SMT Solder Paste Manufacturers.
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Here you can find knowledge about Solder Paste Recycling, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
Solderability of immersion silver (ImAg) PCBs poses dual challenges to solder paste in terms of wetting performance and corrosion resistance. Jiajinyuan GJ-812A solder paste demonstrates excellent compatibility with silver finishes in actual production lines. Its weakly acidic flux system ensures sufficient wetting for 0.3mm fine-pitch QFN packages while avoiding excessive corrosion of the immersion silver layer. After reflow, the solder joints exhibit a clean surface and uniform IMC layer, effectively reducing the risks of cold solder joints and black pad.
Published: 2024-03-12During the rework soldering and BGA chip ball mounting process, an excessive void rate is the main cause of cold solder joints, increased thermal resistance, and early failures. Using low-void solder paste can significantly improve the metallurgical bonding quality of solder joints, and especially maintain structural integrity after multiple thermal cycles. In actual tests, the Jiajinyuan JGY-850 series solder paste stably controls the void rate within 8%. Combined with precise stencil aperture design and nitrogen-protected reflow, it increases the first-pass yield of rework soldering to 98.3%.
Published: 2024-02-28
Excessive flux paste application is a high-frequency cause of component displacement in SMT production lines, and this issue is particularly prominent when soldering tiny components such as 0201 and 0402 packages. Based on 20 years of on-site production line measurement experience of JJY, this paper focuses on the coordinated adjustment of three key factors: squeegee pressure, stencil aperture design, and printing speed. It proposes an immediately executable parameter window calibration method to directly target the process balance point between flux paste and component soldering stability.
Published: 2024-02-11
In 2023, the solder paste market showed a diversified development trend, with traditional industrial applications continuing to integrate with emerging fields such as new energy and semiconductors. The driving factors include technological progress, industrial transformation, and policy support. Industry practitioners need to pay attention to changes in market demand and optimize product structure.
Published: 2024-02-08
All Jiajinyuan solder paste products continue to pass the dynamic and effective control of RoHS, halogen-free, SGS and ISO systems, covering more than ten types of细分 scenarios such as high temperature, medium temperature, low temperature and laser welding. Among them, 8MQP/5RQ series solder paste achieves nearly 100% solder climbing rate for QFN/DFN, 8M9P/
Published: 2024-02-01In the ball mounting process, adopting a low-temperature solder paste solution can significantly reduce the thermal stress on BGA chip bodies, avoiding common production line failures such as pad peeling, silicon die microcracks, and molding compound delamination. In actual tests of the Jiajinyuan LTS series solder paste, this solution achieved ball diameter consistency of ±0.02mm at a peak temperature of 185℃, while balancing wetting and spreading performance with residue insulation properties.
Published: 2024-01-28
Lead-free solder paste and leaded solder paste have essential differences in composition, melting point, wettability, and reflow profile settings. The key to distinguishing them lies in the RoHS marking on the solder paste batch label, the color of flux residue, and the glossiness of solder joints. Since lead-free solder has a high melting point and high surface tension, it is necessary to increase the peak temperature and extend the time above the liquidus, while imposing higher requirements on stencil aperture design, squeegee pressure, and printing speed.
Published: 2024-01-23For the typical solder paste defect of solder paste flux splatter contaminating PCBs, actionable improvement countermeasures that can be implemented immediately are proposed from four aspects: solder paste selection, stencil aperture design, printing parameter matching, and pre-reflow standing control. The synergistic matching of solder paste flux activity and viscosity is emphasized, avoiding reliance solely on cleaning or process compromises.
Published: 2024-01-16Solder sample testing was conducted using three types of materials—solder paste, solder wire, and solder bar—for machine testing, to realistically simulate the printing, placement, and reflow compatibility performance of JJY solder on SMT production lines. The testing focused on verifying the rheological properties of solder paste and its matching with stencil apertures, the wire feed stability of solder wire, and the melting and spreading uniformity of solder bar, providing reproducible process window data support for batch introduction.
Published: 2024-01-12Excessive ion contamination from solder paste soldering directly affects PCBA reliability. It is necessary to control it from the source of solder paste selection, giving priority to low-residue, high-purity no-clean solder paste, and cooperating with standardized solder paste testing procedures to ensure that key indicators such as chloride ions and sodium ions meet the requirements of IPC-J-STD-004B Class L0.
Published: 2023-12-17Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.