JJY Tinsolder Tatak
Naka-localize na supply ng mga propesyonal na elektronikong materyales sa paghihinang, isang one-stop na solusyon sa pagbili para sa solder paste, solder wire at solder bar, na may mga sample na pagsubok at teknikal na suporta.
We are a Shenzhen-based solder paste manufacturing factory supplying directly to electronics assembly facilities across IndiaAndhra Pradesh. Our production facility spans 5,000 sqm and operates 96 sets of precision manufacturing and testing equipment, enabling full-range output including solder paste, solder wire, solder bar, and compatible fluxes.
A local electronics contract manufacturer in Visakhapatnam reported recurring defects — bridging and cold solder joints — when using imported solder paste with unstable rheology. After switching to our lead-free SMT solder paste with controlled metal content and thixotropic profile, their first-pass yield improved by 12% within two production cycles. No process requalification was required due to ISO 9001-certified batch consistency.
Our solder wire portfolio includes diameters from 0.3 mm to 1.2 mm, optimized for selective soldering and hand-soldering applications common in automotive electronics and industrial control units assembled in Tirupati and Guntur. Solder bar variants support wave soldering lines operating at 255°C to 275°C peak temperature, meeting IPC-J-STD-006 requirements for purity and oxide control.
All shipments to IndiaAndhra Pradesh use constant-temperature packaging with validated thermal buffering. We coordinate with dedicated logistics partners specializing in India-bound industrial cargo, ensuring customs-compliant documentation and minimal port dwell time. Sample dispatch is supported via express courier with full technical datasheets and reflow profile recommendations.
Remote SMT process support is provided by our application engineers, covering stencil design validation, print parameter optimization, and defect root-cause analysis. For high-volume partnerships, on-site consultation can be scheduled to align soldering parameters with local line speed, ambient humidity, and board stack-up characteristics.