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The amount of solder paste is not the more the better; excessive usage will lead to solder beads, bridging, and residual contamination. In actual production lines, poor solder wetting often stems from excessive solder paste printing thickness or mismatched stencil aperture design, rather than simply increasing the amount. Precise control of the solder paste volume ratio and activity matching is the core to ensuring the reliability of solder wetting.
Published: 2016-02-13Excess solder is a core defect causing short circuits, bridging and cold solder joints in fine-pitch IC production, and its occurrence is strongly coupled with stencil aperture design, squeegee pressure, solder paste rheological properties and reflow parameters. Production line data from Jiajinyuan shows that over 63% of solder defects caused by excess solder are directly associated with solder paste printing thickness exceeding the standard by more than 0.02 mm, and strict control of excess solder has become a rigid threshold for improving the yield of CSP and QFN 0.4 mm pitch devices.
Published: 2016-02-04Cracks in solder paste joints are mostly caused by thermal stress and material mismatch, which are particularly prominent in large-size BGA, thick copper PCB, and high-low temperature cycling conditions. Selecting solder paste with low modulus, high ductility, and low residual stress after reflow can significantly improve solder paste reliability. Combined with printing accuracy control and reflow profile optimization, microcrack formation can be suppressed from the source.
Published: 2016-01-31BGA chip reballing repair relies on precise reballing processes. Jiajinyuan's dedicated solder paste works in synergy with matching solder balls to ensure solder joint coplanarity, tensile strength, and void rate meet standards. This solution has been verified on multiple production lines to stably pass 500 cycles of -40℃~125℃ thermal shock without defects such as solder bridging, cold solder joints, or ball misalignment.
Published: 2016-01-29The use of T5/T6 ultra-fine solder paste in the ball mounting process can significantly improve the consistency of solder ball formation and edge retention, addressing issues such as easy edge collapse, poor sphericity, and height dispersion commonly associated with traditional solder pastes. It is particularly suitable for micro-pitch BGA ball mounting below 0.3mm and high-density packaging scenarios.
Published: 2015-12-17Excessively high peak reflow temperature of solder paste will directly lead to excessive growth of intermetallic compounds in solder paste joints, intensified dissolution of pad copper, and thermal damage to component bodies. In actual production lines, common defects include cold solder joints, solder balls, tombstoning, and PCB delamination. This problem mostly stems from inaccurate temperature profile settings, drift of furnace temperature sensors, or uncalibrated differences in activity between different batches of solder paste.
Published: 2015-12-10Solder OEM contract manufacturing embeds the ISO 9001 quality management system throughout the entire process, covering incoming raw material inspection, melting parameter monitoring, wire drawing tension calibration, and packaging environment temperature and humidity recording. It achieves a melting point deviation of ≤±1.2℃ for each solder batch, controls the fluctuation of rosin residue within the range of 0.35% to 0.42%, ensures no downtime during material changeover on SMT production lines and zero adjustment of reflow profiles, and truly supports batch stability in solder OEM contract manufacturing delivery.
Published: 2015-11-29RoHS solder is a mandatory access threshold for the export of foreign trade electronic products. Jia Jinyuan RoHS solder has passed all SGS tests, with lead content <100ppm, cadmium <50ppm, and hexavalent chromium <1000ppm, fully meeting the requirements of the EU RoHS 2.0 Directive and the US CPSIA. It has completed full-process verification of solder paste printing, reflow soldering, and AOI inspection on the production lines of 37 OEM factories in Shenzhen, Dongguan, Suzhou and other places.
Published: 2015-11-12
The acid value of solder paste directly affects solder wettability and residual corrosion risk. Acidic solder paste is suitable for difficult-to-solder metals but requires strict control of the cleaning process, while neutral solder paste is mostly used for high-reliability PCBs and no-clean scenarios. Selection must be comprehensively determined based on the oxidation degree of the substrate, the material of component pins, the reflow temperature window, and the production line's cleaning capability.
Published: 2015-11-01Domestic solder has achieved full-process controllability from material formulation to batch stability, supports customers in small-batch sample trial and prototyping, and is widely adapted to scenarios such as new energy vehicle BMS modules, high-reliability PCBA for medical monitors, and consumer fast-charging boards. It can maintain 4-hour printing stability under workshop temperature control of 25℃~30℃. The thixotropic index of Jia Jinyuan solder paste reaches 0.72, with a viscosity recovery rate ≤15%, fully meeting the fine printing requirements of 0201 components and 0.3mm pitch QFN.
Published: 2015-10-22Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.