SMT Solder Paste Manufacturers.
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Solder balls are a frequently occurring soldering defect in SMT placement. They form when excess solder fails to fully wet during the reflow process and aggregates into spherical solder spots, commonly found on the sides of 0402 and smaller resistors and capacitors, along the edges of QFN thermal pads, and near PCB through-holes, directly affecting product reliability and AOI pass rate.
Published: 2019-05-01
Abnormal solder paste viscosity directly leads to high-frequency production line defects such as printing defects, component placement misalignment, and reflow voids. Excessively high solder paste viscosity easily causes printing skipping and stencil clogging, while excessively low viscosity leads to slump, bridging, and solder balls. During actual debugging, dynamic adjustments must be made in combination with ambient temperature and humidity, squeegee parameters, and batch differences of solder paste.
Published: 2019-04-28When soldering thick copper PCBs and multilayer boards with BGA, the significantly increased thermal capacity means conventional heating parameters can easily cause cold solder joints or chip warpage. It is necessary to specifically extend the preheating time, increase the temperature of the soaking zone, and slow down the peak heating slope to ensure synchronous melting of solder balls and overall thermal balance of the PCB.
Published: 2019-04-12Incoming solder paste inspection is the first line of defense for SMT process stability. It quickly screens incoming solder paste through key items such as viscosity, metal content, particle size distribution, slump resistance, and wettability, and comprehensively determines solder paste quality by combining printability, reflow performance, and solder joint morphology under a microscope, ensuring that each batch of incoming solder paste meets the production line's process window requirements.
Published: 2019-03-08
In solder wire soldering, solder bridges causing short circuits are mostly caused by excessively small pad spacing, mismatch between solder wire diameter and soldering iron temperature, insufficient flux activity, or uncleared residual oxide layers. In actual production lines, 80% of solder bridge problems stem from the imbalance between operating technique and material adaptability, rather than simple deviations in process parameters.
Published: 2019-02-15The compliance of solder paste with RoHS, REACH, and halogen regulations directly affects the market access of exported products. SGS solder paste inspection reports must strictly correspond to each batch of physical solder paste. Jia Jinyuan's production line achieves 100% traceability through double-person verification of batch numbers, inspection dates, and consistency with the inkjet codes on solder paste cans, along with synchronized archiving of electronic versions of original SGS solder paste inspection reports, to avoid returning entire batches of PCBA due to mismatched reports.
Published: 2019-02-14Prolonged standing after solder paste placement causing solder paste displacement is a high-frequency abnormality on SMT production lines. The root cause lies in the continuous collapse and wetting spreading of the placement solder paste at room temperature, compounded by multiple factors such as component self-weight, vibration disturbance, and PCB micro-warpage deformation, which gradually causes the solder paste on the pads to lose its anchoring force on the components.
Published: 2019-01-24
In 2018, a trend of solder paste formula optimization emerged in the electronics manufacturing industry, and enterprises began to pay attention to the application scenarios of environmentally friendly and low-residue solder pastes. With increasingly strict environmental regulations and rising industry demand for high-precision manufacturing, solder paste technology is gradually developing in the direction of low harmful substances and high stability.
Published: 2019-01-01Thermal cycling testing is a key method for PCBA reliability testing. Through harsh conditions of -40℃ to +125℃, temperature rise and fall completed within 5 minutes, and a 15-minute dwell per cycle, it simulates temperature stress changes of products in real environments, focuses on exposing microcracks in solder joints and fatigue failure of the IMC layer, and directly reflects the impact of SMT placement processes and reflow profiles on long-term service life.
Published: 2018-12-26When manually soldering mobile phone motherboards, thin-diameter solder wire can precisely cover pads below 0.3mm, avoiding bridging and cold solder joints. Combined with a constant-temperature soldering iron and a high-magnification microscope, it enables reliable connections of tiny solder joints such as peripheral resistors and capacitors around BGA and cable interfaces, making it an indispensable practical process for rework production lines to handle high-density PCBs.
Published: 2018-12-11Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.