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Consumer electronics solders must balance low melting point, high wettability, and low corrosivity of residues. Especially in high-density PCBA soldering for mobile phone earphones and similar devices, Jia Jinyuan SN96.5AG3.0CU0.5 solder has been experimentally measured to have a wetting angle of <25° on 0.3mm pitch BGA and 0201 components, with the post-reflow ICT test defect rate stably controlled within 80ppm.
Published: 2011-01-18Silver-plated board soldering is a critical step in the SMT process where abnormalities such as pad blackening, poor wetting, and excessively thin IMC layers are prone to occur. Based on actual production line cases from Jia Jinyuan, this article focuses on the dependence of silver-plated board soldering on the quality of PCB silver surface treatment, and provides a detailed explanation of practical key points such as silver layer thickness control, OSP residue impact, reflow profile adaptation, and stencil aperture compensation.
Published: 2011-01-04
Solder wire and solder filament are often used interchangeably in SMT production lines, but they actually refer to the same type of flux-cored solder, with the difference only lying in industry customary naming conventions. "Solder wire" is more commonly used in the colloquial language of electronics factories, while "solder filament" is frequently seen in purchase orders and supplier documents. For specification identification, key focus should be placed on diameter tolerance, flux content, rosin type, and J-STD-006 certification markings.
Published: 2010-12-11
Incoming inspection of solder wire should focus on physical and process characteristics that can be quickly determined. The simplest and fastest inspection items include visual appearance inspection, diameter tolerance measurement, flux content observation, rosin residue condition assessment, and soldering wettability verification. These items can be completed on the production line within 10 minutes without the support of professional instruments, and directly determine whether the solder wire meets the immediate usage requirements for SMT wave soldering and manual soldering.
Published: 2010-11-25High-activity solder paste is specifically designed for sensor soldering applications, delivering excellent wetting performance on heavily oxidized PCB pads. It effectively resolves cold solder joints and tombstoning defects caused by pad oxidation after high-temperature storage, multiple reflow cycles, or long-term exposure with conventional solder pastes. It is particularly well-suited for the fine pads and low thermal mass requirements of precision sensors such as MEMS, pressure, temperature and humidity sensors.
Published: 2010-11-12The pre-drying process of solder paste printing directly affects the viscosity stability of the solder paste and the formation quality of solder joints. Excessive drying will cause the flux to volatilize in advance and increase the risk of solder paste collapse, while insufficient drying can easily lead to stencil clogging and printing deviation. Based on 20 years of measured data from the Jiajinyuan production line, this paper analyzes the actual impact of different temperature zone settings on the rheological properties of printed solder paste and the void rate after reflow soldering.
Published: 2010-11-11During the soldering process of immersion silver boards, excessively high flux activity will accelerate the oxidative corrosion of the silver layer, leading to blackened solder joints, poor wetting, and subsequent false judgments in ICT testing. By controlling the acid value of the flux, optimizing the reflow peak temperature and nitrogen purity, and combining with the precise selection of Jiajinyuan JY-806A medium-activity rosin-based flux, silver surface discoloration can be effectively suppressed, and the first-pass soldering yield can be improved.
Published: 2010-10-2101005 micro component SMT soldering imposes stringent requirements on solder paste particle size, rheological properties and reflow performance. Jiajinyuan J-01005 dedicated ultra-fine powder solder paste adopts Type 7 (D50=3.5μm) metal powder and a low-volatility flux system. Under conditions of stencil aperture ≤0.12mm, squeegee pressure 0.35MPa, and printing speed 25mm/s, it can achieve a solder paste transfer rate of over 98.7%, significantly reducing bridging, insufficient solder and tombstoning defects.
Published: 2010-09-28Addressing the local soldering challenges of industrial control board connectors, selective wave soldering achieves high-reliability soldering through precise temperature control and solder wave positioning, while avoiding overheating damage to sensitive components across the entire board. Jiajinyuan equipment stably achieves a 99.7% first-pass yield under conditions of 0.8mm pin pitch and 12mm pad length, with a process window widened by 35% compared to traditional wave soldering, making it particularly suitable for the mixed assembly requirements of multilayer boards + high-density connectors in domestic substitution.
Published: 2010-08-27
High impurity content in solder bars directly causes typical wave soldering defects such as solder spikes, bridging, and cold soldering. Elements such as copper, iron, and arsenic in solder impurities not only reduce wettability, but also accelerate oxidation of the solder pot and clog the nozzles, seriously affecting the line throughput yield and the service life of the solder bars.
Published: 2010-08-24Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.