To ensure soldering quality, choosing the right Solder paste for your product is very important. How should you choose? Is there any basis? Shenzhen JJY, a Solder paste manufacturer, based on 12 years of R&D in the soldering industry, offers some reasonable suggestions for partners:

Select Solder Paste based on the cleanliness of the printed PCB, the surface oxidation of electronic components, and PCB assembly density.

Solder paste types include: no-clean solder paste, organic-solvent-cleanable solder paste, and water-soluble solder paste. The no-clean process uses halogen-containing, non-corrosive no-clean solder paste. The organic solvent cleaning process uses organic-solvent-cleanable solder paste. The water cleaning process uses water-soluble solder paste.

The activity type of solder paste is selected based on the oxidation degree of circuit boards and electronic components. Aerospace products can use R-grade. Circuit boards that have been stored for a long time and whose surfaces are prone to oxidation should use RA-grade, which requires cleaning after soldering.

The particle size of the alloy powder should be selected based on the assembly density of the circuit board. There are four particle size classifications; finer powders are generally in the range of 20 to 45 nanometers.

Shenzhen JJY Industrial Technology Co., LTD has focused on Soldering R&D and sales for 12 years, providing customers with a complete set of Electronic Soldering solutions. The offerings include solder (Solder Wire), Solder paste, and R&D for tin bars, tin sheets, tin foils, and electronic product semiconductors, etc.