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The reflow parameters of solder paste directly affect solder joint wettability, void rate and component reliability. An excessively fast heating rate can easily cause solder beads and PCB warpage, while insufficient peak temperature leads to cold soldering, and excessively high peak temperature will damage heat-sensitive devices. In actual production lines, the solder paste reflow profile needs to be dynamically adjusted according to the solder paste model, PCB thickness and component layout.
Published: 2012-07-19To address issues such as reduced activity, unstable viscosity, and settling of metal particles in solder paste caused by fluctuations in temperature and humidity during sea freight of ASEAN foreign trade solder products, the Jiajinyuan constant-temperature packaging system achieves triple synergy through phase-change materials, vacuum insulation layers, and real-time temperature-sensing labels. It maintains the temperature inside the box within the range of 22℃±3℃ throughout the 30-day sea freight cycle, ensuring that the wetting angle of solder joints after solder paste reflow soldering is less than 35°, the bridging rate is below 0.08%, and the printing release rate remains above 99.7%.
Published: 2012-06-02In circuit board soldering, solder paste, solder wire, and solder bar each have their own dedicated roles: solder paste is exclusively used for SMT placement reflow soldering, solder wire is suited for manual touch-up soldering and rework, and solder bar is limited to pre-tinning in wave soldering or tin coating on high-power heat sinks. Selecting the wrong solder material will lead to common high-frequency production line defects such as cold solder joints, bridging, and poor wetting.
Published: 2012-05-18Clogging of solder paste dispensing needles is a frequent failure on SMT production lines, mostly caused by improper solder paste selection, improper storage, and insufficient temperature recovery and stirring before use. Based on 20 years of production line practical experience, this paper systematically summarizes the key points of dispensing solder paste's shelf life after opening, temperature control, stirring parameters, and material change cleaning, providing directly applicable operational thresholds for solder paste maintenance.
Published: 2012-05-04RoHS solder is directly supplied by domestic manufacturers and supports sample verification. Jiajinyuan RoHS solder has passed all SGS tests, with lead content <100ppm, cadmium <50ppm, hexavalent chromium <1000ppm, and melting point fluctuation between batches ≤±1.5℃. It is suitable for mainstream packages such as 0201 to QFN48. When used with rosin-based flux in a nitrogen environment, it achieves a wetting angle <35°, and the thickness of the solder joint IMC layer is stably controlled within the range of 1.2～1.8μm.
Published: 2012-05-04Relying on measured production line data, solder manufacturers continuously optimize the rheological properties and reflow performance of solder pastes. To address common issues such as 01005 component placement, QFN bottom voiding, and poor wetting on OSP boards, they provide customized solder pastes with adjustable viscosity, thixotropic index, and metal content, while also supplying solder wires and bars to deliver a full range of soldering materials.
Published: 2012-04-18
Common failures of soldering consumables in electronics factories directly hit production line pain points, covering solder paste printing misalignment, collapse, oxidation and skinning, solder wire soldering spatter, icicle formation, poor wetting, insufficient activity of soldering paste and whitening residue, etc. Combined with 20 years of SMT practical experience, immediately executable parameter adjustment and material control solutions are provided.
Published: 2012-04-18The shelf life of refrigerated solder paste in storage refrigerators is usually 6 months, but the temperature must be strictly controlled within the range of 0℃~10℃ and temperature fluctuations must be avoided. After opening, the effective service life at 25℃ environment shall not exceed 12 hours. If refrigerated solder paste is repeatedly taken in and out of the refrigerator causing condensation, it will directly lead to defects such as solder balls, sharp pins and solder joint voids.
Published: 2012-04-11SMT defects often stem from improper solder paste selection, unreasonable stencil aperture design, and mismatched reflow soldering parameters. If any of these three links goes out of control, it will cause typical defects such as cold solder joints, solder bridges, or tombstoning. JIAJINYUAN solder pastes exhibit significant differences in rheological properties under different alloy systems and activity levels, requiring collaborative verification in combination with component density, pad size, and furnace temperature profile.
Published: 2012-04-04Automotive electronic solder is prone to microcracks and interfacial delamination during high-low temperature cycling. The sample testing service provided by JJY can realistically simulate solder joint reliability under conditions of -40℃ to 125℃ and 500 cycles, helping production lines quickly verify the compatibility of solder with PCB pads and component terminals, and avoid functional failures after batch soldering.
Published: 2012-03-11Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.