SMT Solder Paste Manufacturers.
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The electronics manufacturing exhibition held at the Shanghai New International Expo Centre from January 15 to 17, 2026, showcased substantial progress in SMT solders in areas such as high reliability, low-temperature lead-free technology, and fine-pitch compatibility. Multiple leading material manufacturers released new SMT solders tailored for Chiplet packaging and automotive PCBs. The industry consensus is shifting from purely compositional optimization toward the coordinated verification of process compatibility and long-term thermomechanical stability.
Published: 2026-02-21
The iteration of SMT solder technology is accelerating, and the application proportion of environmentally friendly SMT solders such as lead-free, low-temperature, and high-reliability types in consumer electronics, automotive electronics, and industrial control fields has increased significantly. In 2025, the procurement proportion of environmentally friendly SMT solders among mainstream domestic EMS manufacturers has exceeded 78%, and some leading foundries have fully switched to new alloy systems compliant with the JEDEC J-STD-006C standard in their automotive-grade production lines.
Published: 2026-02-08
Industry research data for January 2026 shows that demand for SMT solder increased by 12.3% year-on-year, mainly driven by the mass production of new consumer electronics products, the rising penetration rate of multi-layer PCBs in automotive electronics, and the ramp-up of AI server orders. Meanwhile, raw material price fluctuations and delivery uncertainty are forcing leading EMS manufacturers to collaborate with solder suppliers to build VMI warehousing and distribution systems. The localized response capability and batch consistency of the SMT solder supply chain have become key variables in production line yield control.
Published: 2026-01-31AOI inspection achieves millisecond-level image acquisition and defect identification in SMT production lines, enabling real-time interception of typical defects such as solder bridging, misalignment, and missing printing. Paired with the high-resolution industrial cameras and adaptive algorithms of Jiajinyuan AOI equipment, it increases defective board screening efficiency by more than 3 times, significantly reducing manual re-inspection rates and downstream rework costs.
Published: 2025-10-30In the SMT soldering production line, solder paste thawing and stirring operations directly affect printing yield and reflow soldering void rate. Jia Jinyuan solder paste must be left to stand in an environment of 22℃±2℃ for more than 4 hours to be fully thawed. Stirring must adopt a dual-parameter locked mode with a constant speed of 60rpm and a duration of 120 seconds; otherwise, defects such as solder balls, solder spikes, and solder paste collapse are likely to occur.
Published: 2025-09-10SMT quality control should focus on reviewing and categorizing defective products, reverse-engineering process parameter deviations through typical defects such as solder paste printing offset, reflow soldering cold joints, and placement misalignment. Combined with the response characteristics of Jiajinyuan equipment, continuously calibrate squeegee pressure, stencil tension, and reflow profile, closing the loop of issues in first article confirmation and in-process inspection.
Published: 2025-08-06Reflow soldering is a key step in the SMT placement process to achieve metallurgical bonding of component pads. Solder paste goes through four stages in the reflow oven: preheating, soaking, reflow, and cooling, to complete melting and wetting. Its temperature profile setting, furnace temperature uniformity, and solder paste activity directly affect solder joint strength and void rate.
Published: 2025-07-04Tombstoning is a frequently occurring soldering defect in SMT placement of small-size resistors and capacitors, which directly reduces the first-pass yield. Production line data from Jiajinyuan shows that tombstoning of 0402/0201 components accounts for 68% of placement defects, mainly caused by solder paste printing offset, mismatched reflow oven temperature profile, and asymmetric PCB pad design.
Published: 2025-06-12Thick copper board welding must address three major challenges: large heat capacity, rapid heat dissipation, and difficult wetting caused by copper surface oxidation. During the SMT placement stage, the reflow peak temperature must be increased to 265℃±3℃ and the time above the liquidus line must be extended to over 90 seconds. For wave soldering, a combination of high-activity no-clean flux with a preheating temperature of 150℃, wave height of 10mm, and conveyor angle of 5° must be used. Otherwise, cold solder joints, excessive solder joint void rates, and pad peeling on thick copper PCBs are highly likely to occur.
Published: 2025-02-16
Solder paste and red glue processes can be mixed on the same PCB, but the physical isolation between the red glue dispensing position and the solder paste printing area must be strictly controlled, the reflow soldering temperature profile must take into account both the red glue curing and solder paste melting windows, and the stencil aperture design, dispensing parameters and AOI inspection strategy must be collaboratively optimized. Otherwise, it is extremely easy to cause batch defects such as cold solder joints, tombstoning or red glue contamination of pads. This is a high-risk but implementable special process combination in SMT processes.
Published: 2024-09-13Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.