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On-site solder paste process debugging technical support service for SMT production line engineers, focusing on high-frequency issues such as solder paste printing offset, insufficient solder, and solder bridging. It quickly locates root causes through practical methods including matching squeegee pressure and speed, verifying stencil aperture design, and controlling solder paste warm-up time. The entire process revolves around solder paste process stability, emphasizing that solder paste process debugging must be dynamically coupled with equipment parameters, ambient temperature and humidity, and solder paste batch characteristics.
Published: 2019-09-27
Excessive volatilization of solder paste during high-temperature soldering can lead to typical defects such as solder balls, cold solder joints, and bridging. This is especially likely to induce splattering and poor wetting in a nitrogen atmosphere or during reflow soldering with a high heating rate, directly affecting the SMT first-pass yield and long-term reliability.
Published: 2019-09-23SMT stencil cleaning and maintenance directly affects solder paste printing accuracy and yield. A three-stage combined process of dry cleaning, wet cleaning, and ultrasonic cleaning must be adopted in daily operations. Corresponding cleaning agent concentrations and wiping frequencies shall be matched for solder pastes of different viscosities to avoid defects such as insufficient solder and solder bridging caused by residual paste in apertures.
Published: 2019-09-22Supply from domestic factories for consumer electronics solder has achieved stable batch delivery. Jiajinyuan solder meets first-tier production line requirements in terms of Sn-Ag-Cu series alloy composition control, oxide layer suppression process, and batch consistency. Under the same specifications, its quotation is 18% to 22% lower than that of imported brands, and it supports weekly rolling production scheduling and 48-hour emergency shipment, significantly alleviating the risk of line changeover downtime caused by solder supply disruption on SMT production lines.
Published: 2019-09-08Through on-site testing of Jiajinyuan domestic solder on the SMT production line under combinations of different temperature zone profiles, stencil apertures, and squeegee pressure settings, the soldering performance on circuit boards was evaluated. It was found that the difference in wettability and void rate between this domestic solder and imported materials is less than 8%. After optimizing solder paste storage temperature control and fine-tuning the nitrogen purity of the reflow oven, the first-pass yield of PCBA increased from 92.3% to 96.7%, significantly reducing circuit board soldering defects such as cold solder joints, tombstoning, and bridging.
Published: 2019-08-26As the mainstream choice for solder in energy storage modules, SAC305 is widely used in solder paste printing and manual soldering for power battery modules, BMS boards, and liquid cooling system control boards due to its excellent thermal fatigue resistance and moderate melting point (217℃). Among these applications, the solder paste demonstrates particularly stable performance in soldering 0.3mm fine-pitch IGBT driver chips.
Published: 2019-07-19
Purchasing solder paste, solder wire, and solder bars must be closely tied to the actual production line performance when screening suppliers, with a focus on batch stability, consistency between measured metal content values and J-STD-005, and whether the solder paste thixotropic index is suitable for high-speed printing machines. At the same time, the tensile strength of solder wire and the corrosivity of flux paste residues must be verified to avoid solder bridging, cold solder joints, or poor cleaning caused by material fluctuations.
Published: 2019-07-02Selective wave soldering performs dip soldering on local pins of the PCB through precise positioning, avoiding the thermal shock and bridging risks caused by passing the entire board through the wave. It is suitable for complex single boards with mixed high-density mounting, sensitive components, or bottom shielding covers. In actual tests with Jiajinyuan equipment, the defect rate can be reduced from 1.2% to 0.35%, greatly reducing rework labor and solder dross loss.
Published: 2019-06-28To address practical issues in low-humidity workshops such as solder paste being prone to moisture absorption and oxidation, sudden viscosity changes, and printing defects, this paper proposes a solder paste protection solution centered on nitrogen atmosphere control, dual-parameter linkage monitoring of temperature and humidity, standardization of solder paste temperature recovery and standing, and coordinated adjustment of squeegee pressure and speed. All measures are derived from 20 years of SMT on-site verification on Jia Jinyuan's production lines and can be directly embedded into the existing MES system to trigger early warnings.
Published: 2019-06-02Solder balls are a frequently occurring soldering defect in SMT placement. They form when excess solder fails to fully wet during the reflow process and aggregates into spherical solder spots, commonly found on the sides of 0402 and smaller resistors and capacitors, along the edges of QFN thermal pads, and near PCB through-holes, directly affecting product reliability and AOI pass rate.
Published: 2019-05-01Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.