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Here you can find knowledge about Solder Storage Conditions, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
The shelf life of refrigerated solder paste in storage refrigerators is usually 6 months, but the temperature must be strictly controlled within the range of 0℃~10℃ and temperature fluctuations must be avoided. After opening, the effective service life at 25℃ environment shall not exceed 12 hours. If refrigerated solder paste is repeatedly taken in and out of the refrigerator causing condensation, it will directly lead to defects such as solder balls, sharp pins and solder joint voids.
Published: 2012-04-11SMT defects often stem from improper solder paste selection, unreasonable stencil aperture design, and mismatched reflow soldering parameters. If any of these three links goes out of control, it will cause typical defects such as cold solder joints, solder bridges, or tombstoning. JIAJINYUAN solder pastes exhibit significant differences in rheological properties under different alloy systems and activity levels, requiring collaborative verification in combination with component density, pad size, and furnace temperature profile.
Published: 2012-04-04Automotive electronic solder is prone to microcracks and interfacial delamination during high-low temperature cycling. The sample testing service provided by JJY can realistically simulate solder joint reliability under conditions of -40℃ to 125℃ and 500 cycles, helping production lines quickly verify the compatibility of solder with PCB pads and component terminals, and avoid functional failures after batch soldering.
Published: 2012-03-11
Excessively high activity of solder paste can cause welding hazards such as solder joint voids, component corrosion, solder ball splashing, and whitening residue on the PCB surface. This is especially true in high-temperature and high-humidity environments, where the risk of ionic contamination is exacerbated, directly affecting the SMT line's first-pass yield and the product's long-term reliability.
Published: 2012-02-20Regarding the component drop-off issue during large-size device placement, the rheological properties and metal content of solder paste directly affect print formation and tack retention. Solder paste for placement needs to balance thixotropic index, slump rate, and room-temperature tack. The proportion of rosin matrix, type of activator, and particle size distribution of spherical solder powder in the solder paste formulation jointly determine the displacement resistance of devices during the placement stage.
Published: 2012-01-28To address high-frequency defects such as cold solder joints, tombstoning, and misalignment when soldering 01005 components on precision small boards in consumer electronics, this solution focuses on stencil aperture optimization, solder paste rheological property matching, and closed-loop control of the Z-axis pressure of the placement machine. By reducing the stencil thickness from 0.1mm to 0.08mm and matching it with the Jiajinyuan J-105F solder paste with a thixotropic index of 2.35, the first-pass soldering yield of 01005 components is increased from 82.6% to 97.3%, while avoiding the risk of pad peeling caused by excessive squeegee pressure.
Published: 2012-01-23Consumer electronics solder places extremely high demands on batch consistency, thixotropy, and reflow performance of solder paste in SMT placement production lines. By optimizing the sphericity and particle size distribution of metal powder and strictly controlling the volatilization rate of flux, Jiajinyuan solder paste achieves continuous 30-day CPK ≥ 1.33 on mass production lines with a daily output of one million points, effectively reducing the rate of typical defects such as bridging, cold solder joints, and solder balls.
Published: 2012-01-09
The frequency of adding wave soldering bars depends on the average daily soldering volume, temperature fluctuation of the solder pot, and the accumulation rate of impurities. Typically, additional solder bars need to be replenished every 8 to 12 hours. During replenishment, it is necessary to simultaneously clean the dross, calibrate the liquid level, and ensure that the new solder bars are preheated to above 180°C before being slowly immersed, so as to avoid unstable solder waves or aggravated oxidation caused by cold material impact.
Published: 2011-12-24Automotive electronic solder must maintain zero solder joint cracking under wide temperature range from -40℃ to 150℃, high vibration and long-life operating conditions. Jiajinyuan's high-reliability formula precisely controls the ratio of silver, copper and bismuth ternary metals as well as the residual amount of active flux, increasing the thermal fatigue resistance life of solder joints by 3.2 times and reducing the drop impact failure rate to below 0.008%, fully meeting the AEC-Q200 automotive grade requirements.
Published: 2011-12-18ASEAN foreign trade solder has passed the full-item testing of the RoHS Directive and multiple physical, chemical and toxicity tests conducted by SGS. The contents of restricted substances such as lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyls, and polybrominated diphenyl ethers are all lower than the mandatory thresholds of the EU and mainstream ASEAN countries. With complete batch factory inspection reports and certificates of origin, it can be directly used for the access filing of SMT production lines in electronic foundries in Vietnam, Thailand, Malaysia and other countries.
Published: 2011-11-12Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.