SMT Solder Paste Manufacturers.
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Here you can find knowledge about Solder Melting Point, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
X-Ray inspection can penetrate PCBs and packages to directly observe void ratios, bridging, cold solder joints, and offset conditions at the bottom of devices such as BGAs and QFNs, avoiding missed judgments in blind spots that cannot be covered by traditional AOI and ICT. It is the most reliable non-destructive method for verifying reflow soldering quality in SMT processes.
Published: 2022-03-16ENIG gold-plated PCB boards in SMT production lines often suffer from cold solder joints and poor wettability due to nickel layer oxidation, abnormal gold layer thickness, or mismatched solder paste activity. Solder paste compatibility must take into account both the intermetallic compound growth window of ENIG solder paste and the PCB surface condition, with key control over the flux acid value, active temperature range, and metal powder sphericity in the solder paste to avoid excessive metallographic dissolution or insufficient IMC formation.
Published: 2022-03-14Eutectic solder exhibits excellent forming stability in SMT reflow soldering. Since its solidus and liquidus temperatures coincide and its melting range is zero, it can avoid the common semi-molten state defects of traditional non-eutectic solder, significantly reducing the risks of cold solder joints, tombstoning, and poor wetting. It is especially suitable for mass production processes of high-density fine-pitch devices such as 0201 and 0.3mm pitch QFN.
Published: 2022-02-26The pin dip soldering lead-free alloy process, by precisely controlling dip soldering temperature, time, and alloy composition ratio, effectively avoids the ROHS compliance risks of traditional lead-containing processes. It has been stably operating on multiple export production lines of JJY for over three years, with its solder joint wettability, thermal fatigue resistance, and surface gloss all meeting the requirements of the IEC61191-2 standard.
Published: 2022-02-12High-tack solder paste effectively addresses solder paste collapse, component misalignment, and even component drop-off issues on SMT production lines caused by planned downtime, equipment failures, or line changeovers by enhancing the initial adhesion strength and high-temperature tack retention of surface-mount solder paste. It is particularly suitable for ultra-small components such as 0201 and 01005, as well as double-sided reflow processes. Its tack can be maintained for more than 4 hours at room temperature and remains stable in a 60°C environment, avoiding the significant tack decay that occurs in traditional solder paste after only 1.5 hours of downtime.
Published: 2022-01-27When foreign trade customers screen ISO solder material suppliers, they focus on the coverage of system certifications, batch traceability, and production line process control capabilities. Jiajinyuan operates under the dual IATF 16949+ISO 9001 system, implements SPC monitoring across all processes, and provides actual solder paste thermal cycling test reports, raising the one-time pass rate of customer factory audits to 92% and directly shortening the new project introduction cycle by 11 days.
Published: 2022-01-14
In 2021, the application of low-temperature solder paste in the consumer electronics field gradually expanded, mainly due to its advantages in protecting precision components and its soldering compatibility, making it an important factor driving the technological upgrading of the industry.
Published: 2021-12-30The stirring method of solder paste directly affects its viscosity stability and printing yield. Machine stirring accurately reproduces the process window through three parameters: rotation speed, time, and load. In contrast, manual stirring, with uncontrollable force, frequency, and direction, easily leads to high dispersion of solder paste viscosity. Actual measurements show that for solder paste from the same batch, the viscosity fluctuation range after machine stirring is controlled within ±150 Pa·s, while that after manual stirring can reach ±400 Pa·s. This difference is directly reflected in the stencil aperture filling rate and the incidence of solder joint bridging.
Published: 2021-11-13
Lead-containing and lead-free solder wires must not be mixed on the same production line. Due to the large difference in melting points, incompatible flux systems, and high risk of residue corrosion, mixing them will lead to cold solder joints, bridging, brittle solder joint cracking, and AOI misjudgment. The 217°C melting point of lead-free solder and the 183°C melting point of lead-containing solder wire create a thermal stress conflict, and their halogen contents and activation temperatures differ, which can easily cause batch soldering defects.
Published: 2021-11-12Solder OEM contract manufacturing foreign trade brand owners focus on the real needs of SMT production lines, providing one-stop solder OEM supply services from alloy ratio debugging and flux activity matching to reel/bottle custom packaging, supporting RoHS, REACH compliance certification and UL94 V-0 flame retardant rating verification. Jiajinyuan has completed rapid sampling and batch delivery for 37 export-oriented enterprises.
Published: 2021-11-07Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.