SMT Solder Paste Manufacturers.
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Poor sphericity of solder powder in solder paste significantly reduces print forming rate, leading to high-frequency defects such as missing printing, solder bridging, and misalignment, which is particularly prominent on 0201 and smaller package devices. Non-spherical solder powder has poor fluidity, high rolling resistance, and increased friction with the stencil aperture walls, directly affecting solder paste release rate and demolding consistency.
Published: 2016-05-12In SMT printing, the rheological properties of solder paste directly affect continuous printing stability. An excessively high thixotropic index easily leads to poor demolding and edge pinholes, while an excessively low thixotropic index causes slump and aperture clogging. Jiajinyuan solder paste achieves precise control of the viscoelasticity ratio. Under 25°C environment and 0.5mm stencil conditions, the measured thixotropic index is 1.8～2.3. Combined with the parameter set of squeegee pressure 2.8kg and speed 45mm/s, it can continuously complete 1200 PCBs without aperture clogging.
Published: 2016-04-10Daily routine inspection of reflow soldering production lines is the core line of defense against batch defects. Through systematic checks of rail parallelism, nitrogen purity, deviations between actual and set temperatures in each temperature zone, chain speed stability, and cooling section wind speed every shift, over 90% of typical defects such as cold solder joints, tombstoning, and cold soldering can be intercepted in advance, avoiding batch rework caused by single-point failures.
Published: 2016-03-28Excessive solder paste voiding rate of the thermal pad at the bottom of QFN is a high-frequency failure on SMT production lines, requiring coordinated optimization from four aspects: solder paste selection, stencil aperture design, printing parameters, and reflow profile. Although low-void solder paste can reduce the voiding rate, it cannot replace process matching. The squeegee pressure and speed, nitrogen purity, and temperature gradient of each reflow zone must be adjusted in accordance with the actual equipment status of the production line.
Published: 2016-03-21RoHS solder strictly complies with the EU RoHS environmental directive, completely eliminating six categories of hazardous substances including lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyls, and polybrominated diphenyl ethers. It is suitable for high-reliability production lines such as consumer electronics, medical equipment, and automotive electronics. In Jia Jinyuan's actual SMT mass production, it has been verified that it has stable wettability at a peak temperature of 245°C, a void rate lower than 3.2%, and the thickness of the solder joint IMC layer is controlled within the range of 1.8~2.4μm.
Published: 2016-03-14Domestic solder has fully matched imported products in key indicators such as melting point stability, wetting speed, and residue corrosivity. When used with Jia Jinyuan's specially formulated flux, the first-pass yield of 0201 component soldering remains stable at 99.87%, while the procurement cost is only 63% of that of imported solder of the same specification. For large-volume orders, the coordination of logistics and payment terms further reduces the overall delivery cost.
Published: 2016-02-18
The amount of solder paste is not the more the better; excessive usage will lead to solder beads, bridging, and residual contamination. In actual production lines, poor solder wetting often stems from excessive solder paste printing thickness or mismatched stencil aperture design, rather than simply increasing the amount. Precise control of the solder paste volume ratio and activity matching is the core to ensuring the reliability of solder wetting.
Published: 2016-02-13Excess solder is a core defect causing short circuits, bridging and cold solder joints in fine-pitch IC production, and its occurrence is strongly coupled with stencil aperture design, squeegee pressure, solder paste rheological properties and reflow parameters. Production line data from Jiajinyuan shows that over 63% of solder defects caused by excess solder are directly associated with solder paste printing thickness exceeding the standard by more than 0.02 mm, and strict control of excess solder has become a rigid threshold for improving the yield of CSP and QFN 0.4 mm pitch devices.
Published: 2016-02-04Cracks in solder paste joints are mostly caused by thermal stress and material mismatch, which are particularly prominent in large-size BGA, thick copper PCB, and high-low temperature cycling conditions. Selecting solder paste with low modulus, high ductility, and low residual stress after reflow can significantly improve solder paste reliability. Combined with printing accuracy control and reflow profile optimization, microcrack formation can be suppressed from the source.
Published: 2016-01-31BGA chip reballing repair relies on precise reballing processes. Jiajinyuan's dedicated solder paste works in synergy with matching solder balls to ensure solder joint coplanarity, tensile strength, and void rate meet standards. This solution has been verified on multiple production lines to stably pass 500 cycles of -40℃~125℃ thermal shock without defects such as solder bridging, cold solder joints, or ball misalignment.
Published: 2016-01-29Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.