SMT Solder Paste Manufacturers.
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Here you can find knowledge about Domestic Solder Brand, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
Domestic solder has achieved full-process controllability from material formulation to batch stability, supports customers in small-batch sample trial and prototyping, and is widely adapted to scenarios such as new energy vehicle BMS modules, high-reliability PCBA for medical monitors, and consumer fast-charging boards. It can maintain 4-hour printing stability under workshop temperature control of 25℃~30℃. The thixotropic index of Jia Jinyuan solder paste reaches 0.72, with a viscosity recovery rate ≤15%, fully meeting the fine printing requirements of 0201 components and 0.3mm pitch QFN.
Published: 2015-10-22
The Jiajinyuan R&D team has been continuously optimizing the formulation system in response to solder performance bottlenecks, and has developed 12 major halogen-free and lead-free solder series covering the full temperature range of high, medium, low and ultra-low temperatures. Its domestic high-end solders have achieved breakthroughs in key indicators such as QFN/DFN solder wetting rate, low void rate for automotive lamps, and no solder balls in laser welding.
Published: 2015-01-08RoHS solder is directly supplied by domestic manufacturers and supports sample verification. Jiajinyuan RoHS solder has passed all SGS tests, with lead content <100ppm, cadmium <50ppm, hexavalent chromium <1000ppm, and melting point fluctuation between batches ≤±1.5℃. It is suitable for mainstream packages such as 0201 to QFN48. When used with rosin-based flux in a nitrogen environment, it achieves a wetting angle <35°, and the thickness of the solder joint IMC layer is stably controlled within the range of 1.2～1.8μm.
Published: 2012-05-04Domestic solder covers wire diameters from 0.3mm to 3.0mm, all temperature ranges (183℃~227℃) for both leaded and lead-free variants, and three flux systems: rosin, no-clean, and water-washable. It is compatible with multiple scenarios including high-speed SMT printing, wave soldering, dip soldering, and manual touch-up soldering. The Jiajinyuan series has a measured wetting angle ≤35°, bridging rate below 0.08%, and residual ion content <0.5μg/cm2. No adjustment to stencil apertures or reflow temperature profile is required when switching materials on the production line.
Published: 2011-03-06The direct supply model from domestic factories for solder auxiliary materials significantly reduces intermediate costs. Jiajinyuan's full range of solder auxiliary materials, including solder paste, flux, and cleaning agents, supports orders starting from 100kg. The unit price for bulk purchases is 18% to 25% lower than that of traders, and the delivery cycle is shortened to within 7 working days, meeting the needs of high-frequency replenishment and urgent changeovers on SMT production lines.
Published: 2010-05-25SMT solder paste selection must closely align with the actual pain points of the production line. Domestic solder pastes vary significantly in QFN solder wetting rate, halogen residue, void control, and laser welding compatibility. The 8MQP/5RQ series achieves nearly 100% solder wetting, the 8M9P/5RR zero-halogen variant matches the high-heat scenarios of automotive lighting, and the water-washable 8MW5/5RW5 meets the welding needs of both stainless steel and aluminum materials. The alloy powder grade (T3-T7), halogen grade (ROL0 to ROL1), and temperature window of placement solder paste must be strictly matched with equipment capabilities and product reliability requirements.
Published: 2009-06-04Based on production line measurements, this paper compares the performance of domestic no-clean solder paste in terms of QNP solder wetting rate, halogen residue, void control, and printing stability. It focuses on analyzing the process adaptability of three JIAJINYUAN SMT solder pastes—8MQP/5RQ, 8MNTTP/5RNTT, and 8M9P/5RR—on high-precision communication boards and automotive lighting boards, providing reproducible parameter references for the selection of domestic solder paste.
Published: 2009-06-02To address persistent production-line issues such as excessive voiding, poor solder climbing, and residual whitening in high-precision PCB assembly, this paper directly examines the measured performance of 8M9P/5RR zero-halogen low-void solder paste and 8MNTTP/5RNTT ultra-low-residue domestic solder paste. Combined with QFN device soldering, communication module rework, and automotive LED thermal management scenarios, it explains how low-void solder paste achieves a void rate of <3% through 0ppm halogen control, T4-grade fine powder distribution, and 305 alloy melting point matching, while also balancing PCB solder paste printing accuracy and batch stability of domestic solder paste.
Published: 2009-05-31The selection of low-temperature solder paste must closely align with the balance among the temperature resistance limit of devices, solder joint reliability, and the production line process window. Among domestic solder pastes, LFP-JJY2R-64351 (Sn64Bi35Ag1), LFP-JJY5RW1A-4258 (Sn42Bi58), and LFP-JJY5RG-In52Sn48 have been batch-verified in scenarios such as LED transparent displays, copper wire lights, and fingerprint locks. Combined with T3/T4 powder particle sizes and ROL1/ROL0 halogen control, they achieve a solder wetting rate of over 70%, a void rate of <8%, and transparent, non-corrosive residues within a 160–220℃ reflow window.
Published: 2009-05-29This paper focuses on the actual selection logic of high-temperature solder paste among domestic solder paste brands, combining 12 series of parameters verified by first-tier production lines such as Jia Jinyuan, covering QFN solder wetting rate, halogen content, alloy powder type, and the reflow soldering temperature window for solder paste. It particularly emphasizes the stability performance of 0307/305 alloys under the 240–260℃ reflow soldering process for solder paste.
Published: 2009-05-27Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.