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There is a significant difference in solder paste wettability between halogen-free solder paste and ordinary solder paste. The removal of halogen components in halogen-free solder paste leads to a decrease in flux activity, manifested as a 5%~8% reduction in pad spread rate and an approximately 0.12mm decrease in pin climb height. However, its residue has strong insulation and low corrosion risk, making it suitable for high-reliability military and medical electronic production lines.
Published: 2013-05-07Sensor soldering solder with low ionic residue can significantly suppress leakage current and interfacial electrochemical migration, avoiding sensing signal drift and zero-point offset. Especially in MEMS and gas sensors with high impedance and microvolt-level output, excessive ionic residue will directly lead to deteriorated signal-to-noise ratio and reduced long-term stability. The Jiajinyuan LIS-702 series solder has a measured Cl?+Br?＜0.05 wt% and Na?+K?＜0.12 wt%, meeting the no-clean grade requirements of IPC J-STD-004B.
Published: 2013-04-29Nitrogen reflow involves introducing high-purity nitrogen into the reflow oven to significantly reduce the oxygen content in the chamber to below 100 ppm, thereby inhibiting the oxidation reaction of metal components such as tin, silver, and copper in the solder paste at high temperatures, improving the brightness and wettability of solder joints, and reducing void rate and cold solder risks. It is a key process method for the stable mass production of Jia Jinyuan series reflow ovens in the soldering of fine-pitch devices such as QFN and BGA.
Published: 2013-04-16When soldering BGA/QFN chips via SMT, an excessive void rate can lead to cold solder joints, increased thermal resistance, and early failure, and low-void solder paste is the core solution to this problem. The void rate of Jiajinyuan JL-808 series solder paste is stably controlled below 8% in mass production. Combined with optimized stencil aperture design and nitrogen-protected reflow, it can reduce the void rate at the bottom of QFN packages from 25% to 6.3%, while the void rate of individual BGA balls is simultaneously reduced to 4.1%.
Published: 2013-03-25
The tin slag rate in solder wire production directly reflects the stability of the smelting process and the level of raw material purity control. An excessively high tin slag rate often indicates intensified oxidation of molten tin, accelerated impurity enrichment, or uncontrolled temperature fluctuations, which can easily lead to batch defects in finished solder wire such as slag inclusions, uneven wire drawing, and reduced wettability.
Published: 2013-03-19ASEAN foreign trade solder is designed specifically for small and medium-sized export orders, supports small-batch trial orders starting from 5kg, and is paired with JJY's proprietary logistics channels and localized technical response to ensure a first trial production pass rate of over 92%. It can later be seamlessly switched to stable monthly delivery at the 20-ton level, truly addressing the pain points of Southeast Asian customers such as difficult early-stage verification and slow batch switching.
Published: 2013-02-21To address the persistent production line issues of small component placement offset and solder paste printing mismatch, this paper proposes a practical solution centered on solder paste forming accuracy, with coordinated adjustment of stencil apertures, squeegee parameters, and placement coordinates. It emphasizes the decisive influence of the actual coverage morphology of solder paste on pads on the solder paste positioning tolerance during placement.
Published: 2013-02-18Voiding directly affects solder joint reliability in SMT soldering. Its main causes include insufficient volatilization of solder paste flux, pad oxidation, and improper reflow heating ramp-up, which often interact with each other in actual production lines. Jiajinyuan solder paste shows variations in void rate under different stencil aperture designs and reflow profile matching, requiring coordinated optimization across printing, storage, and reflow profile stages.
Published: 2013-02-08
Stainless steel welding imposes special requirements on the activity, melting point, and flux composition of solder wire. Ordinary solder wire cannot achieve reliable connections at all due to insufficient rosin activity, poor wettability, and its inability to effectively break down the dense oxide film on stainless steel surfaces. Dedicated stainless steel solder wires containing halogen activators or organic acid composite systems must be selected, and used in coordination with mechanical grinding and flux paste.
Published: 2013-01-22The process parameter debugging of selective wave soldering should focus on the coordinated matching of nozzle temperature, chain speed, tin immersion time, and nitrogen coverage intensity. In actual production lines, Jiajinyuan equipment can significantly suppress bridging defects between pins of QFP-44 and SOIC-28 devices by controlling the nozzle temperature at 255℃±2℃, setting the chain speed at 0.8m/min, maintaining the single-point tin immersion time at 3.2 seconds, and stabilizing the nitrogen flow rate at 12L/min, which is especially suitable for secondary soldering scenarios after rework of high-density double-sided boards.
Published: 2013-01-16Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.