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Here you can find knowledge about Solder Melting Point, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
During the pin dip soldering process, oxidation of the solder bath surface is the main cause of continuous dross generation. Jiajinyuan anti-oxidation flux, through the synergistic effect of dynamic coverage and active ingredients, forms a dense inert film on the solder bath surface, reducing the oxidation rate by more than 70% during pin dip soldering, cutting daily dross production by 1.2kg, significantly extending the cleaning cycle of the solder pot, and stabilizing solder joint wettability.
Published: 2018-03-2401005 packaged components, with their extremely small pad dimensions and narrow solder paste volume tolerance, are a high-incidence area for solder beads. Residual solder beads can easily cause creeping discharge and breakdown during high-voltage testing, directly threatening the insulation reliability of products. Production line data from Jiajinyuan shows that this type of defect accounts for 68.3% of the total solder bead incidence, requiring coordinated control from three aspects: stencil aperture design, squeegee pressure, and reflow atmosphere.
Published: 2018-02-20To address persistent issues such as uneven solder paste deposition, cold soldering, and solder bridging during thick copper foil soldering on multilayer boards, this paper draws on 20 years of measured data from Jia Jinyuan's production lines, focuses on precise solder paste dosage control methods, and details the matching logic for thick copper solder paste printing parameters, covering key actions such as stencil aperture design, squeegee pressure and speed coordination, and SPI detection threshold setting before reflow soldering.
Published: 2018-02-09Cold soldering is one of the most stubborn soldering defects in SMT production of large thick copper boards, occurring frequently especially on PCBs with copper thickness ≥2oz and dimensions ≥400mm×300mm. The root cause is that the large heat capacity of the copper substrate and delayed temperature rise lead to insufficient solder paste reflow. In production line tests, Jiajinyuan cold soldering repair paste can reduce the cold soldering defect rate from 1.8% to below 0.3%.
Published: 2018-02-07The standard for solder paste warm-up directly determines printing accuracy and solder joint reliability. Insufficient warm-up will lead to typical soldering defects such as high solder paste viscosity, poor demolding, solder paste collapse, and cold solder joints. Solder paste must strictly follow the 4-hour room temperature warm-up specification before use to avoid batch SMT defects caused by rushed production line launch.
Published: 2018-01-30Connector solder must balance wettability, residue control, and thermal shock resistance. Jia Jinyuan solder wires and bars can achieve capillary filling within 0.3 seconds in terminal dip soldering, maintain a bridging rate below 0.08% at an automatic soldering track speed of 1.2 m/min, and meet the dual-mode soldering requirements of 0.5mm-pitch FPC connectors and IDC crimp terminals.
Published: 2018-01-17
The solder paste itself is non-conductive; its metallic components are encapsulated by rosin or resin and remain in an insulating state when not melted. However, before reflow soldering, excessive residue, printing misalignment, or incomplete cleaning may still cause circuit short circuits due to ionic residue or solder bead bridging. In actual production lines, over 85% of short circuit problems stem from process control failures rather than the intrinsic conductivity of the solder paste.
Published: 2018-01-14Cold solder joints with rough surfaces, poor mechanical strength, and susceptibility to fracture failure are a high-frequency failure mode in SMT production lines. The root causes are insufficient melting of the solder paste, inadequate flux activity, or low reflow peak temperature. For Jia Jinyuan solder paste on 0.3mm fine-pitch QFN devices, if the reflow peak temperature is below 217°C, batch cold soldering leading to weak solder joints with thrust below 8gf is highly likely to occur.
Published: 2018-01-01To address the common issues of solder paste residue, ionic contamination, and incomplete cleaning encountered by water-washable solder paste in SMT production lines, this paper draws on 20 years of on-site commissioning experience to systematically outline key control points, including the matching of squeegee pressure and speed, the synergy of cleaning agent concentration and temperature, and the centrifugal speed and time window. It emphasizes that solder paste residue must be verified through dual validation of conductivity testing and microscopic re-inspection, to avoid batch rework caused by relying solely on cleaning machine parameters.
Published: 2017-12-24
A break in the rosin core of solder wire causes interrupted flux supply, poor wetting, and frequent cold solder joints during soldering. In actual production lines, this often manifests as dull solder joints, sharp spikes, and increased spattering, with problems becoming especially apparent during continuous wire feeding or manual touch-up soldering. Deviations in the concentricity between the solder wire and its rosin core, as well as fluctuations in the wire drawing process, are the root causes.
Published: 2017-12-21Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.