SMT Solder Paste Manufacturers.
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01005 component soldering is currently one of the most challenging process bottlenecks on SMT production lines. Its 0.4mm×0.2mm size, 0.12mm pad pitch, and extremely low heat capacity require solder paste printing accuracy of ±15μm, placement repeatability ≤±10μm, and reflow peak temperature fluctuation controlled within ±2℃. The measured yield of Jiajinyuan JTY-806 solder paste paired with JTS-300 placement machine is stable at 99.2%～99.5%, but at least 3 rounds of fine-tuning are still required for the first article after line changeover to meet the standards.
Published: 2018-11-19
The flux content of solder wire directly affects solder wettability, residue control, and cold solder joint risk. In actual production lines, 0.5% to 3.0% is a common range, among which 1.8% to 2.2% delivers the best overall performance in wave soldering and manual soldering scenarios. Excessively high flux content tends to cause heavy smoke and yellowing of the PCB surface, while excessively low flux content leads to insufficient wetting and an increased probability of bridging.
Published: 2018-11-03Solder OEM contract manufacturing produces solder according to customer formulations, preserving original process performance. It can accurately replicate solder paste rheological properties, wetting speed, and reflow sphere formation consistency, avoiding printing slump, increased solder joint void rate, and ICT test misjudgment caused by raw material substitution or process adjustments. It is especially suitable for high-density BGA, 01005 components, and automotive-grade thermal cycle verification scenarios.
Published: 2018-10-06Post-printing solder paste placement failure and downtime stencil cleaning time directly determine the SMT first-pass yield. If solder paste remains on the stencil for more than 15 minutes, obvious slump, oxidation, and viscosity increase will occur. If stencil cleaning is delayed for more than 30 minutes after downtime, dried residual solder paste will cause solder spikes and insufficient solder in the next batch of printing. The production line must dynamically set the effective window after solder paste printing and the stencil cleaning response threshold based on solder paste type, workshop temperature and humidity, and printing frequency.
Published: 2018-10-03During soldering of ENIG boards, the wettability of solder paste directly affects the formation quality of solder joints. Jiajinyuan solder paste demonstrates excellent spreading ability and low void rate on ENIG boards. With a conventional reflow profile, it can achieve full solder joints, complete pin wrapping, and eliminate common production line defects such as solder spikes and cold solder joints.
Published: 2018-09-28Due to the large heat capacity and slow heating rate of thick copper plate welding, wave soldering is prone to missing solder. Selecting high-wettability solder bars can significantly improve the spreading ability of molten solder on thick copper substrates. Combined with the collaborative optimization of process parameters such as increasing the preheating temperature to 130℃～140℃ and reducing the chain speed to 1.0m/min～1.2m/min, it effectively solves problems such as insufficient solder joints, bridging defects, and cold solder on the back of the PCB.
Published: 2018-08-29The selection of eutectic solder must closely focus on the two key hard indicators of melting point and ductility, as the melting point directly determines the width of the reflow profile window, while ductility affects the thermal fatigue resistance of solder joints. Jia Jinyuan's Sn63Pb37 eutectic solder melts precisely at 183℃ with an elongation rate stably above 45%, making it a reliable choice for mass production of automotive controllers and industrial power boards.
Published: 2018-08-13
The solder paste can be directly applied to PCB pads, but this is limited to special scenarios such as rework, small-batch manual soldering, or BGA ball mounting. Direct application is strictly prohibited on conventional SMT placement production lines, otherwise it will cause problems such as solder paste printing misalignment, increased void rate after reflow, and corrosion of pads by residues. A comprehensive judgment must be made based on the specific process window, activity level of the solder paste, and surface treatment method of the PCB pads.
Published: 2018-08-11Excessive solder paste volume on multi-pin pads is one of the main causes of bridging and solder ball defects on SMT production lines. For Jiajinyuan solder paste, if the printing thickness exceeds 140 μm under a 0.12 mm stencil opening, solder bridges are highly likely to form between fine-pitch devices such as QFP and SOIC. Meanwhile, solder balls may form due to bursting caused by obstructed escape of flux vapor during reflow.
Published: 2018-07-23Based on real cases from SMT production lines, this paper details the verification methods for the insulation performance of the no-clean solder paste process, covering three core solder paste testing methods: ionic contamination testing, surface insulation resistance (SIR) testing, and post-reflow ICT open-circuit retesting. It emphasizes the direct impact of no-clean solder paste residues on the risk of leakage between micro-pitch solder joints under BGA packages.
Published: 2018-07-14Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.