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Here you can find knowledge about Selective Wave Soldering, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
Selective wave soldering bar selection must balance melting point stability, surface tension, and oxide film formation rate; solder dross control is directly affected by solder bar purity, copper and iron impurity content, and flux compatibility. The Jiajinyuan SN99.3CU0.7 series has a measured dross rate below 1.2% in small and medium batch high-density board soldering, significantly outperforming conventional solder bars.
Published: 2020-11-14Selective wave soldering performs dip soldering on local pins of the PCB through precise positioning, avoiding the thermal shock and bridging risks caused by passing the entire board through the wave. It is suitable for complex single boards with mixed high-density mounting, sensitive components, or bottom shielding covers. In actual tests with Jiajinyuan equipment, the defect rate can be reduced from 1.2% to 0.35%, greatly reducing rework labor and solder dross loss.
Published: 2019-06-28Selective wave soldering significantly reduces changeover time and fixture debugging frequency by precisely positioning soldering areas and skipping already surface-mounted components. In multi-variety, small-batch PCBA production, it compresses the preparation cycle per batch to within 15 minutes, greatly improving overall equipment effectiveness, and serves as the core process support for Jiajinyuan models to achieve high output in small and medium batch order scenarios.
Published: 2017-12-09The process parameter debugging of selective wave soldering should focus on the coordinated matching of nozzle temperature, chain speed, tin immersion time, and nitrogen coverage intensity. In actual production lines, Jiajinyuan equipment can significantly suppress bridging defects between pins of QFP-44 and SOIC-28 devices by controlling the nozzle temperature at 255℃±2℃, setting the chain speed at 0.8m/min, maintaining the single-point tin immersion time at 3.2 seconds, and stabilizing the nitrogen flow rate at 12L/min, which is especially suitable for secondary soldering scenarios after rework of high-density double-sided boards.
Published: 2013-01-16Addressing the local soldering challenges of industrial control board connectors, selective wave soldering achieves high-reliability soldering through precise temperature control and solder wave positioning, while avoiding overheating damage to sensitive components across the entire board. Jiajinyuan equipment stably achieves a 99.7% first-pass yield under conditions of 0.8mm pin pitch and 12mm pad length, with a process window widened by 35% compared to traditional wave soldering, making it particularly suitable for the mixed assembly requirements of multilayer boards + high-density connectors in domestic substitution.
Published: 2010-08-27Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.