SMT Solder Paste Manufacturers.
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Here you can find knowledge about Solder Specifications, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
AOI inspection after SMT reflow soldering can efficiently identify appearance soldering defects such as solder joint bridging, tombstoning, solder beads, and misalignment, greatly reducing the missed inspection rate of manual visual inspection. With a pixel accuracy of 0.015mm and the capability of multi-angle light source switching, Jia Jinyuan's AOI inspection equipment stably controls the false alarm rate within 1.2% for solder joint judgment of components below 0603.
Published: 2016-07-14To address the issue of solder joint cracking caused by concentrated thermal stress in energy storage new energy electronic control boards during frequent charge-discharge cycles, solder paste with high ductility, low elastic modulus, and excellent thermal cycle life must be selected. New energy solder paste must pass thermal shock verification at -40℃ to 125℃ for more than 1000 cycles, while reliability solder paste emphasizes the uniformity of the IMC layer and the stability of the Cu6Sn5 phase. The metal content, particle size distribution, and flux residue ion concentration of the solder paste jointly determine its long-term thermal fatigue resistance.
Published: 2016-07-02Soldering of 01005 components is highly sensitive to solder paste particle size and rheological properties. T6 ultra-fine solder paste (particle size 2~5μm) can significantly reduce the defect rates of solder balls and solder bridges. When its thixotropic index is controlled within the range of 0.75~0.85, it can still maintain clear edges and complete demolding under 0.1mm stencil apertures. Combined with fine-tuning of the printing parameters of Jiajinyuan J-603B solder paste, the measured solder bridge occurrence rate is reduced from 1200ppm to 86ppm.
Published: 2016-06-06The pricing method and process for solder paste and solder dross recycling are directly related to m
Published: 2016-05-18
Poor sphericity of solder powder in solder paste significantly reduces print forming rate, leading to high-frequency defects such as missing printing, solder bridging, and misalignment, which is particularly prominent on 0201 and smaller package devices. Non-spherical solder powder has poor fluidity, high rolling resistance, and increased friction with the stencil aperture walls, directly affecting solder paste release rate and demolding consistency.
Published: 2016-05-12In SMT printing, the rheological properties of solder paste directly affect continuous printing stability. An excessively high thixotropic index easily leads to poor demolding and edge pinholes, while an excessively low thixotropic index causes slump and aperture clogging. Jiajinyuan solder paste achieves precise control of the viscoelasticity ratio. Under 25°C environment and 0.5mm stencil conditions, the measured thixotropic index is 1.8～2.3. Combined with the parameter set of squeegee pressure 2.8kg and speed 45mm/s, it can continuously complete 1200 PCBs without aperture clogging.
Published: 2016-04-10Daily routine inspection of reflow soldering production lines is the core line of defense against batch defects. Through systematic checks of rail parallelism, nitrogen purity, deviations between actual and set temperatures in each temperature zone, chain speed stability, and cooling section wind speed every shift, over 90% of typical defects such as cold solder joints, tombstoning, and cold soldering can be intercepted in advance, avoiding batch rework caused by single-point failures.
Published: 2016-03-28Excessive solder paste voiding rate of the thermal pad at the bottom of QFN is a high-frequency failure on SMT production lines, requiring coordinated optimization from four aspects: solder paste selection, stencil aperture design, printing parameters, and reflow profile. Although low-void solder paste can reduce the voiding rate, it cannot replace process matching. The squeegee pressure and speed, nitrogen purity, and temperature gradient of each reflow zone must be adjusted in accordance with the actual equipment status of the production line.
Published: 2016-03-21RoHS solder strictly complies with the EU RoHS environmental directive, completely eliminating six categories of hazardous substances including lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyls, and polybrominated diphenyl ethers. It is suitable for high-reliability production lines such as consumer electronics, medical equipment, and automotive electronics. In Jia Jinyuan's actual SMT mass production, it has been verified that it has stable wettability at a peak temperature of 245°C, a void rate lower than 3.2%, and the thickness of the solder joint IMC layer is controlled within the range of 1.8~2.4μm.
Published: 2016-03-14Domestic solder has fully matched imported products in key indicators such as melting point stability, wetting speed, and residue corrosivity. When used with Jia Jinyuan's specially formulated flux, the first-pass yield of 0201 component soldering remains stable at 99.87%, while the procurement cost is only 63% of that of imported solder of the same specification. For large-volume orders, the coordination of logistics and payment terms further reduces the overall delivery cost.
Published: 2016-02-18Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.