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Here you can find knowledge about Solder Flux, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
When manually repairing circuit boards, the selection of solder wire diameter directly affects solder joint formation and rework yield. 0.3mm solder wire is suitable for fine touch-up soldering and jumper wiring of small-size SMD components such as 0402 and 0603, while 0.5mm solder wire is more suitable for rapid tinning of QFP pins, power ground pads and large-area copper foils. 20 years of production line tests by JJY show that there are significant differences in melting consistency and wetting spreading ability between the two under the conditions of soldering iron temperature of 320℃ and dwell time of 2 seconds.
Published: 2014-01-28The solution to solder paste printing slump and poor release defects focuses on real production line pain points. From stencil aperture design, solder paste rheological properties, squeegee parameter matching to environmental temperature and humidity control, it systematically sorts out six key factors leading to solder paste slump and poor release, and provides an immediately executable parameter adjustment list and verification methods, helping engineers locate the main cause of solder paste release defects within 30 minutes.
Published: 2014-01-15When reworking and welding precision motherboards, precise temperature control must be applied to protect surrounding micro components. The Jiajinyuan JRY-850B hot air system, paired with an infrared temperature gun for real-time feedback, controls the peak temperature of BGA solder joints at 235±2℃ and limits the temperature rise of surrounding 0201 resistors to below 120℃, avoiding PCB delamination or MLCC hidden cracks caused by thermal stress.
Published: 2014-01-10Solder paste printing skip is a high-frequency defect on SMT production lines, directly related to the rheological properties of solder paste, stencil aperture design, and matching of squeegee parameters. Based on Jiajinyuan's 20 years of production line measurement experience, this paper focuses on solder paste, printing process stability, and root causes of solder paste skip, and proposes an immediately executable six-step troubleshooting method, covering real failure scenarios such as viscosity fluctuation of solder paste batches, insufficient stencil support rigidity, and sudden changes in squeegee pressure.
Published: 2013-12-03
The rosin flux inside the solder wire plays key roles during the soldering process, such as removing oxide films, reducing surface tension, and improving wettability. Its content and distribution directly affect the smoothness of solder joints, tin wetting speed, and cold solder joint rate, making it a core indicator of the actual soldering performance of solder wires.
Published: 2013-11-27Cold solder joints manifest as a lack of intermetallic compound layer between component pins and PCB pads, resulting in poor electrical conduction and insufficient mechanical strength. This defect is commonly observed in actual production line conditions such as insufficient peak reflow temperature, reduced solder paste activity, or severe pad oxidation. For Jiajinyuan solder paste, intensified flux volatilization after continuous printing for over 4 hours will significantly increase the incidence of cold solder joints.
Published: 2013-11-03Eutectic solder has a fixed single melting point in SMT production lines, enabling simultaneous melting and solidification, which significantly reduces thermal stress and void rate. Under the Sn96.5Ag3.0Cu0.5 system, the measured melting point of Jia Jinyuan eutectic solder is stable at 217.5℃±0.3℃, suitable for reflow soldering process control of high-density packages such as BGA and QFN.
Published: 2013-10-28Pin dip soldering uniformly covers the surface of component pins with a layer of tin-lead or lead-free solder, significantly improving pin solderability and wetting ability, and resolving cold solder joints and missed solder joints caused by plating oxidation and storage aging. It provides a stable and reliable soldering foundation for SMT placement, and is a key pre-treatment process for Jia Jinyuan's production line to handle high-density PCBs and fine-pitch QFP packages.
Published: 2013-10-14
In BGA chip repair, the synergistic use of solder paste and flux paste directly affects ball mounting yield and soldering reliability. In actual production lines, the flux paste application amount and solder paste printing thickness must be dynamically adjusted based on chip size, solder ball diameter, and PCB pad oxidation level, to avoid pad corrosion caused by excessive activity or increased voids caused by insufficient activity.
Published: 2013-10-12Tearing is a typical defect in solder paste printing caused by poor rheological performance at the moment the squeegee separates from the stencil, manifesting as slender solder spikes at the edges of the pads, which directly affects subsequent placement accuracy and the risk of reflow soldering bridging. Jia Jinyuan's actual tests found that solder pastes with a thixotropic index below 0.65 or a yield stress below 85Pa are highly prone to tearing under conditions of a 30μm stencil and a 45° squeegee angle.
Published: 2013-09-28Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.