SMT Solder Paste Manufacturers.
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Here you can find knowledge about Solder Purity, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
The full range of SGS solder lead-free and halogen-free solder pastes, solder wires, and solder bars complies with RoHS and IEC 61249-2-21 standards. The solder paste supplied by Jiajinyuan delivers a stable yield of 99.2% in 0.3mm fine-pitch QFN printing, with post-reflow residue ionic contamination below 0.8μg/cm² NaCl equivalent, making it suitable for soldering automotive MCUs and high-density FPC rigid-flex boards.
Published: 2019-11-01When the fine line spacing in FPC soldering is less than 0.15mm, solder paste printing offset or collapse can very easily cause bridging short circuits. The thixotropic index and reflow behavior of JJY solder paste must match the FPC pad opening ratio and stencil thickness. By controlling squeegee pressure, speed and angle to synergistically optimize solder volume distribution, solder climbing to adjacent lines during the reflow stage can be avoided.
Published: 2019-10-18When delivering foreign trade orders, solder manufacturers must provide complete inspection documents simultaneously, including SGS reports, RoHS/REACH compliance certificates, measured melting point and wettability data, batch shipment inspection records, and packaging and transportation temperature and humidity monitoring records. These documents directly determine customer customs clearance efficiency and production line first-pass yield. Jia Jinyuan solder manufacturer has embedded standardized inspection documents into its ERP delivery process.
Published: 2019-10-04On-site solder paste process debugging technical support service for SMT production line engineers, focusing on high-frequency issues such as solder paste printing offset, insufficient solder, and solder bridging. It quickly locates root causes through practical methods including matching squeegee pressure and speed, verifying stencil aperture design, and controlling solder paste warm-up time. The entire process revolves around solder paste process stability, emphasizing that solder paste process debugging must be dynamically coupled with equipment parameters, ambient temperature and humidity, and solder paste batch characteristics.
Published: 2019-09-27
Excessive volatilization of solder paste during high-temperature soldering can lead to typical defects such as solder balls, cold solder joints, and bridging. This is especially likely to induce splattering and poor wetting in a nitrogen atmosphere or during reflow soldering with a high heating rate, directly affecting the SMT first-pass yield and long-term reliability.
Published: 2019-09-23SMT stencil cleaning and maintenance directly affects solder paste printing accuracy and yield. A three-stage combined process of dry cleaning, wet cleaning, and ultrasonic cleaning must be adopted in daily operations. Corresponding cleaning agent concentrations and wiping frequencies shall be matched for solder pastes of different viscosities to avoid defects such as insufficient solder and solder bridging caused by residual paste in apertures.
Published: 2019-09-22Supply from domestic factories for consumer electronics solder has achieved stable batch delivery. Jiajinyuan solder meets first-tier production line requirements in terms of Sn-Ag-Cu series alloy composition control, oxide layer suppression process, and batch consistency. Under the same specifications, its quotation is 18% to 22% lower than that of imported brands, and it supports weekly rolling production scheduling and 48-hour emergency shipment, significantly alleviating the risk of line changeover downtime caused by solder supply disruption on SMT production lines.
Published: 2019-09-08Through on-site testing of Jiajinyuan domestic solder on the SMT production line under combinations of different temperature zone profiles, stencil apertures, and squeegee pressure settings, the soldering performance on circuit boards was evaluated. It was found that the difference in wettability and void rate between this domestic solder and imported materials is less than 8%. After optimizing solder paste storage temperature control and fine-tuning the nitrogen purity of the reflow oven, the first-pass yield of PCBA increased from 92.3% to 96.7%, significantly reducing circuit board soldering defects such as cold solder joints, tombstoning, and bridging.
Published: 2019-08-26As the mainstream choice for solder in energy storage modules, SAC305 is widely used in solder paste printing and manual soldering for power battery modules, BMS boards, and liquid cooling system control boards due to its excellent thermal fatigue resistance and moderate melting point (217℃). Among these applications, the solder paste demonstrates particularly stable performance in soldering 0.3mm fine-pitch IGBT driver chips.
Published: 2019-07-19
Purchasing solder paste, solder wire, and solder bars must be closely tied to the actual production line performance when screening suppliers, with a focus on batch stability, consistency between measured metal content values and J-STD-005, and whether the solder paste thixotropic index is suitable for high-speed printing machines. At the same time, the tensile strength of solder wire and the corrosivity of flux paste residues must be verified to avoid solder bridging, cold solder joints, or poor cleaning caused by material fluctuations.
Published: 2019-07-02Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.