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Here you can find knowledge about Solder Cream, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
Soldering thick-copper PCBs places extremely high demands on solder paste rheology, wetting force, and anti-slump performance. During selection, practical production-line issues caused by thick copper—such as rapid heat dissipation, high pad thermal mass, and high tendency of printing misalignment—must be comprehensively considered. Priority should be given to thick-copper solder pastes with high metal content, low thixotropic index, and specially formulated active flux, to ensure sufficient wetting and reliable solder joint formation under conventional reflow profile conditions.
Published: 2013-09-16The full-process standardized control of ISO solder material production focuses on three major categories: solder paste, solder wire, and solder bar. Through hard measures such as raw material batch traceability, linked control of ambient temperature and humidity, closed-loop adjustment of the dual parameters of squeegee pressure and speed, and dynamic calibration of reflow profiles, the yield rate of Jia Jinyuan's production line is stably maintained above 99.2%, eliminating defects such as cold solder joints, solder bridging, and poor solder wetting caused by solder paste activity attenuation, metal content deviation, or flux precipitation.
Published: 2013-09-11
Silver-containing solder paste is irreplaceable in high-power LEDs, automotive-grade MCUs, and 5G RF modules due to its lower melting point, superior electrical and thermal conductivity, and thermal fatigue resistance. Although its silver content is only 0.3% to 3%, it can significantly improve solder joint reliability. Especially in frequent thermal cycling scenarios from -40°C to 150°C, the crack propagation rate of silver-containing solder is more than 40% lower than that of ordinary solder paste.
Published: 2013-08-28Lead-free and halogen-free solder options for electronics manufacturing have become mainstream. Jiajinyuan provides dual-system lead-free solders: Sn96.5Ag3.0Cu0.5 and Sn99.3Cu0.7, while also supporting halogen-free formulations with Br < 900 ppm and Cl < 900 ppm, meeting the full requirements of IEC 61249-2-21, JPCA-ES-01-2021, and RoHS3, and adapting to different product standards for consumer electronics, automotive electronics, and medical devices.
Published: 2013-08-12Excessive voiding in the bottom thermal pad during QFN soldering is a high-frequency failure point in production lines, rooted in improper solder paste volume control. Jia Jinyuan SG-880 series solder paste, used with a 0.15mm stencil aperture and 25℃ environmental temperature control, can reduce the void rate to below 8%. This solution has been continuously verified on the mass production line of automotive MCU modules for 6 months.
Published: 2013-07-18To meet the actual production line requirements for solder materials used in industrial control motherboards, this summary focuses on the compatibility issues of solder paste in SMT printing, reflow soldering and wave soldering processes, and elaborates on the synergistic performance of Jiajinyuan solder paste and matching solder bars in high-reliability soldering, covering key process parameters such as viscosity adaptation, metal content control, and residue corrosion inhibition.
Published: 2013-06-25Batch-to-batch color variation of solder paste is a high-frequency cause of production line abnormalities, often reflecting deviations in flux composition or differences in the oxidation level of metal powder, which directly affect the printability, slump behavior, and reflow wetting capability of solder paste, leading to concentrated outbreaks of defects such as cold solder joints, solder bridges, and solder balls. This effect is particularly pronounced in high-density mounting scenarios such as 0201 and 0.4mm pitch QFN.
Published: 2013-06-22Gold-plated board soldering undertakes high-reliability connection tasks in the manufacturing of medical and precision instrument PCBs. Its surface process must balance solderability, corrosion resistance, and long-term signal stability. Gold-plated board soldering is particularly suitable for scenarios requiring micro pads, high-frequency devices, and low contact resistance. Gold layer thickness control, nickel barrier integrity, and reflow parameter matching are key bottlenecks for mass production yield.
Published: 2013-06-11
Although adding antioxidants to solder bars can significantly delay oxidation reactions and reduce the amount of dross generated during high-temperature molten soldering, it cannot completely eliminate dross formation due to multiple production line variables such as wave soldering temperature fluctuations, flux residue decomposition, molten solder agitation intensity, and alloy composition segregation. There are clear process boundaries for the effectiveness of solder oxidation resistance.
Published: 2013-06-07High-frequency board welding is extremely sensitive to solder paste voiding rate. Dielectric parameter fluctuations caused by voids directly degrade signal integrity. Jiajinyuan low-void solder paste, by optimizing metal content, flux volatilization gradient and reflow wetting dynamics, stably controls the voiding rate of BGA solder joints within 3.2% in 5G RF module tests, significantly suppressing insertion loss drift in high frequency bands.
Published: 2013-05-22Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.