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For the typical solder paste defect of solder paste flux splatter contaminating PCBs, actionable improvement countermeasures that can be implemented immediately are proposed from four aspects: solder paste selection, stencil aperture design, printing parameter matching, and pre-reflow standing control. The synergistic matching of solder paste flux activity and viscosity is emphasized, avoiding reliance solely on cleaning or process compromises.
Published: 2024-01-16Solder sample testing was conducted using three types of materials—solder paste, solder wire, and solder bar—for machine testing, to realistically simulate the printing, placement, and reflow compatibility performance of JJY solder on SMT production lines. The testing focused on verifying the rheological properties of solder paste and its matching with stencil apertures, the wire feed stability of solder wire, and the melting and spreading uniformity of solder bar, providing reproducible process window data support for batch introduction.
Published: 2024-01-12Excessive ion contamination from solder paste soldering directly affects PCBA reliability. It is necessary to control it from the source of solder paste selection, giving priority to low-residue, high-purity no-clean solder paste, and cooperating with standardized solder paste testing procedures to ensure that key indicators such as chloride ions and sodium ions meet the requirements of IPC-J-STD-004B Class L0.
Published: 2023-12-17X-Ray inspection is the only non-destructive method in SMT production lines that can penetrate packages to directly observe the internal structure of hidden solder joints such as BGA and QFN. It is mainly used to detect invisible defects such as solder joint voids, cold solder joints, and solder ball offset. Especially in the mass production of automotive-grade and industrial-grade high-reliability products, with 0.5μm detail resolution and real-time dynamic imaging capability, Jia Jinyuan X-Ray inspection equipment stably maintains the recognition rate of defective solder joints with a void rate exceeding 25% at over 99.7%.
Published: 2023-11-17
Although solder paste, solder cream, and solder wire all belong to electronic soldering consumables, their flux composition design logic is completely different. Solder paste emphasizes high viscosity and thixotropy to support precision dispensing; solder cream requires a balance of printability and reflow activity, adopting a combination of medium rosin content and volatile solvents; solder wire relies on low-solid-content flux in the core to achieve continuous supply and rapid volatilization. The three cannot be used interchangeably.
Published: 2023-11-04
Jiajinyuan LFP series halogen-free solder paste has completed QFN packaging process verification, with the measured solder wetting rate close to 100%, significantly improving solder joint wettability and bridging control capability. Relying on 0307/T4 alloy powder and ROL1 grade low-halogen formula, it maintains high activity while meeting IPC-J-STD-00
Published: 2023-10-25Debugging the BGA soldering reflow curve requires precise matching of the solder paste activity window and solder ball melting characteristics. By optimizing the preheating slope, extending the soaking time, and controlling the peak temperature plateau width, the void rate can be significantly reduced. Test data from JJY shows that the void area ratio was reduced from 18.7% to below 6.2%.
Published: 2023-10-22The vacuum reflow process for solder paste imposes higher requirements on the metal content, flux activity, residue insulation, and high-temperature stability of the solder paste. Vacuum solder paste must feature low volatile content, high wetting power, and anti-slump properties; otherwise, it can easily cause persistent production-line issues such as excessive void rate, cold solder joints, or solder ball splashing. The reliability of solder paste soldering is directly constrained by the suitability of its selection and matching.
Published: 2023-10-05During FPC soldering, using low-temperature solder paste and solder wire can significantly reduce the thermal stress on the substrate, avoiding thermal damage phenomena such as coverlay wrinkling, copper foil peeling, and PI layer discoloration. It is especially suitable for high-density, multi-layer stacked flexible printed circuit boards with IC bonding. Jiajinyuan low-temperature solder paste starts melting at 138℃, with the peak temperature controlled below 210℃. Combined with nitrogen protection, it can further suppress oxidation and improve wettability.
Published: 2023-09-03
The size of the rosin-core hollow in solder wire directly affects the flux release amount, wetting speed and residue distribution. An excessively large hollow easily causes solder spatter, cold solder joints and rosin overflow that contaminates the PCB, while an excessively small hollow leads to insufficient flux, poor wetting and solder joint spikes. In actual production lines, 0.5mm diameter solder wire paired with a 0.12mm rosin-core hollow is the optimal combination for SMT manual touch-up soldering and rework.
Published: 2023-08-25Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.