SMT Solder Paste Manufacturers.
Focused on SMT soldering processes, a one-stop electronic soldering solutions provider.
Here you can find knowledge about Solder Paste Recycling, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
Incoming inspection of solder wire should focus on physical and process characteristics that can be quickly determined. The simplest and fastest inspection items include visual appearance inspection, diameter tolerance measurement, flux content observation, rosin residue condition assessment, and soldering wettability verification. These items can be completed on the production line within 10 minutes without the support of professional instruments, and directly determine whether the solder wire meets the immediate usage requirements for SMT wave soldering and manual soldering.
Published: 2010-11-25High-activity solder paste is specifically designed for sensor soldering applications, delivering excellent wetting performance on heavily oxidized PCB pads. It effectively resolves cold solder joints and tombstoning defects caused by pad oxidation after high-temperature storage, multiple reflow cycles, or long-term exposure with conventional solder pastes. It is particularly well-suited for the fine pads and low thermal mass requirements of precision sensors such as MEMS, pressure, temperature and humidity sensors.
Published: 2010-11-12The pre-drying process of solder paste printing directly affects the viscosity stability of the solder paste and the formation quality of solder joints. Excessive drying will cause the flux to volatilize in advance and increase the risk of solder paste collapse, while insufficient drying can easily lead to stencil clogging and printing deviation. Based on 20 years of measured data from the Jiajinyuan production line, this paper analyzes the actual impact of different temperature zone settings on the rheological properties of printed solder paste and the void rate after reflow soldering.
Published: 2010-11-11During the soldering process of immersion silver boards, excessively high flux activity will accelerate the oxidative corrosion of the silver layer, leading to blackened solder joints, poor wetting, and subsequent false judgments in ICT testing. By controlling the acid value of the flux, optimizing the reflow peak temperature and nitrogen purity, and combining with the precise selection of Jiajinyuan JY-806A medium-activity rosin-based flux, silver surface discoloration can be effectively suppressed, and the first-pass soldering yield can be improved.
Published: 2010-10-2101005 micro component SMT soldering imposes stringent requirements on solder paste particle size, rheological properties and reflow performance. Jiajinyuan J-01005 dedicated ultra-fine powder solder paste adopts Type 7 (D50=3.5μm) metal powder and a low-volatility flux system. Under conditions of stencil aperture ≤0.12mm, squeegee pressure 0.35MPa, and printing speed 25mm/s, it can achieve a solder paste transfer rate of over 98.7%, significantly reducing bridging, insufficient solder and tombstoning defects.
Published: 2010-09-28Addressing the local soldering challenges of industrial control board connectors, selective wave soldering achieves high-reliability soldering through precise temperature control and solder wave positioning, while avoiding overheating damage to sensitive components across the entire board. Jiajinyuan equipment stably achieves a 99.7% first-pass yield under conditions of 0.8mm pin pitch and 12mm pad length, with a process window widened by 35% compared to traditional wave soldering, making it particularly suitable for the mixed assembly requirements of multilayer boards + high-density connectors in domestic substitution.
Published: 2010-08-27
High impurity content in solder bars directly causes typical wave soldering defects such as solder spikes, bridging, and cold soldering. Elements such as copper, iron, and arsenic in solder impurities not only reduce wettability, but also accelerate oxidation of the solder pot and clog the nozzles, seriously affecting the line throughput yield and the service life of the solder bars.
Published: 2010-08-24For the common insufficient solder defects in SMT production lines, it is necessary to wipe the bottom of the stencil with a lint-free cloth dipped in IPA after every 10 to 15 PCBs are printed, and thoroughly clean the stencil once a week with an ultrasonic cleaning machine. Meanwhile, choose the JIAJINYUAN JL-8802 series solder paste, which has a viscosity change rate of less than 8%, a slump rate of less than 12%, and a printing release stability of 99.3% at room temperature of 25℃, and can significantly reduce the incidence of insufficient solder.
Published: 2010-08-19To address the issues of solder paste collapse and excessive reflow void rate easily caused by the large copper foil and large pad structures of energy storage power boards, this paper is based on 20 years of measured experience on the Jiajinyuan production line, focuses on the matching of key parameters for solder paste selection, emphasizes that solder paste for large pads requires coordinated control of high thixotropic index and medium viscosity, and low-void solder paste must meet the synchronization between the flux volatilization curve and the thermal response of high heat capacity substrates, with the core focus on the wetting and spreading stability of solder paste under thick copper design.
Published: 2010-08-03Solder OEM contract manufacturing and customization must strictly match the customer's production line takt time and equipment compatibility. Common spool weights are 250g, 500g, and 1kg. Specifications cover combinations of diameters from 0.3mm to 1.0mm and lengths from 0.5m to 30m. Outer packaging labels must include alloy composition, rosin type, activity grade, batch number, and RoHS/REACH compliance statements. All solder OEM contract manufacturing orders from Jia Jinyuan are executed in accordance with both JIS Z 3283 and IPC J-STD-006 standards.
Published: 2010-07-30Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.