SMT Solder Paste Manufacturers.
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The solder manufacturer provides full-cycle support for wave soldering processes on SMT production lines, covering solder bar selection, wave parameter matching, dross control, and root cause analysis of solder bridges and missed soldering. Jiajinyuan solder manufacturer, through on-site stationed debugging and dynamic monitoring of molten solder metal composition, helps customers increase the first-pass yield of wave soldering from 89.3% to 99.1%, significantly reducing manual rework hours and cold solder joint repair costs.
Published: 2023-07-25Temperature fluctuations in solder paste storage refrigerators directly disrupt the stable dispersion system of metal particles and flux inside the solder paste, leading to abnormal viscosity, aggravated slump, and poor printing release. If refrigerated solder paste frequently experiences fluctuations above ±3℃, the uniformity of its metal content distribution will significantly deteriorate within 72 hours. Therefore, the solder paste storage stage has become a key source of hidden yield loss in SMT production lines.
Published: 2023-07-22Soldering on ENIG boards imposes extremely stringent requirements on the halogen residue, wettability, and residue insulation of solder paste. Halogen-free solder paste stands out in preventing excessive dissolution of the gold layer, reducing leakage current during ICT testing, and improving long-term reliability. Jiajinyuan's halogen-free solder paste has been validated on multiple high-end HDI board production lines, demonstrating stable printability under 0.3mm pitch QFN and 0.4mm BGA packages, along with an actual void rate of <8%.
Published: 2023-07-11
Jiajinyuan has significantly improved batch stability and process traceability of solder paste by establishing 21 inspection processes covering the entire workflow from raw material warehousing, alloy powder preparation, solder paste mixing, reflow verification to outgoing inspection. Its halogen-free and lead-free high-temperature solder paste series performs well in key aspects such as QFN/DFN solder climbing rate, residue transparency, and void control
Published: 2023-07-06During dip soldering, temperature runaway in manual dip soldering pots is the main cause of cold solder joints and missed solder joints. For the JiajinYuan manual dip soldering pot, the solder bath temperature must be stably controlled at 255℃±3℃, the preheating zone maintained at 90℃~110℃, and the dip soldering time strictly limited to 3 seconds±0.5 seconds. Imbalance in the coordination of these three factors will cause bridging or poor wetting.
Published: 2023-06-14
A dull surface on solder wire does not necessarily indicate poor quality; it requires comprehensive judgment based on solder appearance, flux residue, storage environment, and degree of oxidation. For some low-smoke lead-free solder wires, natural dullness due to high rosin content or low-temperature storage is normal, while persistent blackening and reduced adhesion indicate flux deterioration or abnormal metal composition.
Published: 2023-05-17Lead-free solder for consumer electronics has become a mandatory threshold for export. Jiajinyuan lead-free solder strictly meets the requirements of RoHS and JEDEC J-STD-006 in terms of melting point, wettability, and IMC growth rate. Measured at a reflow peak temperature of 235℃±2℃, the solder joint thrust reaches 4.8N, the void rate is below 12%, and the copper PAD corrosion depth is <0.8μm, fully satisfying the full-lifecycle environmental compliance requirements of EU CE, US FCC, and Japanese JIS for consumer electronics solder.
Published: 2023-05-17To address the frequently occurring issues of solder paste tombstoning, cold solder joints, and poor wetting on OSP gold-plated pads in SMT production lines, and drawing on 20 years of on-site commissioning experience, this paper provides immediately actionable countermeasures from four aspects: solder paste selection compatibility, stencil aperture design redundancy, reflow profile activity window control, and collaborative management of PCB pad surface conditions, directly targeting the root causes of uneven solder paste wetting and cold solder joint defects.
Published: 2023-05-12Solder dross is continuously generated during continuous wave soldering, and its production volume is directly affected by solder pot temperature, conveyor speed, flux activity, and PCB design. Production line data from Jia Jinyuan shows that every 0.5 kg/h increase in dross increment raises the material cost per board by 0.32 yuan. Therefore, dross volume control is not an auxiliary step, but the true cost control center of the wave soldering process.
Published: 2023-05-03The R&D of solder ODM focuses on the welding pain points of thick copper boards and high-frequency boards. By adjusting the activity of the rosin system, the sphericity and particle size distribution of metal powder, as well as the viscosity and thixotropy of the carrier, it improves the melting and spreading ability without sacrificing printing accuracy, and solves production-line-level problems such as insufficient wetting caused by fast heat dissipation of thick copper and residual ion migration caused by sensitivity to dielectric loss of high-frequency boards.
Published: 2023-05-01Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.