Name: LFP-2R-64351 Halogen-Free Lead-Free Mid- and Low-Temperature Solder Paste
Brand: JJY Tinsolder

*Some tables can be scrolled horizontally to view parameters

Model	Application	Halogen	Type	Alloy Powder
Leaded Solder Paste 8MN/7RN	High activity, ideal for QFN/DFN high-climbing scenarios; bright solder joints;	600~750ppm ROL1	Rosin Type	Alloy powder such as 62362/62836804/6337/6040 T2.5, T3, T4
Leaded Solder Paste 7M/7R	Suitable for high-precision and standard scenarios such as communications, tablets, laptops, and phones; bright solder joints;	250~400ppm ROL0	Rosin Type	Alloy powder such as 62362/62836804/6337/6040/5545 T2.5, T3, T4, T5
Leaded Solder Paste 7MTWT/7RTWT	Suitable for high-precision and standard scenarios such as communications, tablets, laptops, and phones; withstands long placement after printing without solder blackening or solder balls; bright solder joints;	<500ppm ROL0	Rosin Type	Alloy powder such as 62362/62836804/6337/6040/5545/55X/50X/45X/40X/434314 T2.5, T3, T4, T5
Leaded Solder Paste 7MTHT/7RTHT	Dedicated to outdoor display scenarios; stable viscosity and long stencil life (a standout advantage); bright solder joints; concentrated rosin residue (no screen mottling, even ink color)	250~400ppm ROL0	Rosin Type	Alloy powder such as 62362/62836804/6337/6040 T2.5, T3, T4, T5
Leaded Solder Paste 7MH/7RH	General purpose, transparent and bright residue; especially suitable for white boards such as LED, with strong drying resistance and continuous printing for over 16 hours; solder paste can be stored at room temperature; withstands long placement after printing without solder spattering, especially free of solder balls	250~400ppm ROL0	Rosin Type	Alloy powder such as 62362/62836804/6337/6040/5545/55X/50X/45X/40X/434314 T2.5, T3, T4
Leaded Solder Paste 7ML/7RL	Transparent and bright residue; especially suitable for white boards such as LED, with slightly lower drying resistance, so best for fast-consumption scenarios; can also be used for grooved embedded heat sinks to achieve a low void rate	250~400ppm ROL0	Rosin Type	Alloy powder such as 62362/62836804/6337/6040/5545/55X/50X/45X/40X/434314 T2.5, T3, T4
Leaded Solder Paste 7MF/7RF	Dedicated to silver pads such as silver-plated electronic ceramic components, photovoltaic cells, and light-show glass screens; does not corrode silver pads or cause blackening;	150~350ppm ROL0	Rosin Type	Alloy powder such as 62362/62836804/6337/6040/5545 T2.5, T3, T4
Water-Wash Leaded Solder Paste 3MW9/3RW9	Water-washable, lower cost, excellent printing formability; also suitable for energy-storage battery lead grid soldering;	ORH1	Water-Wash Type	Alloy powder such as 62362/62836804/6337/6040/5545/5050/4555/4060/3565/3070/2575/2080/1585/1090/595 T2.5, T3, T4
Leaded Solder Paste for Stainless Steel & Aluminum 3MW5/3RW5	For soldering stainless steel and aluminum; can be cleaned with water	ORH1	Water-Wash Type	Alloy powder such as 62362/62836804/6337/6040/5545/5050/4555/4060/3565/3070/2575/2080/1585/1090/595 T2.5, T3, T4

Select the appropriate solder powder particle size based on your process requirements and product type

Leaded Alloy Type	Melting Point (°C)	Soldering Temp. (°C)	T2.5	T3	T4	T4.5	T5	T6	T7
Sn62Pb36Ag2	179	200-225		✔	✔		✔	✔	✔
Sn62.8Pb36.8Ag0.4	181	200-225		✔	✔		✔	✔	✔
Sn63Pb36.9Ag0.1	181	200-225		✔	✔
6337 (Sn63Pb37)	183	200-225	✔	✔	✔	✔	✔	✔	✔
6040 (Sn60Pb40)	183-191	210-235	✔	✔	✔
5545 (Sn55Pb45)	183-203	225-245	✔	✔	✔
5050 (Sn50Pb50)	183-215	235-255	✔	✔	✔
4555 (Sn45Pb55)	183-227	245-265	✔	✔	✔
4060 (Sn40Pb60)	183-238	255-280	✔	✔	✔
3565 (Sn35Pb65)	183-248	265-290	✔	✔	✔
3070 (Sn30Pb70)	183-258	280-300	✔	✔	✔
2575 (Sn25Pb75)	183-260	280-300	✔	✔	✔
2080 (Sn20Pb80)	183-279	300-320	✔	✔	✔
1585（Sn15Pb85）	approx. 183-285/295	305-335	✔	✔	✔
1090（Sn10Pb90）	268-301	320-340	✔	✔	✔
595（Sn5Pb95）	300-314	335-355	✔	✔	✔
Sn55/Pb41.5/Bi3/Sb0.5	-	-	✔
Sn52/Pb42.5/Bi5/Sb0.5	170	190-220	✔
Sn48/Pb48.6/Bi3/Sb0.4	-	-	✔
Sn43/Pb49/Bi7/Sb1	-	-	✔
Sn38/Pb52.5/Bi8/Sb1.5	173	190-220	✔
Sn43Pb43Bi14	144-163	185-200	✔	✔	✔
Sn10Pb88Ag2	268-299	320-340		✔	✔
Sn5Pb92.5Ag2.5	287-296	315-335		✔	✔
Sn5Pb93.5Ag1.5	296-301	320-340		✔	✔

*Some tables can be scrolled horizontally to view parameters

Model	Application	Halogen	Type	Alloy Powder
Halogen-Free Lead-Free High-Temp Solder Paste 8MQP/5RQ	High activity, highest solder climbing (close to 100%) for QFN/DFN and similar applications	Single <900ppm / Dual <1500ppm ROL1	Rosin Type	Alloy powder such as 0307/105/305 T3, T4, T5
Halogen-Free Lead-Free High-Temp Solder Paste 8MTSP/5RTS	Higher activity, good solder climbing (70%-90%) for QFN/DFN and similar applications; low, bright residue;	<500ppm ROL0	Rosin Type	Alloy powder such as 0307/105/305 T3, T4, T5
Halogen-Free Lead-Free High-Temp Solder Paste 8MNTTP/5RNTT	Especially suitable for high-precision applications such as communications, tablets, laptops, mobile phones, Bluetooth, and fingerprint locks; low, transparent residue;	100~200ppm ROL0	Rosin Type	Alloy powder such as 0307/105/305/00507BN/00507B2N T3, T4, T5
Zero-Halogen & REACH Lead-Free High-Temp 8M9P/5RR	Zero halogen, extremely low void rate, suitable for low-void, high-thermal-conductivity applications such as automotive lighting; low, transparent residue;	0ppm ROL0	Rosin Type	Alloy powder such as 0307/105/305 T3, T4, T5
Halogen-Free Lead-Free High-Temp Solder Paste 8MA	Suitable for general and wider-pitch standard scenarios such as lighting LEDs; low, transparent residue;	<900ppm ROL1	Rosin Type	0307/0107/SC07/00507BN/00507B2N alloy powder T3, T4
Standard Halogen-Free Lead-Free Medium-Temp & Low-Temp Solder Paste 8M/2R (8MTHL/2RTHL)	For lead-free medium-temp and low-temp scenarios that only tolerate medium/low temperatures, such as LEDs, crystal oscillators, copper wire lights, and transparent screens;	800~900ppm ROL1	Rosin Type	Sn64Bi35Ag1/Sn64.7Bi35Ag0.3/Sn42Bi58/Sn42Bi57Ag1/Sn49.6Bi48.5Ag1Cu0.9/high-reliability LT32S alloy powder T2.5, T3, T4, T5
Zero-Halogen Lead-Free Ultra-Low-Temp Solder Paste 5RG	For special scenarios that only tolerate ultra-low temperatures;	0ppm ROL0	Rosin Type	In52Sn48/In40.2Sn20.7Bi39.1 alloy powder T5, T6, T7
Water-Wash Lead-Free High-Temp Solder Paste 8MW1P/5RW1	Post-solder residue can be cleaned with water; low cost;	ORH1	Water-Wash Type	SC07/0307/105/305 alloy powder T3, T4
Water-Wash Lead-Free Low-Temp Solder Paste 8MW1AP/5RW1A	Leaves no traces after soldering on nickel-plated aluminum heat sink fins; low cost;	ORH1	Water-Wash Type	Alloy powder such as Sn42Bi58 T2.5, T3, T4
Laser Lead-Free High-Temp Solder Paste 5RLJ	Laser-heated soldering with superior performance and no solder balls; compatible with pneumatic, screw, and jet valve dispensing.	<500ppm ROL0	Rosin Type	0307/105/305/00507BN/00507B2N alloy powder T3, T4, T5, T6, T7
Laser Lead-Free Medium/Low-Temp Solder Paste 5RLJB	Laser-heated soldering with superior performance and no solder balls; compatible with pneumatic, screw, and jet valve dispensing.	<500ppm ROL0	Rosin Type	Sn64Bi35Ag1/Sn64.7Bi35Ag0.3/Sn42Bi58/Sn42Bi57Ag1/Sn49.6Bi48.5Ag1Cu0.9/high-reliability LT32 and LT32S alloy powder T3, T4, T5, T6, T7
Lead-Free Solder Paste for Stainless Steel & Aluminum 8MW5/5RW5	For soldering stainless steel and aluminum; can be cleaned with water	ORH1	Water-Wash Type	SC07/0307/105/305/Sn64Bi35Ag1/Sn64.7Bi35Ag0.3/Sn42Bi58 alloy powder T3, T4

Select the appropriate solder powder particle size based on your process requirements and product type

Lead-Free Solder Paste Alloy Type	Melting Point (°C)	Soldering Temp. (°C)	T2.5	T3	T4	T4.5	T5	T6	T7
Sn96Ag4	221-226	240-260		✔	✔		✔
Sn97Ag3	221-224	240-260		✔	✔		✔
305（Sn96.5Ag3Cu0.5）	217	235-255		✔	✔	✔	✔	✔	✔
105（Sn98.5Ag1Cu0.5）	221-227	240-260		✔	✔
0307（Sn99Ag0.3Cu0.7）	221-227	240-260		✔	✔	✔	✔	✔	✔
0107（Sn99.2Ag0.1Cu0.7）	221-227	240-260		✔	✔	✔	✔	✔	✔
00507BN（SnCu0.7Ag0.05BiNi）	221-227	240-260		✔	✔
00507B2N（SnCu0.7Ag0.05Bi2Ni）	221-227	240-260		✔	✔
99307（Sn99.3Cu0.7）	221-227	240-260		✔	✔
SC07NG（Sn99.3Cu0.7 (Ni0.04-0.07, Ge0.008-0.01)）	227	240-260		✔	✔
Sn90Sb10	253.3-255.7	275-290		✔	✔		✔	✔
Sn95Sb5	245	265-285		✔	✔		✔	✔
Sn69.5Bi30Cu0.5	149-186	205-225		✔	✔
64351（Sn64Bi35Ag1）	151-172	195-220		✔	✔		✔	✔	✔
6473503（Sn64.7Bi35Ag0.3）	151-172	195-220		✔	✔
4258（Sn42Bi58）	138	160-185	✔	✔	✔		✔	✔	✔
Sn42Bi57Ag1	139/140	160-185		✔	✔		✔	✔	✔
High-Reliability Lead-Free Low-Temp LT32/LT32S	143-144	160-190		✔	✔	✔	✔	✔	✔
In52Sn48	118	140-160					✔	✔	✔
In40.2Sn20.7Bi39.1	65-89	110-130					✔	✔	✔

Name	Parameters
Series	General halogen-free lead-free mid-temperature solder paste, halogen-free lead-free low-temperature solder paste 8M/2R (8MTHL/2RTHL)
Applications	For lead-free mid-temperature and lead-free low-temperature scenarios such as LEDs, crystal oscillators, copper-wire lamps and transparent screens that can only withstand mid/low temperatures
Halogen	800~900ppm ROL1
Flux Type	Rosin type
Alloy Powder	Sn64Bi35Ag1/Sn64.7Bi35Ag0.3/Sn42Bi58/Sn42Bi57Ag1/Sn49.6Bi48.5Ag1Cu0.9/high-reliability LT325 alloy powders, T2.5, T3, T4, T5

Item	Specification	Reference Standard
Viscosity	150±20Pa·S	IPC-TM-650
Solder Ball	PASS	IPC-TM-650
Printing Durability	5-8 hours
Flux Content	10±0.5%
Flux Type	ROL1	IPC J-STD-004
Halogen Content	<500ppm	IPC J-STD-004
Copper Mirror Corrosion Test	PASS	IPC-TM-650
Surface Insulation Resistance - Initial	1.0×10¹³Ω	IPC-TM-650
Surface Insulation Resistance - After Humidity	1.0×10¹²Ω	IPC-TM-650
Spread Rate	>90%	JIS-Z-3197(1999)
Tack Life	2-4 hours
Solder Pit Test	Pass	IPC-TM-650
Shelf Life (2-10°C)	6 months
Printability	Good stencil printability for apertures of T3: ≥0.5mm / T4: ≥0.3mm

Solder Powder	Main Components (%)			Impurity Content (%)
Alloy	Sn	Bi	Ag	Fe	Pb	Al	Cd	Ni	Sb	Zn	Cu	As	Hg
Sn64Bi35Ag1	Rem.	35±1	1±0.1	≤0.015	≤0.01	≤0.001	≤0.001	≤0.010	≤0.040	≤0.001	≤0.020	≤0.000	≤0.002

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LFP-2R-64351 Halogen-Free Lead-Free Mid- and Low-Temperature Solder Paste

Specifications

Product Introduction

What Makes Our Solder Paste Different

Excellent Printing & Soldering

Eco-Friendly, Halogen-Free, No-Clean

Stable Batches, Worry-Free Use

Technical Support That Solves Problems

Core Product Showcase

Lead-Free Eco Solder Paste

Low-Temperature Solder Paste

Classic Leaded Solder Paste

What Problem Do You Want to Solve?

Cold & False Joints

Solder Bridging & Shorts

Solder Ball Spatter

Shift & Tombstoning

Voids & Porosity

Full Solder Climbing

Core Product Features

1 Strong, Bright, Full Solder Joints

2 Low Residue, No-Clean

3 Strong Wetting, Excellent Solder Climbing

4 Stable Printing, Good Release

5 Water-Washable with High Cleanliness (water-wash solder paste only)

Instructions for Use

Storage

Warming Up

Stirring

Precautions

Enterprise Certifications & Advantages

ISO9001/ISO14001

SGS Certified

REACH Certified

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