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The SMT solder industry is facing a dual shortage of skilled process engineers and on-site process technicians. In early 2026, several leading packaging enterprises and EMS foundries launched internal solder application capability certification programs, strengthening hands-on training in core processes such as solder paste printing and reflow profile optimization through joint training bases with universities and IPC standard courses, accelerating the transformation of SMT solder technical talent supply toward production line-adapted personnel.
Published: 2026-06-13
Driven by the accelerated iteration of consumer electronics, deepening domestic production of automotive electronics, and surging demand for multi-layer PCBs for AI servers, the 2026 SMT solder market will see structural growth. The shipment share of high-reliability lead-free solder, low-temperature solder, and silver-containing micro-alloyed products continues to rise. The overall industry demand scale will expand by about 12% compared with 2024, and the order backlog of leading material manufacturers has been extended to the third quarter of 2026.
Published: 2026-05-23
The "General Technical Specification for SMT Soldering Process" (GB/T 43287-2025), implemented on January 1, 2026, officially replaces the previous version of the standard. It adds 12 key technical indicators, including test methods for the thermal fatigue life of lead-free solders, requirements for the matching between stencil aperture and solder paste volume ratio, and dynamic deviation tolerance for reflow profiles. The batch consistency, wetting uniformity, and long-term reliability under high-temperature and high-humidity conditions of SMT solders have been systematically strengthened, providing a quantifiable basis for improving the manufacturing quality of PCBA in the consumer electronics, automotive electronics, and industrial control fields.
Published: 2026-05-18
After the solder paste soldering is completed, we may find that the edges of the solder paste are no
Published: 2026-05-15
Nowadays,Solder pasteIt has been widely applied in the electronics industry. Unlike tin wires and ti
Published: 2026-05-15
inSMTThe unused ones in the patchSolder pasteIt would be a waste to throw them away. Next time, anot
Published: 2026-05-15
Nowadays, many electronics factories are complaining that the cost of using the entire solder paste
Published: 2026-05-15
Lead-free tin barIt is an energy-saving raw material, free of lead chemicals, also known as low-carb
Published: 2026-05-15
In 2026, the SMT solder market is experiencing structural growth driven by demand from automotive electronics, AI servers, and wearable devices. The order share of high-end lead-free, low-temperature, and high-reliability SMT solder has increased to 38%. Leading domestic manufacturers are accelerating their IATF 16949 and IPC J-STD-004 certifications. The overall industry capacity utilization rate remains around 82%, with supply and demand approaching a tight balance.
Published: 2026-05-12
I believe all the partners should understand that sometimes the solder paste does not attach solder
Published: 2026-05-12Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.