JIAJINYUAN no-clean lead-free solder wire is produced by melting high-purity lead-free refined tin and electrolytic copper at the required ratio, refining to remove impurities, casting into tin rods, injecting rosin flux under hydraulic pressure, and drawing to the customer-required wire diameter.
The alloy composition covers series such as Sn99.3Cu0.7, Sn-Ag0.3-Cu0.7 and Sn-Ag3.0-Cu0.5. Flux is uniformly and continuously filled into the center of the tin alloy; rosin content, wire diameter and packaging can all be customized to the customer's soldering process.
The core value of the no-clean lead-free solder wire lies in extremely low, transparent post-soldering residue, low ionic contamination and high insulation resistance. It is widely used in no-clean processes for consumer electronics, household appliances, instrumentation and automotive electronics, eliminating downstream cleaning steps and saving cost.
Across the series, lead content is strictly controlled below 100 ppm; it passes authoritative SGS testing and fully meets EU RoHS, REACH (SVHC), halogen-free, PAHs and phthalate international environmental directives.