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Here you can find knowledge about Low-Temperature Solder Paste, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
The selection of low-temperature solder paste must closely align with the balance among the temperature resistance limit of devices, solder joint reliability, and the production line process window. Among domestic solder pastes, LFP-JJY2R-64351 (Sn64Bi35Ag1), LFP-JJY5RW1A-4258 (Sn42Bi58), and LFP-JJY5RG-In52Sn48 have been batch-verified in scenarios such as LED transparent displays, copper wire lights, and fingerprint locks. Combined with T3/T4 powder particle sizes and ROL1/ROL0 halogen control, they achieve a solder wetting rate of over 70%, a void rate of <8%, and transparent, non-corrosive residues within a 160–220℃ reflow window.
Published: 2009-05-29SnBi solder paste has become a key material for soldering heat-sensitive components due to its low melting point of 138–172℃. Domestic solder paste has achieved mass production of mature formulations such as Sn42Bi58 and Sn64Bi35Ag1 in the low-temperature solder paste field. The Jiajinyuan LFP-JJY2R-64351 and LFP-JJY5RW1A-4258 series have verified process stability in printability, wettability and low void rate in scenarios such as LED transparent screens, copper wire lamps and aluminum nickel-plated heat sinks.
Published: 2009-03-20Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.