SMT Solder Paste Manufacturers.
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Solder paste must balance low spatter, fast melting, strong wetting, and high residue stability in both laser soldering and Hotbar thermocompression soldering. Hotbar solder paste must maintain sharp, non-sagging edges after ultra-thin 0.15mm printing, while laser soldering paste must complete melting within 300ms at a power density of 1200W/cm2 without oxidation black spots.
Published: 2017-07-04Solder dross is continuously generated during wave soldering machine operation and floats on the surface of the molten solder bath. If not removed in time, it will cause intensified liquid level fluctuations, increased risk of nozzle clogging, and frequent solder spikes and bridging on solder joints. Regular dross removal is a key action to ensure consistent wave height and soldering yield. Production line verification by Jiajinyuan shows that manual dross removal every 4 hours can stably control the thickness of solder dross within 3mm.
Published: 2017-06-15
Whether to choose solder wire or solder ribbon for manual welding is essentially a process matching issue. Solder wire is suitable for welding large solder joints and high-heat components, while solder ribbon, with its thinner flux core and more controllable solder output, is adapted for tiny surface-mount components such as 0402 and 0603. The selection of wire diameter must be comprehensively determined by considering the soldering iron power, pad size, and the operator's proficiency level.
Published: 2017-06-11The solder for industrial control motherboards is specifically designed for high-reliability soldering of industrial control motherboard PCBA. It features excellent wettability, low void rate, and strong thermal cycle resistance, meeting the demands of harsh scenarios such as wide temperature range, long service life, and vibration resistance. It is a core material for ensuring the long-term stability of solder joints on industrial control motherboards.
Published: 2017-06-01During the BGA welding rework and ball mounting process, the molding stability of solder paste directly determines the ball mounting yield and subsequent reflow soldering reliability. Jiajinyuan solder paste demonstrates excellent anti-offset capability in 0.3mm pitch BGA ball mounting. The synergistic control of its thixotropic index and pre-reflow collapse amount keeps the center offset of the solder balls stably controlled within ±15μm.
Published: 2017-05-28High-viscosity solder paste significantly improves the placement offset issues of 0201, 0402 and other tiny components as well as irregular devices in SMT production, and is especially suitable for complex scenarios such as double-sided reflow, stepped stencils, and high-density board layouts. Its characteristics of strong thixotropy, low slump rate, and long room-temperature holding time reduce the component displacement rate during the solder paste placement process by more than 40%, while easing the pressure on the waiting window from after printing to before placement.
Published: 2017-04-26SMT stencils are core consumables in the SMT solder paste printing process. Their aperture size, thickness, surface treatment, and tension state jointly determine the stability of solder paste transfer volume. Jiajinyuan SMT stencils, through laser cutting precision control and electropolishing process optimization, achieve a solder paste transfer rate of over 92% at a thickness of 0.12mm, effectively suppressing common high-frequency production line defects such as insufficient solder, solder bridging, and edge burrs.
Published: 2017-04-18
Solder paste delamination is a phase separation phenomenon between solder powder and flux caused by density differences or improper storage, manifesting as a clear oily substance on the upper layer and particle deposition on the lower layer. In this state, the printing accuracy of the solder paste decreases and the risk of slump increases, so it must be discontinued and re-stirred or scrapped.
Published: 2017-04-05The solder used in energy storage modules is extremely sensitive to voiding rate. Low-void solder paste can control the voiding rate of BGA solder joints within 5%, significantly improving the thermal fatigue life of electronic control boards under high-power cycling. Jiajinyuan JY-810A solder paste, with its stable thixotropy, low residue, and reflow wetting angle of less than 25°, has become a practical combination for BGA soldering of electronic control boards in the selection of solder materials for energy storage modules.
Published: 2017-04-04SMT placement pressure control directly affects the deformation state of solder paste. Excessive pressure will cause the solder paste to be squeezed laterally to both sides of the pad, leading to bridging defects. JIAJINYUAN placement machines achieve ±0.02N precision control through real-time pressure feedback and Z-axis dynamic compensation, combined with stencil aperture design matched with the rheological properties of solder paste, to suppress bridging from the source.
Published: 2017-03-09Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.