SMT Solder Paste Manufacturers.
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Here you can find knowledge about Solder Paste Viscosity, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
TLP-7RN series QFN-specific leaded solder paste is developed to address the soldering challenges of QFN packages, effectively improving solder wetting rate and soldering reliability.
Published: 2026-08-24Improper solder paste stirring can easily lead to cold soldering risks and affect soldering quality. Correct solder paste stirring operations can reduce the defect rate and ensure stable production.
Published: 2026-08-24After reflow soldering, solder bead defects appear, which are closely related to the performance and usage of the solder paste. This paper explores the key role of solder paste in the soldering process through practical case analysis.
Published: 2026-08-24
The successive revisions of the EU RoHS Directive continue to impact the global solder industry, driving solder products toward more environmentally friendly development.
Published: 2026-08-24After reflow soldering, solder joints turn black, which is mainly related to flux residues in the solder paste. By controlling solder paste usage, optimizing reflow soldering parameters, and strengthening the cleaning process, residue problems can be effectively reduced and soldering quality can be improved.
Published: 2026-08-24
Looking back on the lead-free transition in the SMT solder industry, the EU RoHS Directive has driven the global solder industry toward environmentally friendly transformation.
Published: 2026-08-24The solder paste scrapping standards cover key indicators during use, such as viscosity changes, contamination status, and opening time. In practice, if obvious deterioration or contamination occurs, it must be discarded immediately to ensure welding quality.
Published: 2026-08-24
On October 10, 2023, we were delighted to welcome two European customers to Shenzhen Jia Jinyuan Industrial Technology Co., Ltd. for an inspection and discussion of solder paste project cooperation. This visit provided our company with a valuable opportunity to allow customers to gain a deeper understanding of our company's scale, products, production process control, research and development
Published: 2023-10-10The tombstoning issue in QFN packages is often caused by improper solder paste selection or insufficient process control. Correctly selecting solder paste and optimizing process parameters can effectively reduce such defects and improve product yield.
Published: 2026-08-24No abnormalities were found in the stencil aperture, yet solder paste printing still exhibits insufficient solder deposition. The core issue may lie in the solder paste itself or the operating process. This article analyzes common causes and provides practical recommendations to help resolve the challenge of insufficient solder deposition during solder paste printing.
Published: 2026-08-24Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.