SMT Solder Paste Manufacturers.
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Whether expired solder paste can still be put into production depends on the actual storage conditions, compliance with temperature recovery procedures, and process verification results throughout the printing and reflow soldering process, rather than being simply determined based on the solder paste expiration label. In production lines, improper low-temperature cold storage often leads to sudden changes in solder paste viscosity, flux stratification, or oxidation of metal particles, which in turn causes batch defects such as insufficient solder, solder bridges, and cold solder joints.
Published: 2022-05-06Based on recent production line feedback regarding excessive solder paste print thickness and frequent bridging issues, Duoxi has re-evaluated the stencil aperture ratio, reducing the aperture area ratio in conventional 0402 component areas from 85% to 78%, while synchronously lowering squeegee pressure and print speed, resulting in a 12% overall reduction in solder paste deposition volume, effectively improving post-reflow tombstoning rate and solder joint void rate.
Published: 2022-04-16Leveraging its solder ODM R&D capabilities, Jia Jinyuan has developed a customized solder system featuring a low void rate (≤3%), a reflow peak temperature ≤220°C, and an extended oxidation resistance lifespan of over 72 hours, addressing pain points such as excessive void rate in BGA packaging, low-temperature soldering requirements for temperature-sensitive devices, and printing defects caused by solder paste oxidation on production lines. This system has been batch-validated on the production lines of multiple automotive electronics and medical equipment customers.
Published: 2022-03-17X-Ray inspection can penetrate PCBs and packages to directly observe void ratios, bridging, cold solder joints, and offset conditions at the bottom of devices such as BGAs and QFNs, avoiding missed judgments in blind spots that cannot be covered by traditional AOI and ICT. It is the most reliable non-destructive method for verifying reflow soldering quality in SMT processes.
Published: 2022-03-16ENIG gold-plated PCB boards in SMT production lines often suffer from cold solder joints and poor wettability due to nickel layer oxidation, abnormal gold layer thickness, or mismatched solder paste activity. Solder paste compatibility must take into account both the intermetallic compound growth window of ENIG solder paste and the PCB surface condition, with key control over the flux acid value, active temperature range, and metal powder sphericity in the solder paste to avoid excessive metallographic dissolution or insufficient IMC formation.
Published: 2022-03-14Eutectic solder exhibits excellent forming stability in SMT reflow soldering. Since its solidus and liquidus temperatures coincide and its melting range is zero, it can avoid the common semi-molten state defects of traditional non-eutectic solder, significantly reducing the risks of cold solder joints, tombstoning, and poor wetting. It is especially suitable for mass production processes of high-density fine-pitch devices such as 0201 and 0.3mm pitch QFN.
Published: 2022-02-26The pin dip soldering lead-free alloy process, by precisely controlling dip soldering temperature, time, and alloy composition ratio, effectively avoids the ROHS compliance risks of traditional lead-containing processes. It has been stably operating on multiple export production lines of JJY for over three years, with its solder joint wettability, thermal fatigue resistance, and surface gloss all meeting the requirements of the IEC61191-2 standard.
Published: 2022-02-12High-tack solder paste effectively addresses solder paste collapse, component misalignment, and even component drop-off issues on SMT production lines caused by planned downtime, equipment failures, or line changeovers by enhancing the initial adhesion strength and high-temperature tack retention of surface-mount solder paste. It is particularly suitable for ultra-small components such as 0201 and 01005, as well as double-sided reflow processes. Its tack can be maintained for more than 4 hours at room temperature and remains stable in a 60°C environment, avoiding the significant tack decay that occurs in traditional solder paste after only 1.5 hours of downtime.
Published: 2022-01-27When foreign trade customers screen ISO solder material suppliers, they focus on the coverage of system certifications, batch traceability, and production line process control capabilities. Jiajinyuan operates under the dual IATF 16949+ISO 9001 system, implements SPC monitoring across all processes, and provides actual solder paste thermal cycling test reports, raising the one-time pass rate of customer factory audits to 92% and directly shortening the new project introduction cycle by 11 days.
Published: 2022-01-14
In 2021, the application of low-temperature solder paste in the consumer electronics field gradually expanded, mainly due to its advantages in protecting precision components and its soldering compatibility, making it an important factor driving the technological upgrading of the industry.
Published: 2021-12-30Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.