Some of you may think, "The smaller the particle size of Solder Paste, the stronger its activity." Is this really the objective fact? JJY Solder paste manufacturer will lead our partners to learn about it together.

Relatively speaking, people who have just been exposed to Solder paste and have not been in the field for long, or those who use Lead-free solder paste, may agree with this view. Only after learning more do you discover that it is actually incorrect. JJY Solder Paste Manufacturer would like to explain why a smaller solder paste particle size does not necessarily mean stronger activity.

In fact, the reason lies in fine-pitch IC package printing. This is why partners have such a view: the solder coverage of solder paste with larger particle size is even worse than that of smaller particle size. The main reason is that many positions have not been coated with solder, or have not been coated at all. This is why some people feel it is caused by the weak activity of the solder paste.

The objective fact is not like that, because the gaps between fine-pitch IC electronic devices are very small. Only very tiny fine particles of solder paste can penetrate sufficiently, while larger particles are blocked and cannot penetrate at all. However, the strength of their activity needs no further elaboration.

In conclusion, if the small particles in the solder paste do not cause solder crawling or show weak tensile properties, it may be related to the weak activity of the solder paste.

The activity of solder paste is related to the activator added. The stronger the activity of the surfactant, the stronger the activity of the solder paste. Of course, the activity of the solder paste should be appropriate. If you want to know more about solder paste, lead-free solder paste, lead-free Flux paste, and related products, partners are welcome to consult Shenzhen Jiajin Qianyuan Industrial Technology Co., Ltd. and learn and grow together!