SMT Solder Paste Manufacturers.
Focused on SMT soldering processes, a one-stop electronic soldering solutions provider.
Here you can find knowledge about Solder Paste, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
When choosing between syringe-packaged and bottled solder paste for mobile phone repair, the key factors are work precision, reapplication frequency, and solder ball control capability. Syringe packaging delivers stable paste output in high-precision electronic repair scenarios such as BGA ball mounting and flying wire soldering, and is less likely to contaminate PCBs. Bottled solder paste, while lower in cost, is prone to oxidation and introduces more impurities during dipping, which in turn increases the rate of cold solder joints and rework over long-term use.
Published: 2020-11-10In actual production lines, solder auxiliary materials must be flexibly selected between no-clean or water-washing processes according to the reliability requirements of end products. The Jiajinyuan series of solder auxiliary materials achieve adaptation to the dual demands of fast-paced consumer electronics production and high cleanliness standards for automotive electronics without equipment replacement by adjusting rosin content, activator ratio, and solvent boiling point distribution.
Published: 2020-10-18Insufficient flux activity in solder paste will significantly weaken its ability to remove oxide films, leading to poor pad wetting after solder paste printing and insufficient solder spreading during reflow, which ultimately causes cold solder joints in the solder paste. This issue is particularly prominent in 0201/01005 micro components, OSP surface-treated PCBs, and low-temperature reflow processes, requiring coordinated verification from three aspects: flux acid value, halogen content, and activation temperature window.
Published: 2020-09-21The SGS solder factory can provide copies of inspection certificates along with the goods, significantly shortening the incoming material acceptance cycle for JJY's production lines and delaying SMT scheduling caused by waiting for third-party reports. All SGS solder batches correspond to a unique factory number, and the certificates cover tin content, impurity elements, melting point range, and measured wettability data, fully meeting the compliance requirements for solder alloys specified in IPC-J-STD-006C.
Published: 2020-09-12The selection and control of solder materials in electronics manufacturing directly determine the first-pass yield of PCBA. The metal content, viscosity, and slump resistance of solder paste must match the stencil apertures, reflow profile, and component density of the production line. Jia Jinyuan solder paste performs excellently in 0.3mm pitch QFN printing, while solder wire and solder bar require focused monitoring of rosin residue and wetting angle consistency.
Published: 2020-08-29
The presence of honeycomb pores on the surface of tin bars is not necessarily a quality defect, and comprehensive judgment should be made in combination with the appearance of solder, smelting process and application scenarios. For example, for tin bars smelted and cast in a low-oxygen environment, if there are only tiny honeycomb pores on the surface layer that do not affect wettability and drawing continuity, they are within the acceptable range. However, honeycomb pores accompanied by oxidation slag, wire breakage or poor tin plating clearly indicate that the internal purity of the tin bar or the degassing process is out of control.
Published: 2020-08-17BGA soldering in 5G communication and energy storage motherboards faces challenges of high thermal stress, long-term aging, and high-frequency signal integrity. By optimizing stencil aperture design, segmented temperature control of reflow profile, and post-soldering full X-ray inspection process, JJY ensures that BGA solder joints have no void expansion and no abnormal IMC thickening after 1000 hours of accelerated aging at 85℃/85%RH, achieving true long-term reliability.
Published: 2020-08-15The operation of opening the lid after solder paste is warmed up directly affects the stability of solder paste usage and printing yield. The specification requires that the warmed solder paste must be left to stand in a constant temperature room for more than 4 hours, with no condensed water on the surface, gently shaken and mixed before opening the lid, and the exposure time throughout the process must be controlled to no more than 8 hours. All links need to record the batch number, the start and end time of warming up, and the first lid opening time to ensure that the entire process of solder paste usage is traceable and reviewable.
Published: 2020-07-18
The Jiajinyuan technical team provides on-site resident services at the customer's SMT production line, conducting full-process diagnosis and process optimization for typical soldering defects such as solder bridging and tombstoning. Relying on precise selection and parameter matching of various halogen-free and lead-free high-temperature solder pastes including 8MQP/5RQ and 8MNTTP/5RNTT, combined with 030
Published: 2020-07-16First article inspection is the first gate for error prevention on the SMT production line. It is necessary to simultaneously verify the consistency between material models and the BOM, the thickness and offset of solder paste printing, the XYθ deviation of placement positions, and whether the temperature and time in each zone of the reflow profile meet the process window of JiajinYuan solder paste. Any inaccuracy in any link will cause irreversible defects such as cold solder joints, tombstoning, or cold soldering in mass production.
Published: 2020-07-12Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.