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Here you can find knowledge about Solder Shelf Life, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
Thermal cycling testing is a key method for PCBA reliability testing. Through harsh conditions of -40℃ to +125℃, temperature rise and fall completed within 5 minutes, and a 15-minute dwell per cycle, it simulates temperature stress changes of products in real environments, focuses on exposing microcracks in solder joints and fatigue failure of the IMC layer, and directly reflects the impact of SMT placement processes and reflow profiles on long-term service life.
Published: 2018-12-26When manually soldering mobile phone motherboards, thin-diameter solder wire can precisely cover pads below 0.3mm, avoiding bridging and cold solder joints. Combined with a constant-temperature soldering iron and a high-magnification microscope, it enables reliable connections of tiny solder joints such as peripheral resistors and capacitors around BGA and cable interfaces, making it an indispensable practical process for rework production lines to handle high-density PCBs.
Published: 2018-12-11Aiming at the common edge collapse problem in solder paste printing for thick boards, this paper starts with the collaborative optimization of solder paste rheological properties, stencil aperture design and squeegee parameters, proposes a solder paste selection standard for thick boards adapted to PCB thicknesses above 0.8mm and a tightening scheme for the solder paste printing process window, and emphasizes that yield improvement can be achieved through solder paste viscosity gradient matching and fine-tuning of the standing time before reflow without replacing equipment.
Published: 2018-11-1901005 component soldering is currently one of the most challenging process bottlenecks on SMT production lines. Its 0.4mm×0.2mm size, 0.12mm pad pitch, and extremely low heat capacity require solder paste printing accuracy of ±15μm, placement repeatability ≤±10μm, and reflow peak temperature fluctuation controlled within ±2℃. The measured yield of Jiajinyuan JTY-806 solder paste paired with JTS-300 placement machine is stable at 99.2%～99.5%, but at least 3 rounds of fine-tuning are still required for the first article after line changeover to meet the standards.
Published: 2018-11-19
The flux content of solder wire directly affects solder wettability, residue control, and cold solder joint risk. In actual production lines, 0.5% to 3.0% is a common range, among which 1.8% to 2.2% delivers the best overall performance in wave soldering and manual soldering scenarios. Excessively high flux content tends to cause heavy smoke and yellowing of the PCB surface, while excessively low flux content leads to insufficient wetting and an increased probability of bridging.
Published: 2018-11-03Solder OEM contract manufacturing produces solder according to customer formulations, preserving original process performance. It can accurately replicate solder paste rheological properties, wetting speed, and reflow sphere formation consistency, avoiding printing slump, increased solder joint void rate, and ICT test misjudgment caused by raw material substitution or process adjustments. It is especially suitable for high-density BGA, 01005 components, and automotive-grade thermal cycle verification scenarios.
Published: 2018-10-06Post-printing solder paste placement failure and downtime stencil cleaning time directly determine the SMT first-pass yield. If solder paste remains on the stencil for more than 15 minutes, obvious slump, oxidation, and viscosity increase will occur. If stencil cleaning is delayed for more than 30 minutes after downtime, dried residual solder paste will cause solder spikes and insufficient solder in the next batch of printing. The production line must dynamically set the effective window after solder paste printing and the stencil cleaning response threshold based on solder paste type, workshop temperature and humidity, and printing frequency.
Published: 2018-10-03During soldering of ENIG boards, the wettability of solder paste directly affects the formation quality of solder joints. Jiajinyuan solder paste demonstrates excellent spreading ability and low void rate on ENIG boards. With a conventional reflow profile, it can achieve full solder joints, complete pin wrapping, and eliminate common production line defects such as solder spikes and cold solder joints.
Published: 2018-09-28Due to the large heat capacity and slow heating rate of thick copper plate welding, wave soldering is prone to missing solder. Selecting high-wettability solder bars can significantly improve the spreading ability of molten solder on thick copper substrates. Combined with the collaborative optimization of process parameters such as increasing the preheating temperature to 130℃～140℃ and reducing the chain speed to 1.0m/min～1.2m/min, it effectively solves problems such as insufficient solder joints, bridging defects, and cold solder on the back of the PCB.
Published: 2018-08-29The selection of eutectic solder must closely focus on the two key hard indicators of melting point and ductility, as the melting point directly determines the width of the reflow profile window, while ductility affects the thermal fatigue resistance of solder joints. Jia Jinyuan's Sn63Pb37 eutectic solder melts precisely at 183℃ with an elongation rate stably above 45%, making it a reliable choice for mass production of automotive controllers and industrial power boards.
Published: 2018-08-13Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.