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Before the delivery of foreign trade orders, solder sample testing must be conducted. Key parameters such as melting point, wettability, and residual ion content are verified through pre-sampling tests to avoid rejection or returns by overseas customers due to batch differences. Jia Jinyuan's measured data shows that the defect rate of export batches without solder sample testing is as high as 12.7%, while the customer complaint rate for orders following standard sampling procedures is reduced to within 0.3%.
Published: 2024-11-15When soldering communication base station motherboards with high-frequency boards, it is necessary to cope with long-term cyclic working conditions from -40℃ to +85℃. Jiajinyuan optimized solder paste selection, stencil aperture compensation, and segmented temperature control of the reflow soldering profile, reducing the solder joint void rate to ≤8%. After 2000 thermal shocks, the impedance fluctuation remains <3%, ensuring the stability of 5G millimeter-wave signal transmission.
Published: 2024-10-14RoHS solder fully meets the requirements of EU environmental directives. Jiajinyuan lead-free solder paste achieves stable printing of 0.3mm fine-pitch QFN on SMT production lines, with a wetting angle of less than 35° after reflow and a void rate of less than 15%. When paired with solder wires and bars of the same system, it can ensure consistent process windows for wave soldering and manual soldering, avoiding poor wetting or abnormal thickening of the IMC layer caused by mixed use.
Published: 2024-09-16
Solder paste and red glue processes can be mixed on the same PCB, but the physical isolation between the red glue dispensing position and the solder paste printing area must be strictly controlled, the reflow soldering temperature profile must take into account both the red glue curing and solder paste melting windows, and the stencil aperture design, dispensing parameters and AOI inspection strategy must be collaboratively optimized. Otherwise, it is extremely easy to cause batch defects such as cold solder joints, tombstoning or red glue contamination of pads. This is a high-risk but implementable special process combination in SMT processes.
Published: 2024-09-13To address common solder paste defects during the dispensing process, such as stringing and paste breakage, this paper examines five key factors: viscosity, thixotropic index, metal content, flux activity, and storage temperature. By combining these factors with actual production line measurement data, it proposes an immediately actionable solder paste parameter optimization pathway, providing a direct basis for dispensing solder paste selection and process matching.
Published: 2024-09-01Soldering 01005 components poses extreme challenges to the accuracy of high-speed placement machines, the consistency of solder paste printing, and the uniformity of the reflow soldering thermal field. Through dual-track synchronous visual positioning, 0.02mm-level Z-axis closed-loop compensation, and a gradient temperature zone control system, Jiajinyuan equipment controls solder joint offset within ±12μm in mass production, effectively addressing typical failures such as tombstoning, cold solder joints, and uneven pad wetting during 01005 component soldering.
Published: 2024-08-21Solder paste selection must match the actual pad pitch and stencil aperture size. T3 to T6 solder powder particle sizes directly affect the printing accuracy and slump control of fine-pitch solder paste. Among them, T4 (25–45μm) is suitable for 0.4mm pin pitch, T5 (15–25μm) is adapted for fine-pitch solder paste applications of 0.3mm and below, while T6 (5–15μm) is only limited to CSP or FCCSP packages below 0.2mm and requires nitrogen reflow and high-precision printing equipment.
Published: 2024-08-14Chinese-made solder exports to ASEAN must simultaneously meet the dual requirements of China's export supervision and the technical access of ASEAN importing countries, involving the application of RCEP rules of origin, SN/T 0370.3-2018 packaging inspection, HS code 81052090 classification confirmation, and adaptation to the RoHS exemption clauses of the destination country. A batch of Jiajinyuan solder wire was fully returned during inspection by a Vietnamese customer due to flux residue failing to meet the limits of TCVN 8264:2019, exposing the problem of missing third-party SGS testing before export.
Published: 2024-08-05SMT printing is a key process in which SMT stencils evenly transfer solder paste to PCB pads, directly affecting placement accuracy and reflow soldering yield. In actual production lines, solder paste viscosity, stencil aperture size, squeegee pressure, and printing speed must be coordinated and matched; any slight deviation will cause typical defects such as insufficient solder, solder bridging, or misalignment.
Published: 2024-07-28PCBA soldering materials have complete SGS certifications, covering all categories including lead-tin alloys, lead-free solder pastes, fluxes and cleaning agents, and comply with mandatory export standards such as IEC 61249, RoHS 2.0 and REACH. They can be directly used for complete machine exports to the EU, North America, Japan and South Korea, avoiding customs clearance delays or batch returns caused by missing material qualifications.
Published: 2024-07-14Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.