SMT Solder Paste Manufacturers.
Focused on SMT soldering processes, a one-stop electronic soldering solutions provider.
Here you can find knowledge about Solder Bar Wholesale, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
Voiding directly affects solder joint reliability in SMT soldering. Its main causes include insufficient volatilization of solder paste flux, pad oxidation, and improper reflow heating ramp-up, which often interact with each other in actual production lines. Jiajinyuan solder paste shows variations in void rate under different stencil aperture designs and reflow profile matching, requiring coordinated optimization across printing, storage, and reflow profile stages.
Published: 2013-02-08
Stainless steel welding imposes special requirements on the activity, melting point, and flux composition of solder wire. Ordinary solder wire cannot achieve reliable connections at all due to insufficient rosin activity, poor wettability, and its inability to effectively break down the dense oxide film on stainless steel surfaces. Dedicated stainless steel solder wires containing halogen activators or organic acid composite systems must be selected, and used in coordination with mechanical grinding and flux paste.
Published: 2013-01-22The process parameter debugging of selective wave soldering should focus on the coordinated matching of nozzle temperature, chain speed, tin immersion time, and nitrogen coverage intensity. In actual production lines, Jiajinyuan equipment can significantly suppress bridging defects between pins of QFP-44 and SOIC-28 devices by controlling the nozzle temperature at 255℃±2℃, setting the chain speed at 0.8m/min, maintaining the single-point tin immersion time at 3.2 seconds, and stabilizing the nitrogen flow rate at 12L/min, which is especially suitable for secondary soldering scenarios after rework of high-density double-sided boards.
Published: 2013-01-16
The standard control specification for solder paste printing thickness is typically 120±20μm. This value must be dynamically adjusted based on stencil aperture dimensions, squeegee pressure and speed, and the rheological properties of the solder paste. In actual production lines, over 80% of cold solder joint and solder bridge defects can be traced back to out-of-tolerance printing thickness deviations.
Published: 2012-12-05An overly small solder paste stencil aperture will result in insufficient solder paste deposition during printing, which in turn causes defects such as cold solder joints and tombstoning. Based on real production line cases, this paper proposes immediately actionable countermeasures from three aspects: verification of stencil design parameters, matching of squeegee pressure and speed, and adaptation to solder paste rheological properties. It emphasizes stabilizing the solder paste volume by adjusting printing parameters and selecting the appropriate solder paste without replacing the stencil.
Published: 2012-11-22
The purity of solder bars directly affects the quality of wave soldering joints. 99.99% purity solder bars can significantly reduce the rate of solder joint voids and poor wetting, while solder bars containing lead or excessive impurities are prone to forming solder balls, sharp protrusions, and bridging defects at the edges of PCB pads. Production line measurements show that for every 0.005% excess in the total amount of impurities such as copper, iron, and arsenic in the solder bars, the rate of cold solder joints increases by 12% to 18%.
Published: 2012-11-17Ball mounting process yield control should focus on solder paste printing consistency, stencil tension stability, and reflow profile matching. By monitoring squeegee pressure fluctuations in real time, optimizing the vacuum suction parameters of the ball mounting machine, and calibrating visual positioning offsets, the incidence of cold solder joints and solder ball misalignment can be significantly reduced. On Jiajinyuan's production line, the measured defect rate per batch of ball mounting was reduced from 0.87% to 0.23%. The key lies in coupling all stages of the ball mounting process into a closed-loop feedback system.
Published: 2012-11-16In dip soldering, the oxidation resistance of tin bars directly affects the amount of tin dross generated. By optimizing the tin-copper-nickel ternary alloy ratio and adding trace rare earth elements, Jiajinyuan tin bars reduce the oxide film growth rate by 40% at a conventional dip soldering temperature of 255℃～265℃. The measured tin dross loss per shift drops from 1.8kg to 0.95kg, significantly reducing the frequency of manual dross skimming and the tin bar replenishment interval.
Published: 2012-10-07
The particle size of SMT solder powder directly affects solder paste printing accuracy and solder joint reliability. The core difference between Type 3 powder and Type 4 powder lies in their different D50 median diameter values: the former is approximately 25±5μm, while the latter is approximately 20±4μm. Finer particle sizes are more prone to oxidation and more difficult to print, requiring matching stencil aperture and squeegee parameters.
Published: 2012-09-01In SMT printing, the matching of squeegee pressure and speed directly affects solder paste transfer rate. Excessive pressure easily causes solder spikes and stencil deformation, while insufficient pressure leads to insufficient solder and edge collapse. Combined with actual production line data of Jiajinyuan squeegees, controlling the pressure at 4.5±0.3kg and setting the speed to 45±3mm/s can significantly reduce the defect rate.
Published: 2012-08-17Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.