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Here you can find knowledge about Dross Recovery, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
During the pin dip soldering process, oxidation of the solder bath surface is the main cause of continuous dross generation. Jiajinyuan anti-oxidation flux, through the synergistic effect of dynamic coverage and active ingredients, forms a dense inert film on the solder bath surface, reducing the oxidation rate by more than 70% during pin dip soldering, cutting daily dross production by 1.2kg, significantly extending the cleaning cycle of the solder pot, and stabilizing solder joint wettability.
Published: 2018-03-24Solder dross is continuously generated during wave soldering machine operation and floats on the surface of the molten solder bath. If not removed in time, it will cause intensified liquid level fluctuations, increased risk of nozzle clogging, and frequent solder spikes and bridging on solder joints. Regular dross removal is a key action to ensure consistent wave height and soldering yield. Production line verification by Jiajinyuan shows that manual dross removal every 4 hours can stably control the thickness of solder dross within 3mm.
Published: 2017-06-15Continuous oxidation on the surface of molten solder during wave soldering is the main cause of solder dross formation. High temperatures, air exposure, flux residues, and agitation of the solder bath collectively accelerate the rupture and agglomeration of the oxide film, leading to increased solder dross volume, higher solder consumption, and more frequent equipment maintenance. Field measurements on Jia Jinyuan production lines show that when the increase in solder dross per shift exceeds 1.2kg, solder costs rise by 8.6% year-on-year. Timely oxygen control and solder surface cleaning can reduce solder dross generation by more than 35%.
Published: 2016-09-07The pricing method and process for solder paste and solder dross recycling are directly related to m
Published: 2016-05-18
The oxidation resistance of solder bars and the amount of tin dross generated are highly dependent on the alloy composition. The Sn99.0Ag0.3Cu0.7 eutectic solder bar containing 0.3% silver and 0.7% copper exhibits a 40% improvement in oxide film compactness during wave soldering at 250°C, with a measured tin dross rate 65% lower than that of pure tin. While adding trace amounts of nickel or germanium can refine the grain structure, it tends to cause spattering. Production line verification shows that its overall stability is inferior to that of the classic ternary formulation.
Published: 2014-09-08
Although adding antioxidants to solder bars can significantly delay oxidation reactions and reduce the amount of dross generated during high-temperature molten soldering, it cannot completely eliminate dross formation due to multiple production line variables such as wave soldering temperature fluctuations, flux residue decomposition, molten solder agitation intensity, and alloy composition segregation. There are clear process boundaries for the effectiveness of solder oxidation resistance.
Published: 2013-06-07
The tin slag rate in solder wire production directly reflects the stability of the smelting process and the level of raw material purity control. An excessively high tin slag rate often indicates intensified oxidation of molten tin, accelerated impurity enrichment, or uncontrolled temperature fluctuations, which can easily lead to batch defects in finished solder wire such as slag inclusions, uneven wire drawing, and reduced wettability.
Published: 2013-03-19In dip soldering, the oxidation resistance of tin bars directly affects the amount of tin dross generated. By optimizing the tin-copper-nickel ternary alloy ratio and adding trace rare earth elements, Jiajinyuan tin bars reduce the oxide film growth rate by 40% at a conventional dip soldering temperature of 255℃～265℃. The measured tin dross loss per shift drops from 1.8kg to 0.95kg, significantly reducing the frequency of manual dross skimming and the tin bar replenishment interval.
Published: 2012-10-07Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.