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Welding thick copper boards directly determines the high-current carrying capacity and long-term operational stability of solder joints in new energy power boards. By optimizing the synergy among pad design, solder paste selection, and reflow profile, JJY ensures that solder joints on 2mm thick copper layers maintain a temperature rise within 35°C under a continuous current of 150A, avoiding common production line failures such as cold solder joints, excessive void rates, and thermal stress cracking.
Published: 2021-04-21PCBA soldering materials cover a full range of auxiliary materials including solder paste, solder wire, flux, cleaning agent and nitrogen. Their selection and control directly determine the SMT placement first-pass yield and long-term reliability. The Jiajinyuan series performs stably under stringent parameters such as reflow soldering peak temperature of 235℃±5℃, solder paste viscosity of 700±100Pa·s, and flux solid content of 18.5%.
Published: 2021-04-07When reflow soldering precision BGA/QFN devices, the heating rate directly affects solder joint void ratio, solder ball collapse consistency, and PCB warpage risk. In particular, a preheat ramp exceeding 3℃/s can easily cause ceramic substrate cracking, while insufficient flux residue control occurs when the soak stage duration below 150℃ is less than 90 seconds. Jia Jinyuan's measured data shows that the void ratio of QFN bottom solder joints increases by 27% as the heating slope rises by 1.2℃/s. The temperature difference across the entire board must be controlled within ±2.5℃ to ensure first-pass yield.
Published: 2021-03-25
The division of application scenarios between solder paste and liquid flux depends on solder joint size, component density, and equipment compatibility. Solder paste is suitable for stencil printing or dispensing processes for 0201 and smaller micro components, while liquid flux is mostly used for through-hole insertion, rework on large solder pads, and pre-spraying before selective wave soldering. The two are often used in combination in SMT production lines according to process cycle time and residue control requirements.
Published: 2021-03-09The solder paste optimization corresponding to the generation mechanism of tiny solder balls focuses on the dynamic coupling relationship among solder paste, solder ball solder paste, and solder paste reflow. By regulating the particle size distribution and sphericity of metal powder in the solder paste, the volatilization gradient of the flux, and the viscosity decay curve, the generation of 0.1～0.3mm tiny solder balls is significantly suppressed without sacrificing printing accuracy, and PPM-level defect reduction has been achieved in multiple automotive electronics production lines.
Published: 2021-02-27Leveraging years of hands-on experience in SMT production lines, the ASEAN foreign trade solder factory stably supplies highly consistent solder products to global customers. It can also provide MSDS material reports that comply with REACH, RoHS, and customs requirements of various countries, meeting the rigid demands of ASEAN foreign trade solder in export customs clearance, terminal factory audits, and process traceability.
Published: 2021-02-19AOI inspection is highly efficient for identifying surface defects on solder joints, but due to the limitations of optical principles, it cannot penetrate the metal solder layer, resulting in complete missed detection of internal defects such as voids and cold solder joints. X Ray inspection, with its penetrating capability, has become the only reliable means to identify solder joint voids in devices such as BGA and QFN.
Published: 2021-02-13
The solder paste reflow profile must be dynamically adjusted according to the alloy composition, melting point range, and flux activity. For example, SAC305 requires a peak temperature of 235℃±5℃ and a time above liquidus of 60~90 seconds, while Sn63/Pb37 requires a peak temperature of 220℃±3℃ and a time above liquidus of 45~60 seconds. The metal powder particle size distribution and oxidation level of different solder pastes also significantly affect the ramp-up rate and soak zone settings.
Published: 2021-01-27When soldering 5G devices on high-frequency PCBs, solder faces the practical issue of increased void rate that exacerbates signal attenuation. By optimizing metal content, rheological properties, and flux volatilization pathways, low-void solder paste has been verified on actual production lines of the Jiajinyuan JH-5G series, stably controlling the void rate of BGA solder joints within 8%, significantly improving the impedance continuity and return loss performance of RF modules in the millimeter-wave frequency band.
Published: 2021-01-19
The global supply chain volatility in 2020 significantly impacted solder paste supply, prompting some manufacturers to accelerate localized production layouts to cope with market uncertainty. Industry trends show that demand for solder paste continues to grow, but supply stability faces challenges, and enterprises need to strengthen localized capabilities and industrial chain coordination.
Published: 2021-01-08Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.