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In formic acid atmosphere vacuum reflow soldering, solder paste must balance activity control and bubble removal; vacuum solder paste must have low vapor pressure, high thermal stability, and formic acid compatibility, while formic acid reflow solder paste requires a flux system that can synergistically reduce oxides with formic acid without exacerbating metal corrosion. These three factors jointly determine the void fraction and shear strength of solder joints in high-power devices.
Published: 2024-04-21For the first-article confirmation of the insufficient solder production line, the solder paste forming status must be visually inspected pad by pad, with a focus on identifying typical insufficient solder defects such as edge collapse, central depression, and local solder shortage. Simultaneous troubleshooting shall be conducted in combination with squeegee pressure, stencil aperture size, and solder paste rheological properties to ensure the printing stability of Jia Jinyuan solder paste under the low solder volume process window.
Published: 2024-04-17
Flux paste and solder paste have completely different functional roles in SMT placement soldering. Flux paste contains no metal powder and has no forming capability, so it cannot replace solder paste to achieve solder joint bonding and structural support. It can only serve as an auxiliary supplement to solder paste or a flux reinforcement method for local rework.
Published: 2024-04-09Solderability of immersion silver (ImAg) PCBs poses dual challenges to solder paste in terms of wetting performance and corrosion resistance. Jiajinyuan GJ-812A solder paste demonstrates excellent compatibility with silver finishes in actual production lines. Its weakly acidic flux system ensures sufficient wetting for 0.3mm fine-pitch QFN packages while avoiding excessive corrosion of the immersion silver layer. After reflow, the solder joints exhibit a clean surface and uniform IMC layer, effectively reducing the risks of cold solder joints and black pad.
Published: 2024-03-12During the rework soldering and BGA chip ball mounting process, an excessive void rate is the main cause of cold solder joints, increased thermal resistance, and early failures. Using low-void solder paste can significantly improve the metallurgical bonding quality of solder joints, and especially maintain structural integrity after multiple thermal cycles. In actual tests, the Jiajinyuan JGY-850 series solder paste stably controls the void rate within 8%. Combined with precise stencil aperture design and nitrogen-protected reflow, it increases the first-pass yield of rework soldering to 98.3%.
Published: 2024-02-28
Excessive flux paste application is a high-frequency cause of component displacement in SMT production lines, and this issue is particularly prominent when soldering tiny components such as 0201 and 0402 packages. Based on 20 years of on-site production line measurement experience of JJY, this paper focuses on the coordinated adjustment of three key factors: squeegee pressure, stencil aperture design, and printing speed. It proposes an immediately executable parameter window calibration method to directly target the process balance point between flux paste and component soldering stability.
Published: 2024-02-11
In 2023, the solder paste market showed a diversified development trend, with traditional industrial applications continuing to integrate with emerging fields such as new energy and semiconductors. The driving factors include technological progress, industrial transformation, and policy support. Industry practitioners need to pay attention to changes in market demand and optimize product structure.
Published: 2024-02-08
All Jiajinyuan solder paste products continue to pass the dynamic and effective control of RoHS, halogen-free, SGS and ISO systems, covering more than ten types of细分 scenarios such as high temperature, medium temperature, low temperature and laser welding. Among them, 8MQP/5RQ series solder paste achieves nearly 100% solder climbing rate for QFN/DFN, 8M9P/
Published: 2024-02-01In the ball mounting process, adopting a low-temperature solder paste solution can significantly reduce the thermal stress on BGA chip bodies, avoiding common production line failures such as pad peeling, silicon die microcracks, and molding compound delamination. In actual tests of the Jiajinyuan LTS series solder paste, this solution achieved ball diameter consistency of ±0.02mm at a peak temperature of 185℃, while balancing wetting and spreading performance with residue insulation properties.
Published: 2024-01-28
Lead-free solder paste and leaded solder paste have essential differences in composition, melting point, wettability, and reflow profile settings. The key to distinguishing them lies in the RoHS marking on the solder paste batch label, the color of flux residue, and the glossiness of solder joints. Since lead-free solder has a high melting point and high surface tension, it is necessary to increase the peak temperature and extend the time above the liquidus, while imposing higher requirements on stencil aperture design, squeegee pressure, and printing speed.
Published: 2024-01-23Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.