SMT Solder Paste Manufacturers.
Focused on SMT soldering processes, a one-stop electronic soldering solutions provider.
Here you can find knowledge about Low-Void Solder Paste, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
To address the issues of solder paste collapse and excessive reflow void rate easily caused by the large copper foil and large pad structures of energy storage power boards, this paper is based on 20 years of measured experience on the Jiajinyuan production line, focuses on the matching of key parameters for solder paste selection, emphasizes that solder paste for large pads requires coordinated control of high thixotropic index and medium viscosity, and low-void solder paste must meet the synchronization between the flux volatilization curve and the thermal response of high heat capacity substrates, with the core focus on the wetting and spreading stability of solder paste under thick copper design.
Published: 2010-08-03To address persistent production-line issues such as excessive voiding, poor solder climbing, and residual whitening in high-precision PCB assembly, this paper directly examines the measured performance of 8M9P/5RR zero-halogen low-void solder paste and 8MNTTP/5RNTT ultra-low-residue domestic solder paste. Combined with QFN device soldering, communication module rework, and automotive LED thermal management scenarios, it explains how low-void solder paste achieves a void rate of <3% through 0ppm halogen control, T4-grade fine powder distribution, and 305 alloy melting point matching, while also balancing PCB solder paste printing accuracy and batch stability of domestic solder paste.
Published: 2009-05-31QFN package soldering places extremely high requirements on the solder paste's wetting ability, void rate, and residue. The zero-halogen solder paste of the 8M9P/5RR series launched by domestic solder paste brand Jiajinyuan achieves an extremely low void rate. When paired with 0307T4 alloy powder, it forms stably within the 240–255℃ reflow window. Meanwhile, the 8MQP/5RQ series achieves nearly 100% wetting for QFN solder paste thanks to its high activity, making it a key practical option for low-void solder paste and for domestic solder paste to replace imported alternatives.
Published: 2009-02-22Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.