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Addressing the industry pain point that solder joints on new energy electronic control boards are prone to cracking and have insufficient reliability under high-low temperature cycling conditions, Jiajinyuan has launched a variety of halogen-free and lead-free high-temperature solder pastes, covering segmented scenarios such as high solder climb for QFN/DFN, low void rate, zero halogen, and laser welding. Its 0307, 305 and other alloy systems at 240
Published: 2026-01-04The bulk procurement of solder for the electronics factory adopts the direct supply model from Jiajinyuan Factory, eliminating intermediaries to reduce the unit price by 12%~18%. Combined with VMI inventory collaboration and batch traceability system, the solder turnover cycle of the SMT production line is compressed to 4.2 days, significantly alleviating the capital occupation of solder and the pressure of emergency replenishment for the electronics factory.
Published: 2025-12-31Tombstoning is a common defect in the SMT printing process. Replacing the solder paste with better adaptability and synchronously adjusting the squeegee pressure, speed, and release parameters can significantly reduce the incidence of tombstoning. Jiajinyuan JY-808 series solder paste exhibits superior shear-thinning properties and release consistency in 0.3mm fine-pitch printing.
Published: 2025-12-20Internal voids in BGA/QFN solder joints will significantly weaken electrical and thermal conductivity. Especially when the void area ratio exceeds 25%, the thermal resistance of the solder joint rises by more than 30%, and the current carrying capacity decreases significantly. When X-ray inspection in the production line finds that voids are concentrated in the center of the pad or the edge area of the chip, it is necessary to immediately investigate key factors such as solder paste printing offset, excessive oxygen content in the reflow atmosphere, and oxidation of the PCB pad.
Published: 2025-12-06By subjecting industrial control motherboard solder samples to combined accelerated aging, temperature cycling, and vibration stress tests, we realistically simulate a decade of service environment on the production line, focusing on the microcrack propagation rate of solder joints, changes in IMC layer thickness, and shear force attenuation trends, to provide reproducible failure boundary data for JJY's industrial control motherboard solder selection and reflow parameter optimization.
Published: 2025-11-25As fine-pitch QFN pin spacing shrinks, the risk of bridging is further aggravated. Anti-slump and anti-tailing performance must be achieved by regulating the rheological properties of solder paste. JF-608 solder paste from Jiajinyuan demonstrates excellent viscosity retention under 217°C reflow conditions. When paired with 0.12mm stencil aperture and a 35° squeegee angle, it can stably control the bridging rate within 80ppm.
Published: 2025-11-11The solder used for Jiajinyuan sensor welding adopts a halogen-free formula design, meets the requirements of the IEC 61249-2-21 standard, has an ionic contamination value of post-welding residue lower than 0.5μg/cm² NaCl equivalent, can pass the high-reliability verification of medical sensors without cleaning, and is especially suitable for low-temperature welding scenarios of tiny heat-sensitive components such as platinum resistors and MEMS pressure cores.
Published: 2025-10-14
Dull solder joints after solder paste soldering are often not caused by a single factor, but rather the combined effect of multiple process variables such as insufficient solder paste activity, mismatched reflow temperature profile, unreasonable stencil aperture design, low nitrogen purity, or oxidation of PCB pads. Among these, the metal content of the solder paste itself and the flux system have the most direct impact on the final solder joint gloss.
Published: 2025-10-06Unstable soldering quality of OSP boards often stems from a mismatch between the activity of solder paste flux and the chemical stability of the OSP film, leading to poor wetting, cold solder joints, or blackened solder joints. Jiajinyuan series solder paste precisely removes the OSP film without corroding the copper surface through a gradient activity design, and its controllable stripping capability for 0.3μm thick OSP film has been verified on multiple production lines.
Published: 2025-09-27In the SMT soldering production line, solder paste thawing and stirring operations directly affect printing yield and reflow soldering void rate. Jia Jinyuan solder paste must be left to stand in an environment of 22℃±2℃ for more than 4 hours to be fully thawed. Stirring must adopt a dual-parameter locked mode with a constant speed of 60rpm and a duration of 120 seconds; otherwise, defects such as solder balls, solder spikes, and solder paste collapse are likely to occur.
Published: 2025-09-10Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.