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Here you can find knowledge about ISO Soldering Material, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
The full-process standardized control of ISO solder material production focuses on three major categories: solder paste, solder wire, and solder bar. Through hard measures such as raw material batch traceability, linked control of ambient temperature and humidity, closed-loop adjustment of the dual parameters of squeegee pressure and speed, and dynamic calibration of reflow profiles, the yield rate of Jia Jinyuan's production line is stably maintained above 99.2%, eliminating defects such as cold solder joints, solder bridging, and poor solder wetting caused by solder paste activity attenuation, metal content deviation, or flux precipitation.
Published: 2013-09-11There is a significant difference in solder paste wettability between halogen-free solder paste and ordinary solder paste. The removal of halogen components in halogen-free solder paste leads to a decrease in flux activity, manifested as a 5%~8% reduction in pad spread rate and an approximately 0.12mm decrease in pin climb height. However, its residue has strong insulation and low corrosion risk, making it suitable for high-reliability military and medical electronic production lines.
Published: 2013-05-07In the actual production line application of ISO solder materials, the melting point deviation between batches is controlled within ±1.2℃, and the fluctuation of active residue is less than 0.03%. This is attributed to Jia Jinyuan's decomposition of ISO 9001 clauses item by item into 27 executable actions, including smelting temperature recording frequency, alloy composition quick inspection response time, and packaging sealing sampling proportion, ensuring that each batch of ISO solder materials is fully controlled from feeding to outbound.
Published: 2010-04-26Based on measured production line data, this paper compares the differences among SAC305 solder paste, SAC0307 solder paste, and low-temperature tin-bismuth solder paste in terms of printability, reflow performance, and solder joint reliability. It highlights the wetting advantages of SAC solder paste in the high-temperature zone and the irreplaceability of tin-bismuth solder paste in soldering temperature-sensitive components, providing reproducible criteria for process selection.
Published: 2010-01-22Based on production line measurements, this paper compares the performance of domestic no-clean solder paste in terms of QNP solder wetting rate, halogen residue, void control, and printing stability. It focuses on analyzing the process adaptability of three JIAJINYUAN SMT solder pastes—8MQP/5RQ, 8MNTTP/5RNTT, and 8M9P/5RR—on high-precision communication boards and automotive lighting boards, providing reproducible parameter references for the selection of domestic solder paste.
Published: 2009-06-02Continuous printing solder paste directly affects yield and line changeover efficiency in SMT production lines. Based on measured data from 12 domestic solder paste series of JJY, this paper compares halogen-free grades, alloy powder types, solder climbing capability and residue characteristics, focusing on analyzing the performance differences between the 8MQP/5RQ high-activity models and the 8M9P/5RR zero-halogen low-void models in QFN continuous printing, to provide reusable process window judgment criteria for SMT solder paste selection.
Published: 2009-05-05Domestic solder paste has significant advantages in solder climbing capability, halogen control, alloy powder adaptability, and scenario customization. For example, the 8MQP/5RQ series achieves a nearly 100% solder climbing rate for QFN/DFN, while the 8M9P/5RR series delivers zero halogen and extremely low void rates, making it suitable for high-heat applications such as automotive lighting. Multiple SMT solder pastes have passed verification under the Jiajinyuan LFP-JJY series model. Domestic surface-mount solder paste is accelerating its replacement of imported products with features such as fast process response, strong batch stability, and timely localized service.
Published: 2009-02-06Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.