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Low-temperature solder paste is suitable for heat-sensitive components such as MLCCs, LED beads, flexible printed circuits, and connectors with plastic housings. Its melting point is typically 138°C to 170°C, more than 50°C lower than that of traditional solder paste, which can significantly reduce the risk of thermal stress damage, while imposing higher requirements for reflow soldering zone settings and nitrogen protection.
Published: 2025-08-20High-oxidation-resistance solder bars suppress the continuous generation of solder dross at the source by improving the stability of the surface tension of molten solder and the compactness of the oxide film. Under the measured condition of 8 hours of continuous wave soldering operation, the solder dross output can be reduced by 42% to 58%, significantly extending the maintenance cycle of the solder pot and reducing the frequency of manual dross removal.
Published: 2025-08-18To address the frequent occurrence of bridging defects in the SMT process, we optimized the matching of stencil aperture size and thickness, adjusted the collaborative parameters of squeegee pressure and speed, and selected Jia Jinyuan anti-rheology solder paste to reduce the tendency of post-printing slump. This significantly reduced bridging caused by solder overflow on fine-pitch components such as 0402 and 0603, and improved the first article pass rate and first-pass yield.
Published: 2025-08-01Insufficient solder occurs frequently on SMT production lines, with root causes concentrated in stencil clogging and poor solder paste transfer rate, which often reinforce each other. For example, residual dried solder paste film around stencil apertures further reduces the solder paste transfer rate in subsequent printing, while a low transfer rate in turn exacerbates the batch occurrence of insufficient solder defects. The actual performance of Jia Jinyuan solder paste under different stencil thicknesses and aperture ratios has verified this pattern.
Published: 2025-07-17Reflow soldering is a key step in the SMT placement process to achieve metallurgical bonding of component pads. Solder paste goes through four stages in the reflow oven: preheating, soaking, reflow, and cooling, to complete melting and wetting. Its temperature profile setting, furnace temperature uniformity, and solder paste activity directly affect solder joint strength and void rate.
Published: 2025-07-04The solder sample testing focuses on measured furnace temperature profile data and stencil aperture parameter adjustments. By comparing the differences in printing accuracy, reflow wettability, and cold solder joint rate between old and new Jia Jinyuan solders, the process adaptability of the new solder in 0201 components and fine-pitch QFN packages is verified, providing a reproducible parameter baseline for mass production switching.
Published: 2025-06-18PCBA reliability testing is a key method for verifying finished product solder joints in real service environments. Through three types of rigorous tests—temperature cycling resistance, random vibration, and damp heat aging—it exposes hidden defects such as cold solder joints, dry solder joints, and abnormal growth of interfacial intermetallic compounds. In particular, it provides data support for solder joint failure modes of high-density packages such as BGA and QFN, offering a direct basis for JJY's production line process optimization and customer delivery risk control.
Published: 2025-06-13Void-free nitrogen reflow combined with low-void solder paste can reduce the void ratio of BGA solder joints from 15% to below 3%. This combination has been stably running on Jia Jinyuan's production line for over 2 million units. The key is that nitrogen purity must be maintained above 99.995% with oxygen content below 50 ppm. Combined with the thixotropy optimization and activator gradient volatilization design of Jia Jinyuan LDS-702 low-void solder paste, voids are effectively suppressed in the early stage of reflow.
Published: 2025-05-26Solder sample testing should focus on four practical dimensions: printing accuracy, wetting and spreading capability, void rate control, and solder ball formation tendency. Through methods such as stencil aperture matching verification, post-reflow solder joint morphology observation, X-ray void area statistics, and solder ball counting under a microscope, the adaptation boundaries of Jia Jinyuan solder under different PCB pad designs and process windows can be quickly identified.
Published: 2025-05-15
In manual soldering, the selection of solder wire diameter directly affects drag soldering efficiency and solder joint formation quality. Thick solder wire is suitable for large-area pads and quick solder replenishment but is prone to causing bridging, while thin solder wire facilitates precise pin control but imposes higher requirements on operation rhythm. Actual production lines need to comprehensively weigh factors based on PCB pad size, component spacing, and operation takt time.
Published: 2025-05-11Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.