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Solder Paste

18 Years of Focus on Solder R&D and Production

High-Quality Solder Paste
Solving Your Soldering Challenges

Cold solder? Solder balls? Tombstoning? Voids?
JJY Solder Paste provides one-stop perfect solutions

ISO Certified

Quality Assured

18+

Years of Experience

5000+

Partner Clients

99.5%

Customer Satisfaction

Get Quote Now

What Makes Our Solder Paste Different

Excellent Printing & Soldering Performance

Stable printing viscosity, excellent forming, up to 100% solder climb height, bright and full solder joints. Effectively solves cold solder, solder bridges, solder balls, tombstoning, voids and other industry challenges.

Environmentally Friendly & Halogen-Free

RoHS, Halogen, REACH(SVHC) certified. Transparent and colorless post-solder residue, ROL0 no-clean, high insulation resistance, safe and reliable.

Consistent Quality & Reliable Supply

Advanced production and testing equipment from Germany and Japan. ISO9001/ISO14001 certified quality control. Each batch undergoes 21 inspections for consistent long-term performance.

Professional Technical Support

Experienced engineer team provides one-on-one service, free on-site debugging, customized solder paste solutions, and on-site process problem solving.

Core Product Showcase

Complete range of solder paste products for different process requirements

Lead-Free Solder Paste

Hot Sale

SAC305 alloy, wide application range, high soldering reliability, the most widely used eco-friendly solder paste

Low-Temperature Solder Paste

New

Sn42Bi58 alloy, melting point 138°C, effectively protects heat-sensitive components like FPC

Lead-Based Solder Paste

Cost-Effective

Sn63Pb37 eutectic alloy, excellent soldering performance, cost-effective, suitable for general consumer electronics

Lead-Based Paste - Performance Lead-Based Paste - Alloy Lead-Free Paste - Performance Lead-Free Paste - Alloy

*Swipe table left/right to view all parameters

Model	Application	Halogen	Type	Alloy Powder
Lead-Based Paste 8MN/7RN	High activity, dedicated for QFN/DFN with high solder climb; bright solder joints;	600~750ppm ROL1	Rosin Type	Alloy powders: 62362/62836804/6337/6040 T2.5, T3, T4
Lead-Based Paste 7M/7R	Suitable for high-precision applications like communication, tablets, laptops, mobile phones and general applications; bright solder joints;	250~400ppm ROL0	Rosin Type	Alloy powders: 62362/62836804/6337/6040/5545 T2.5, T3, T4, T5
Lead-Based Paste 7MTWT/7RTWT	Suitable for high-precision and general applications; long shelf life after printing without solder blackening or solder balls; bright solder joints;	<500ppm ROL0	Rosin Type	Alloy powders: 62362/62836804/6337/6040/5545/55X/50X/45X/40X/434314 T2.5, T3, T4, T5
Lead-Based Paste 7MTHT/7RTHT	Dedicated for outdoor display; stable viscosity, long stencil life; bright solder joints; concentrated rosin residue distribution (no screen blooming, uniform ink color)	250~400ppm ROL0	Rosin Type	Alloy powders: 62362/62836804/6337/6040 T2.5, T3, T4, T5
Lead-Based Paste 7MH/7RH	General purpose, transparent bright residue, ideal for white PCBs like LED; continuous printing over 16 hours; room temperature storage; long shelf life after printing, no solder splashing, especially no solder balls	250~400ppm ROL0	Rosin Type	Alloy powders: 62362/62836804/6337/6040/5545/55X/50X/45X/40X/434314 T2.5, T3, T4
Lead-Based Paste 7ML/7RL	Transparent bright residue, ideal for white PCBs like LED; slightly poor dry resistance, suitable for fast consumption scenarios; also for groove embedded heat sinks to achieve low VOID rate	250~400ppm ROL0	Rosin Type	Alloy powders: 62362/62836804/6337/6040/5545/55X/50X/45X/40X/434314 T2.5, T3, T4
Lead-Based Paste 7MF/7RF	Dedicated for silver pads on silver-plated electronic ceramic components, photovoltaic cells, light show glass screens; no silver pad corrosion, no blackening;	150~350ppm ROL0	Rosin Type	Alloy powders: 62362/62836804/6337/6040/5545 T2.5, T3, T4
Water-Washable Lead-Based 3MW9/3RW9	Water-washable, low cost, excellent printing; also for lead grid welding in energy storage batteries;	ORH1	Water-Washable	Alloy powders: 62362/62836804/6337/6040/5545/5050/4555/4060/3565/3070/2575/2080/1585/1090/595 T2.5, T3, T4
SS/Aluminum Lead-Based 3MW5/3RW5	For stainless steel and aluminum soldering, water-washable	ORH1	Water-Washable	Alloy powders: 62362/62836804/6337/6040/5545/5050/4555/4060/3565/3070/2575/2080/1585/1090/595 T2.5, T3, T4

Select the appropriate solder powder particle size based on your process requirements and product type

Lead-Based Alloy Type	Melting Point (℃)	Soldering Temp (℃)
Sn62Pb36Ag2	179	200-225
Sn62.8Pb36.8Ag0.4	181	200-225
Sn63Pb36.9Ag0.1	181	200-225
6337（Sn63Pb37）	183	200-225
6040（Sn60Pb40）	183-191	210-235
5545（Sn55Pb45）	183-203	225-245
5050（Sn50Pb50）	183-215	235-255
4555（Sn45Pb55）	183-227	245-265
4060（Sn40Pb60）	183-238	255-280
3565（Sn35Pb65）	183-248	265-290
3070（Sn30Pb70）	183-258	280-300
2575（Sn25Pb75）	183-260	280-300
2080（Sn20Pb80）	183-279	300-320
1585（Sn15Pb85）	Approx. 183-285/295	305-335
1090（Sn10Pb90）	268-301	320-340
595（Sn5Pb95）	300-314	335-355
Sn55/Pb41.5/Bi3/Sb0.5	-	-
Sn52/Pb42.5/Bi5/Sb0.5	170	190-220
Sn48/Pb48.6/Bi3/Sb0.4	-	-
Sn43/Pb49/Bi7/Sb1	-	-
Sn38/Pb52.5/Bi8/Sb1.5	173	190-220
Sn43Pb43Bi14	144-163	185-200
Sn10Pb88Ag2	268-299	320-340
Sn5Pb92.5Ag2.5	287-296	315-335
Sn5Pb93.5Ag1.5	296-301	320-340

*Swipe table left/right to view all parameters

Model	Application	Halogen	Type	Alloy Powder
Halogen-Free Lead-Free High-Temp 8MQP/5RQ	High activity, highest solder climb for QFN/DFN (near 100%)	Single <900ppm/Dual <1500ppm ROL1	Rosin Type	Alloy powders: 0307/105/305 T3, T4, T5
Halogen-Free Lead-Free High-Temp 8MTSP/5RTS	High activity, good solder climb for QFN/DFN (70%-90%); low transparent residue;	<500ppm ROL0	Rosin Type	Alloy powders: 0307/105/305 T3, T4, T5
Halogen-Free Lead-Free High-Temp 8MNTTP/5RNTT	Excellent for high-precision applications: communication, tablets, laptops, phones, Bluetooth, fingerprint locks; low transparent residue;	100~200ppm ROL0	Rosin Type	Alloy powders: 0307/105/305/00507BN/00507B2N T3, T4, T5
Zero-Halogen REACH Compliant 8M9P/5RR	Zero halogen, ultra-low void rate, for automotive lighting and other low-void high-thermal conductivity applications; low transparent residue;	0ppm ROL0	Rosin Type	Alloy powders: 0307/105/305 T3, T4, T5
Halogen-Free Lead-Free High-Temp 8MA	For general applications: lighting LEDs, standard and larger pitch components; low transparent residue;	<900ppm ROL1	Rosin Type	Alloy powders: 0307/0107/SC07/00507BN/00507B2N T3, T4
Standard Halogen-Free Mid/Low Temp 8M/2R (8MTHL/2RTHL)	For mid/low temp applications: temperature-sensitive LEDs, oscillators, copper wire lights, transparent displays;	800~900ppm ROL1	Rosin Type	Alloy powders: Sn64Bi35Ag1/Sn64.7Bi35Ag0.3/Sn42Bi58/Sn42Bi57Ag1/Sn49.6Bi48.5Ag1Cu0.9/LT32S T2.5, T3, T4, T5
Zero-Halogen Lead-Free Ultra-Low Temp 5RG	For ultra-low temperature sensitive special applications;	0ppm ROL0	Rosin Type	Alloy powders: In52Sn48/In40.2Sn20.7Bi39.1 T5, T6, T7
Water-Washable Lead-Free High-Temp 8MW1P/5RW1	Post-solder residue washable with water, low cost;	ORH1	Water-Washable	Alloy powders: SC07/0307/105/305 T3, T4
Water-Washable Lead-Free Low-Temp 8MW1AP/5RW1A	No residue on aluminum nickel-plated heat sink fins, low cost;	ORH1	Water-Washable	Alloy powders: Sn42Bi58 T2.5, T3, T4
Laser Lead-Free High-Temp 5RLJ	Laser soldering, excellent performance, no solder balls;	<500ppm ROL0	Rosin Type	Alloy powders: 0307/105/305/00507BN/00507B2N T3, T4, T5, T6, T7
Laser Lead-Free Mid/Low Temp 5RLJB	Laser soldering, excellent performance, no solder balls;	<500ppm ROL0	Rosin Type	Alloy powders: Sn64Bi35Ag1/Sn64.7Bi35Ag0.3/Sn42Bi58/Sn42Bi57Ag1/Sn49.6Bi48.5Ag1Cu0.9/LT32/LT32S T3, T4, T5, T6, T7
SS/Aluminum Lead-Free Paste 8MW5/5RW5	For stainless steel and aluminum soldering, water-washable	ORH1	Water-Washable	Alloy powders: SC07/0307/105/305/Sn64Bi35Ag1/Sn64.7Bi35Ag0.3/Sn42Bi58 T3, T4

Select the appropriate solder powder particle size based on your process requirements and product type

Lead-Free Alloy Type	Melting Point (℃)	Soldering Temp (℃)
Sn96Ag4	221-226	240-260
Sn97Ag3	221-224	240-260
305（Sn96.5Ag3Cu0.5）	217	235-255
105（Sn98.5Ag1Cu0.5）	221-227	240-260
0307（Sn99Ag0.3Cu0.7）	221-227	240-260
0107（Sn99.2Ag0.1Cu0.7）	221-227	240-260
00507BN（SnCu0.7Ag0.05BiNi）	221-227	240-260
00507B2N（SnCu0.7Ag0.05Bi2Ni）	221-227	240-260
99307（Sn99.3Cu0.7）	221-227	240-260
SC07NG（Sn99.3Cu0.7 (Ni0.04-0.07, Ge0.008-0.01)）	227	240-260
Sn90Sb10	253.3-255.7	275-290
Sn95Sb5	245	265-285
Sn69.5Bi30Cu0.5	149-186	205-225
64351（Sn64Bi35Ag1）	151-172	195-220
6473503（Sn64.7Bi35Ag0.3）	151-172	195-220
4258（Sn42Bi58）	138	160-185
Sn42Bi57Ag1	139/140	160-185
High Reliability Lead-Free Low-Temp LT32/LT32S	143-144	160-190
In52Sn48	118	140-160
In40.2Sn20.7Bi39.1	65-89	110-130

What Problem Are You Trying to Solve?

Targeted solutions for various soldering challenges

Cold Solder

Solder Bridges

Solder Balls

Tombstoning

Voids

Solder Climb

Other soldering issues? Consult our technical engineers now

Free Technical Consultation

Core Product Features

18 years of meticulous craftsmanship, every item is a commitment to quality.

1 The solder joints are strong, bright and full.

With 18 years of R&D and production experience, we have mastered modern process formulas to ensure that the solder paste is highly compatible with the products being soldered, resulting in strong, bright, uniform, and full solder joints without solder beads.

2 Low residue, no rinsing required

We developed and formulated ROL0 no-clean environmentally friendly flux, which leaves little residue after soldering, has high insulation resistance, leaves the board surface clean and free of corrosion, and forms a protective layer to prevent the substrate from oxidizing again.

3 High wettability and good solderability

The optimized flux formula and alloying trace element addition scheme, combined with special processes, make the solder paste highly active, completely wet the pads, achieve a high solder climb height, and significantly eliminate phenomena such as cold solder joints, misalignment, tombstoning, solder balls, and voids during the soldering process.

4 Stable printing and good release properties

The tin powder particles are round and uniform in size, with no trailing, sticking, or splashing during printing. The molding process is free from collapse, sticking, or sharpening. The viscosity changes little during continuous printing, and the powder does not dry out. It maintains good adhesion and does not fly away.

5 Cleans with water; achieves high cleanliness (applicable only to water-washed solder paste).

Solder residue can be dissolved and washed away with pure water (deionized water), leaving no residue after cleaning. It achieves a high level of cleanliness, enabling excellent ICT testing performance without damaging electronic components. The production and cleaning processes are pollution-free, meeting environmental protection requirements. Cleaning speed is fast, much faster than other types of solder paste.

Usage Instructions

Standard operation for optimal performance

Storage Conditions

Store at 0-10℃, shelf life 6 months

Temperature Recovery

Take out 2-4 hours before use to reach room temperature

Mixing Method

Mix thoroughly for 1-3 minutes until uniform

Precautions

Seal unused paste separately and refrigerate

Company Certifications & Advantages

Multiple authoritative certifications, quality you can trust

ISO9001/ISO14001

Quality Management System

SGS Certified

ROHS Compliance

REACH Certified

EU Environmental Certification

Own Brand

18 Years Factory Brand

17+ Certifications

18+

Years Experience

5000+

Clients

Inspection Steps

ISO

Quality Cert.

Professional R&D Team · Custom Solutions

Professional technical team provides customized formulations based on customer process requirements. Solder alloy, flux activity level, cleaning method, and special properties can all be customized. We also provide product selection advice, optimize soldering processes, and offer suitable solutions to improve customers' first-pass yield.

Strict Quality Control · Consistent Performance

5000m² factory with 96 production and testing equipment. ISO9001/ISO14001 certified and strictly implemented. 21 inspection procedures ensure stable solder performance. Raw material incoming, in-process, and finished product testing ensure compliance. All eco-friendly products pass SGS testing, meeting RoHS, halogen-free, and REACH (SVHC) standards.

18 Years Experience · Superior Soldering Results

18 years focused on solder paste R&D and production. Using high-purity virgin tin, optimized flux formulas, and trace element alloy additions with special processes. Our solder paste precisely matches assembly scenarios, providing fast, high solder climb with strong, bright, full joints. No cold solder, bridging, solder balls, tombstoning, voids, stringing, slumping or drying issues. Direct manufacturer with no middlemen, offering better cost-performance.

Real-time Technical Support · On-site Service

Pre-sales consultation and post-sales technical support provided by senior engineers with one-on-one service. Free on-site debugging and product matching. On-site problem solving. Solutions provided within 24 hours, issues resolved within 72 hours. Free replacement for quality issues.