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Syringe dispensing solder paste and stencil printing solder paste are often used interchangeably in actual production lines, but differences in their rheological properties can easily cause issues such as needle clogging, stringing, and printing misalignment. Based on JJY's 20 years of on-site SMT experience, this paper focuses on the interchangeability boundaries between dispensing solder paste and printing solder paste, key points for thixotropic index matching, and a coordinated improvement plan for needle clogging based on the three core elements of temperature control, pressure, and cleaning.
Published: 2020-03-22
The tightness of the solder wire winding directly affects the smoothness of solder wire feeding in automatic solder feeders. Excessive tightness easily causes drawing breakage and jamming alarms, while excessive looseness leads to wire jumping, deviation, and even solder breakage. Production line tests show that a winding tension deviation exceeding 15% significantly increases the nozzle clogging rate.
Published: 2020-03-21Solder OEM contract manufacturing services focus on the full-category private label production of solder paste, solder wire, and solder bar, supporting in-depth customization from alloy formulation and flux activity control to branded packaging. Relying on 20 years of measured data from SMT production lines, JJY continuously optimizes printability and reflow stability to ensure mass production delivery of zero clogging, low void rate, and strong wettability for clients' own brands in high-speed placement machines and nitrogen reflow ovens.
Published: 2020-03-11
Jiajinyuan 5RLJ laser solder paste is optimized specifically for laser heating soldering scenarios. It adopts a synergistic design of rosin-based systems with multiple specifications of high-temperature alloy powders including 0307/105/305 and 00507BN, delivering stable performance with bright solder joints and no solder ball spattering within the 240–260℃ soldering window. Halogen
Published: 2020-02-19To address common issues such as cold soldering, poor wetting, and solder beads that frequently occur in the high-volume production of consumer electronics motherboards with OSP boards, this solution is based on measured production line data from Jia Jinyuan, focusing on four key measures: stencil aperture optimization, dynamic nitrogen concentration control, reflow oven temperature zone gradient matching, and AOI false alarm rate reduction. It stably improves the first-pass yield of OSP board soldering to 99.23%, with a single-line daily output exceeding 8500 units.
Published: 2020-02-17
Halogen-free solder paste is an eco-friendly solder paste that complies with RoHS and IEC 61249-2-21 standards. Its core feature is that the flux contains no halogen elements (such as chlorine and bromine) at all, while ordinary solder paste often contains halogen activators to improve wettability. There are essential differences between the two in terms of soldering reliability, ionic contamination, PCB corrosion risk, and ICT test yield.
Published: 2020-01-15
Whether flux paste must be cleaned after SMT soldering depends on the chemical activity and ion content of the flux residue, as well as the requirements of subsequent assembly processes. No-clean flux paste is not completely residue-free; rather, its flux residue becomes inert and low-corrosive after reflow. However, high-density BGA or aerospace-grade products still require cleaning to mitigate the risk of long-term electrochemical migration.
Published: 2019-12-31The head-in-pillow effect caused by solder paste defects and X-ray void defects in BGA soldering require coordinated troubleshooting from four aspects: solder paste selection, stencil design, printing parameters, and reflow profile. Insufficient wetting, uneven flux volatilization, or pad oxidation during the solder paste soldering process will exacerbate solder paste defect manifestations. Combining X-Ray image features can quickly identify the root cause of voids.
Published: 2019-12-14Solder auxiliary materials are indispensable supporting consumables in the PCBA soldering process, among which flux and PCB cleaning solvent directly affect soldering wettability, residue control and subsequent reliability. The Jiajinyuan series flux is compatible with 0201 to QFN0.4mm pads in SMT reflow soldering and wave soldering scenarios. Its rosin-based active ingredients take effect at 150℃ and complete activation at 235℃. When used with Jiajinyuan halogen-free PCB cleaning solvent, the ROSE method ion contamination value can be achieved <0.78μg/cm2.
Published: 2019-12-02
Flux paste residues do carry a risk of moisture absorption after long-term storage, which can significantly reduce the insulation reliability of PCBs, especially in high-humidity environments. In actual production lines, leakage failures between adjacent pads caused by moisture absorption of uncleaned rosin-based flux paste have occurred multiple times, and this problem is particularly prominent in enclosed areas such as under BGA and fine-pitch QFN.
Published: 2019-11-08Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.