature, zero-halogen, water-washable, and laser-specific. Among them, the 8MQP/5RQ series has a solder wetting rate close to 100%, and the 8M9P/5RR achieves 0ppm halogen content and an extremely low void rate, making it particularly suitable for high-demand working conditions such as QFN/DFN packages and automotive lighting. All models support 10g/20g/50g small packages, meeting the three core demands of prototyping solder paste, small-packaged solder paste, and domestic solder paste.
Published: 2009-03-04Insufficient solder paste volume on low-solder pads is the main cause of high-frequency cold soldering defects in SMT production lines, directly resulting in poor solder joint wetting, increased void rate, and failed thrust tests. When Jiajinyuan solder paste is printed through a 0.12mm thick stencil, if the squeegee pressure is below 4.5kg and the speed exceeds 40mm/s, discontinuous solder volume is extremely likely to form on the edges of 0.3mm pitch QFN pads, requiring simultaneous adjustment of the release speed and PCB support flatness.
Published: 2009-03-03500g canned solder paste balances material change frequency and waste control in SMT production lines. The domestic solder paste brand Jiajinyuan's multiple series of halogen-free, lead-free high-temperature solder pastes cover scenarios such as QFN solder climbing, low voidage in automotive lamps, and high-precision communication applications. Its models including 8MQP/5RQ, 8MNTTP/5RNTT, and 8M9P/5RR stand out in T3-T5 alloy powder particle size distribution, halogen content ranging from 100~200ppm to 0ppm, and residue transparency, making them a cost-effective alternative to imported SMT solder pastes.
Published: 2009-03-02To meet the stringent requirements of SMT production lines for solder paste with stable viscosity, several domestic solder pastes are recommended, covering types such as halogen-free and lead-free high-temperature, zero-halogen, water-washable, and laser-specific. Among them, the 8MQP/5RQ and 8MNTTP/5RNTT series stand out in terms of QFN solder climbing rate, residue transparency, and halogen control, making them preferred SMT solder pastes that balance viscosity stability and process adaptability.
Published: 2009-02-28To meet stringent requirements in high-density PCB soldering such as fine pitch, high solder climb rate, and low void rate, multiple domestic halogen-free, lead-free high-temperature solder pastes compatible with T3/T4/T5 grade fine powder solder pastes are recommended, covering high-activity scenarios for QFN/DFN, precision placement in communications and consumer electronics, low-void thermal management for automotive lamps, and special models for laser dispensing. All products use 0307/305 alloy powders with a measured melting point of 217–227℃, balancing printability, wettability, and residue transparency.
Published: 2009-02-26Insufficient solder is a frequently occurring soldering defect in SMT production lines, especially prominent on large pad designs and PCBs with copper thickness of 2oz or above. Its essence is the combined effect of decreased solder paste transfer rate and insufficient wetting during the printing, placement, and reflow stages, requiring coordinated intervention across multiple links such as stencil aperture, squeegee pressure, peak temperature of the reflow profile, and nitrogen purity.
Published: 2009-02-24Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.