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Brand: JJY TinSolder
Model: TLP-JJY7RTWT-6337T4
Alloy Composition: Sn63Pb37
Particle Size: 4#(20~38um)
Viscosity: 180±20 Pa·S
Activity: ROL0
Melting Point: 183℃
Specification: 500g/bottle
| Name | Parameters |
|---|---|
| Series | Leaded solder paste 7MTWT/7RTWT |
| Applications | For high-precision scenarios such as communication, tablets, laptops and mobile phones, as well as conventional scenarios; withstands long storage after printing without solder blackening or solder balls, bright joints |
| Halogen | <500ppm ROL0 |
| Flux Type | Rosin type |
| Alloy Powder | 62362/62836804/6337/6040/5545/55X/50X/45X/40X/434314 and other alloy powders, T2.5, T3, T4, T5 |
TLP-7RTWT-6337 leaded solder paste is made from standard 6337 leaded alloy spherical solder powder and is compatible with a wide range of common leaded alloys including 62362, 62836804, 6337, 6040, 5545, 55X, 50X, 45X, 40X and 434314, supporting T2.5, T3, T4 and T5 particle sizes. Paired with the 7MTWT/7RTWT rosin-type flux system in a low-halogen eco formula, the flux has a halogen content below 500 ppm, meeting ROL0 grade.
With stable activity and excellent wetting, it withstands long storage after printing without solder blackening or solder-ball defects, producing bright, full joints. Designed for high-precision SMT scenarios such as mobile phones, tablets, laptops and communication equipment, it also fully adapts to conventional chip-scale mass production. It needs no extra flux, adapts well to ordinary components and slightly oxidized boards, is compatible with traditional leaded SMT printing and reflow processes, and offers wide applicability with stable yield.
| Item | Specification | Reference Standard |
|---|---|---|
| Viscosity | 170±20 Pa·S | IPC-TM-650 |
| Solder Ball | PASS | IPC-TM-650 |
| Printing Durability | Excellent | |
| Flux Content | (10士0.5)% | |
| Flux Type | ROL0 | IPC J-STD-004 |
| Halogen Content | <0.08% | IPC J-STD-004 |
| Copper Mirror Corrosion Test | PASS | IPC-TM-650 |
| Surface Insulation Resistance - Initial | 1.0×1013Ω | IPC-TM-650 |
| Surface Insulation Resistance - After Humidity | 1.0×1012Ω | IPC-TM-650 |
| Spread Rate | 95% | JIS-Z-3197(1999) |
| Tack Life | 6-8 hours | |
| Solder Pit Test | Pass | IPC-TM-650 |
| Shelf Life (2-10°C) | 6 months | |
| Printability | Good printability on 0.3mm pitch boards |
| Solder Powder | Main Components (%) | Impurity Content (%) | |||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Alloy | Sn | Pb | Bi | Sb | Cu | Zn | Ag | Al | As | Cd | Fe | Ni | Hg |
| Sn63Pb37 | 63.0±0.5 | Rem. | ≤0.025 | ≤0.040 | ≤0.020 | ≤0.001 | ≤0.030 | ≤0.001 | ≤0.010 | ≤0.001 | ≤0.015 | ≤0.010 | ≤0.002 |
Stable printing viscosity and tack with excellent formability and up to 100% solder climbing height. Bright, full solder joints effectively solve industry challenges such as cold joints, solder bridging, solder balls, tombstoning, and voids.
Certified to multiple environmental SGS standards including RoHS, halogen, and REACH (SVHC). Post-solder residue is transparent and colorless, ROL0 no-clean, with high insulation resistance for safe, reliable performance.
Advanced production and testing equipment from Germany and Japan, strict ISO9001/ISO14001 quality control, and 21 inspection steps per batch ensure consistent, stable performance over the long term.
Our experienced engineers provide one-on-one service, free on-site debugging, and better-matched solder paste products, solving soldering process issues on the spot.
A full range of solder paste products to meet diverse process needs
SAC305 alloy, wide application range, high soldering reliability — the most widely used eco-friendly solder paste today
Sn42Bi58 alloy with a melting point of 138°C, effectively protecting heat-sensitive components such as FPCs
Sn63Pb37 eutectic alloy with excellent soldering performance and cost efficiency, ideal for general consumer electronics
| Model | Application | Halogen | Type | Alloy Powder |
|---|---|---|---|---|
| Leaded Solder Paste 8MN/7RN |
High activity, ideal for QFN/DFN high-climbing scenarios; bright solder joints; | 600~750ppm ROL1 |
Rosin Type | Alloy powder such as 62362/62836804/6337/6040 T2.5, T3, T4 |
| Leaded Solder Paste 7M/7R |
Suitable for high-precision and standard scenarios such as communications, tablets, laptops, and phones; bright solder joints; | 250~400ppm ROL0 |
Rosin Type | Alloy powder such as 62362/62836804/6337/6040/5545 T2.5, T3, T4, T5 |
| Leaded Solder Paste 7MTWT/7RTWT |
Suitable for high-precision and standard scenarios such as communications, tablets, laptops, and phones; withstands long placement after printing without solder blackening or solder balls; bright solder joints; | <500ppm ROL0 |
Rosin Type | Alloy powder such as 62362/62836804/6337/6040/5545/55X/50X/45X/40X/434314 T2.5, T3, T4, T5 |
| Leaded Solder Paste 7MTHT/7RTHT |
Dedicated to outdoor display scenarios; stable viscosity and long stencil life (a standout advantage); bright solder joints; concentrated rosin residue (no screen mottling, even ink color) | 250~400ppm ROL0 |
Rosin Type | Alloy powder such as 62362/62836804/6337/6040 T2.5, T3, T4, T5 |
| Leaded Solder Paste 7MH/7RH |
General purpose, transparent and bright residue; especially suitable for white boards such as LED, with strong drying resistance and continuous printing for over 16 hours; solder paste can be stored at room temperature; withstands long placement after printing without solder spattering, especially free of solder balls | 250~400ppm ROL0 |
Rosin Type | Alloy powder such as 62362/62836804/6337/6040/5545/55X/50X/45X/40X/434314 T2.5, T3, T4 |
| Leaded Solder Paste 7ML/7RL |
Transparent and bright residue; especially suitable for white boards such as LED, with slightly lower drying resistance, so best for fast-consumption scenarios; can also be used for grooved embedded heat sinks to achieve a low void rate | 250~400ppm ROL0 |
Rosin Type | Alloy powder such as 62362/62836804/6337/6040/5545/55X/50X/45X/40X/434314 T2.5, T3, T4 |
| Leaded Solder Paste 7MF/7RF |
Dedicated to silver pads such as silver-plated electronic ceramic components, photovoltaic cells, and light-show glass screens; does not corrode silver pads or cause blackening; | 150~350ppm ROL0 |
Rosin Type | Alloy powder such as 62362/62836804/6337/6040/5545 T2.5, T3, T4 |
| Water-Wash Leaded Solder Paste 3MW9/3RW9 |
Water-washable, lower cost, excellent printing formability; also suitable for energy-storage battery lead grid soldering; | ORH1 | Water-Wash Type | Alloy powder such as 62362/62836804/6337/6040/5545/5050/4555/4060/3565/3070/2575/2080/1585/1090/595 T2.5, T3, T4 |
| Leaded Solder Paste for Stainless Steel & Aluminum 3MW5/3RW5 |
For soldering stainless steel and aluminum; can be cleaned with water | ORH1 | Water-Wash Type | Alloy powder such as 62362/62836804/6337/6040/5545/5050/4555/4060/3565/3070/2575/2080/1585/1090/595 T2.5, T3, T4 |
| Leaded Alloy Type | Melting Point (°C) | Soldering Temp. (°C) | T2.5 | T3 | T4 | T4.5 | T5 | T6 | T7 |
|---|---|---|---|---|---|---|---|---|---|
| Sn62Pb36Ag2 | 179 | 200-225 | ✔ | ✔ | ✔ | ✔ | ✔ | ||
| Sn62.8Pb36.8Ag0.4 | 181 | 200-225 | ✔ | ✔ | ✔ | ✔ | ✔ | ||
| Sn63Pb36.9Ag0.1 | 181 | 200-225 | ✔ | ✔ | |||||
| 6337 (Sn63Pb37) | 183 | 200-225 | ✔ | ✔ | ✔ | ✔ | ✔ | ✔ | ✔ |
| 6040 (Sn60Pb40) | 183-191 | 210-235 | ✔ | ✔ | ✔ | ||||
| 5545 (Sn55Pb45) | 183-203 | 225-245 | ✔ | ✔ | ✔ | ||||
| 5050 (Sn50Pb50) | 183-215 | 235-255 | ✔ | ✔ | ✔ | ||||
| 4555 (Sn45Pb55) | 183-227 | 245-265 | ✔ | ✔ | ✔ | ||||
| 4060 (Sn40Pb60) | 183-238 | 255-280 | ✔ | ✔ | ✔ | ||||
| 3565 (Sn35Pb65) | 183-248 | 265-290 | ✔ | ✔ | ✔ | ||||
| 3070 (Sn30Pb70) | 183-258 | 280-300 | ✔ | ✔ | ✔ | ||||
| 2575 (Sn25Pb75) | 183-260 | 280-300 | ✔ | ✔ | ✔ | ||||
| 2080 (Sn20Pb80) | 183-279 | 300-320 | ✔ | ✔ | ✔ | ||||
| 1585（Sn15Pb85） | approx. 183-285/295 | 305-335 | ✔ | ✔ | ✔ | ||||
| 1090（Sn10Pb90） | 268-301 | 320-340 | ✔ | ✔ | ✔ | ||||
| 595（Sn5Pb95） | 300-314 | 335-355 | ✔ | ✔ | ✔ | ||||
| Sn55/Pb41.5/Bi3/Sb0.5 | - | - | ✔ | ||||||
| Sn52/Pb42.5/Bi5/Sb0.5 | 170 | 190-220 | ✔ | ||||||
| Sn48/Pb48.6/Bi3/Sb0.4 | - | - | ✔ | ||||||
| Sn43/Pb49/Bi7/Sb1 | - | - | ✔ | ||||||
| Sn38/Pb52.5/Bi8/Sb1.5 | 173 | 190-220 | ✔ | ||||||
| Sn43Pb43Bi14 | 144-163 | 185-200 | ✔ | ✔ | ✔ | ||||
| Sn10Pb88Ag2 | 268-299 | 320-340 | ✔ | ✔ | |||||
| Sn5Pb92.5Ag2.5 | 287-296 | 315-335 | ✔ | ✔ | |||||
| Sn5Pb93.5Ag1.5 | 296-301 | 320-340 | ✔ | ✔ |
| Model | Application | Halogen | Type | Alloy Powder |
|---|---|---|---|---|
| Halogen-Free Lead-Free High-Temp Solder Paste 8MQP/5RQ |
High activity, highest solder climbing (close to 100%) for QFN/DFN and similar applications | Single <900ppm / Dual <1500ppm ROL1 |
Rosin Type | Alloy powder such as 0307/105/305 T3, T4, T5 |
| Halogen-Free Lead-Free High-Temp Solder Paste 8MTSP/5RTS |
Higher activity, good solder climbing (70%-90%) for QFN/DFN and similar applications; low, bright residue; | <500ppm ROL0 |
Rosin Type | Alloy powder such as 0307/105/305 T3, T4, T5 |
| Halogen-Free Lead-Free High-Temp Solder Paste 8MNTTP/5RNTT |
Especially suitable for high-precision applications such as communications, tablets, laptops, mobile phones, Bluetooth, and fingerprint locks; low, transparent residue; | 100~200ppm ROL0 |
Rosin Type | Alloy powder such as 0307/105/305/00507BN/00507B2N T3, T4, T5 |
| Zero-Halogen & REACH Lead-Free High-Temp 8M9P/5RR |
Zero halogen, extremely low void rate, suitable for low-void, high-thermal-conductivity applications such as automotive lighting; low, transparent residue; | 0ppm ROL0 |
Rosin Type | Alloy powder such as 0307/105/305 T3, T4, T5 |
| Halogen-Free Lead-Free High-Temp Solder Paste 8MA |
Suitable for general and wider-pitch standard scenarios such as lighting LEDs; low, transparent residue; | <900ppm ROL1 |
Rosin Type | 0307/0107/SC07/00507BN/00507B2N alloy powder T3, T4 |
| Standard Halogen-Free Lead-Free Medium-Temp & Low-Temp Solder Paste 8M/2R (8MTHL/2RTHL) |
For lead-free medium-temp and low-temp scenarios that only tolerate medium/low temperatures, such as LEDs, crystal oscillators, copper wire lights, and transparent screens; | 800~900ppm ROL1 |
Rosin Type | Sn64Bi35Ag1/Sn64.7Bi35Ag0.3/Sn42Bi58/Sn42Bi57Ag1/Sn49.6Bi48.5Ag1Cu0.9/high-reliability LT32S alloy powder T2.5, T3, T4, T5 |
| Zero-Halogen Lead-Free Ultra-Low-Temp Solder Paste 5RG |
For special scenarios that only tolerate ultra-low temperatures; | 0ppm ROL0 |
Rosin Type | In52Sn48/In40.2Sn20.7Bi39.1 alloy powder T5, T6, T7 |
| Water-Wash Lead-Free High-Temp Solder Paste 8MW1P/5RW1 |
Post-solder residue can be cleaned with water; low cost; | ORH1 | Water-Wash Type | SC07/0307/105/305 alloy powder T3, T4 |
| Water-Wash Lead-Free Low-Temp Solder Paste 8MW1AP/5RW1A |
Leaves no traces after soldering on nickel-plated aluminum heat sink fins; low cost; | ORH1 | Water-Wash Type | Alloy powder such as Sn42Bi58 T2.5, T3, T4 |
| Laser Lead-Free High-Temp Solder Paste 5RLJ |
Laser-heated soldering with superior performance and no solder balls; compatible with pneumatic, screw, and jet valve dispensing. | <500ppm ROL0 |
Rosin Type | 0307/105/305/00507BN/00507B2N alloy powder T3, T4, T5, T6, T7 |
| Laser Lead-Free Medium/Low-Temp Solder Paste 5RLJB |
Laser-heated soldering with superior performance and no solder balls; compatible with pneumatic, screw, and jet valve dispensing. | <500ppm ROL0 |
Rosin Type | Sn64Bi35Ag1/Sn64.7Bi35Ag0.3/Sn42Bi58/Sn42Bi57Ag1/Sn49.6Bi48.5Ag1Cu0.9/high-reliability LT32 and LT32S alloy powder T3, T4, T5, T6, T7 |
| Lead-Free Solder Paste for Stainless Steel & Aluminum 8MW5/5RW5 |
For soldering stainless steel and aluminum; can be cleaned with water | ORH1 | Water-Wash Type | SC07/0307/105/305/Sn64Bi35Ag1/Sn64.7Bi35Ag0.3/Sn42Bi58 alloy powder T3, T4 |
| Lead-Free Solder Paste Alloy Type | Melting Point (°C) | Soldering Temp. (°C) | T2.5 | T3 | T4 | T4.5 | T5 | T6 | T7 |
|---|---|---|---|---|---|---|---|---|---|
| Sn96Ag4 | 221-226 | 240-260 | ✔ | ✔ | ✔ | ||||
| Sn97Ag3 | 221-224 | 240-260 | ✔ | ✔ | ✔ | ||||
| 305（Sn96.5Ag3Cu0.5） | 217 | 235-255 | ✔ | ✔ | ✔ | ✔ | ✔ | ✔ | |
| 105（Sn98.5Ag1Cu0.5） | 221-227 | 240-260 | ✔ | ✔ | |||||
| 0307（Sn99Ag0.3Cu0.7） | 221-227 | 240-260 | ✔ | ✔ | ✔ | ✔ | ✔ | ✔ | |
| 0107（Sn99.2Ag0.1Cu0.7） | 221-227 | 240-260 | ✔ | ✔ | ✔ | ✔ | ✔ | ✔ | |
| 00507BN（SnCu0.7Ag0.05BiNi） | 221-227 | 240-260 | ✔ | ✔ | |||||
| 00507B2N（SnCu0.7Ag0.05Bi2Ni） | 221-227 | 240-260 | ✔ | ✔ | |||||
| 99307（Sn99.3Cu0.7） | 221-227 | 240-260 | ✔ | ✔ | |||||
| SC07NG（Sn99.3Cu0.7 (Ni0.04-0.07, Ge0.008-0.01)） | 227 | 240-260 | ✔ | ✔ | |||||
| Sn90Sb10 | 253.3-255.7 | 275-290 | ✔ | ✔ | ✔ | ✔ | |||
| Sn95Sb5 | 245 | 265-285 | ✔ | ✔ | ✔ | ✔ | |||
| Sn69.5Bi30Cu0.5 | 149-186 | 205-225 | ✔ | ✔ | |||||
| 64351（Sn64Bi35Ag1） | 151-172 | 195-220 | ✔ | ✔ | ✔ | ✔ | ✔ | ||
| 6473503（Sn64.7Bi35Ag0.3） | 151-172 | 195-220 | ✔ | ✔ | |||||
| 4258（Sn42Bi58） | 138 | 160-185 | ✔ | ✔ | ✔ | ✔ | ✔ | ✔ | |
| Sn42Bi57Ag1 | 139/140 | 160-185 | ✔ | ✔ | ✔ | ✔ | ✔ | ||
| High-Reliability Lead-Free Low-Temp LT32/LT32S | 143-144 | 160-190 | ✔ | ✔ | ✔ | ✔ | ✔ | ✔ | |
| In52Sn48 | 118 | 140-160 | ✔ | ✔ | ✔ | ||||
| In40.2Sn20.7Bi39.1 | 65-89 | 110-130 | ✔ | ✔ | ✔ |
Targeted solutions for every soldering process challenge
Have other soldering issues? Consult our technical engineers now
Free Technical Consultation18 years of craftsmanship — every detail is a promise of quality
With 18 years of R&D and production experience and a scientifically developed modern process formula, our solder paste is highly compatible with the parts being soldered, producing strong, bright, uniform, full solder joints with no solder balls.
An ROL0 no-clean eco-friendly flux was developed, leaving little post-solder residue, offering high insulation resistance, keeping the board clean and corrosion-free, and forming a protective layer that prevents re-oxidation of the substrate.
An optimized flux formula with trace-element alloy additions, combined with a special process, gives the solder paste high activity that fully wets the pads and achieves a high solder climbing height, effectively eliminating cold and false joints, shifting, tombstoning, solder balls, voids, and other issues during soldering.
The solder powder particles are round and uniform in size, with no stringing, sticking, or spattering during printing and no collapse, sticking, or peaks after forming. Viscosity changes little over continuous printing, the paste does not dry out, and tack is well maintained without material loss.
Post-solder residue dissolves and washes away with pure water (deionized water), leaving no residue behind. Cleanliness is very high, achieving excellent ICT test performance without damaging electronic components. The production and cleaning processes generate no pollution and meet environmental requirements. Cleaning is fast — much faster than with other types of solder paste.
Follow the guidelines to get the best performance
Refrigerate at 0-10°C; shelf life 6 months
Take out 2-4 hours before use to reach room temperature
Stir thoroughly for 1-3 minutes until uniform
Seal and refrigerate any unused solder paste separately
Multiple authoritative certifications, quality you can trust
Quality Management System
ROHS Compliant
EU Environmental Certification
18-Year Factory Brand
Years in Industry
Customers
Inspection Steps
Quality Certifications
Our professional technical team provides custom formulas based on your process requirements. Solder alloys, flux activity levels, cleaning methods and special performance characteristics can all be customized. We also offer product selection advice, optimize soldering processes and provide suitable solutions to improve your first-pass yield.
A 5000㎡ factory equipped with 96 production and testing machines. ISO9001/ISO14001 certified and strictly implemented. 21 inspection steps ensure stable solder performance. Incoming material, in-process and finished product testing ensure compliance. All eco-friendly products are SGS tested and meet RoHS, halogen-free and REACH (SVHC) standards.
18 years focused on solder paste R&D and production. Using high-purity virgin tin, optimized flux formulas and a special process that adds trace-element alloys. Our solder paste precisely matches assembly scenarios, delivering fast climbing and bright, full solder joints. No cold joints, bridging, solder balls, tombstones, voids, stringing, slump or drying issues. Factory-direct sales with no middlemen for better value.
Senior engineers provide pre-sales consulting and after-sales technical support with one-on-one service. Free on-site debugging and product matching. On-site problem solving. Solutions provided within 24 hours and issues resolved within 72 hours. Free replacement for quality issues.
High-end equipment from Germany and Japan ensures product precision and quality
Vacuum Mixing (Tank and Syringe) Batch Filling Integrated Machine (1)
German SPECTRO Spectroscopy Analyzer
Japanese Malcom solder paste viscosity meter
Solder paste dispensing and spraying + Laser welding testing machine
Vacuum Mixing (Tank and Syringe) Batch Filling Integrated Machine (2)
Solder paste printing testing machine
Programmable Desktop Reflow Soldering Machine Tester
Kecheng Test Constant Temperature and Humidity Chamber
Vacuum mixing (tank and syringe) filling and sealing integrated machine (3)
Paste emulsifying machine
Paste grinding machine
Fully automatic solder paste mixer
Middle part of the tin cylinder
Solder Extruder
Wire Stretcher
Winding Machine
Serving many well-known enterprises, trusted by customers
Free samples + on-site debugging by technical engineers
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