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Humidity control in the immersion silver board welding workshop is a key process measure to suppress silver layer migration. When the ambient relative humidity is higher than 60%RH for a long time, an electrolyte film is easily formed on the surface of the immersion silver board, which accelerates the electrochemical migration of silver ions between the pad and the edge of the solder mask. Actual measurements on the Jia Jinyuan production line show that stably controlling the humidity within the range of 40% to 55%RH can reduce the silver migration failure rate by 72%. Combined with nitrogen-protected reflow soldering and matching the activity level of the solder paste, it can significantly improve the long-term reliability of immersion silver board welding.
Published: 2016-11-22To address the unstable yield of 0.4mm and below fine-pitch solder paste printing, this paper, based on 20 years of measured data from the Jiajinyuan production line, clarifies that the stencil aperture ratio needs to be dynamically adjusted within the range of 75% to 85%. Among them, 82% is recommended for QFN0.4mm, and it must be reduced to 76% for BGA0.3mm. It is also pointed out that an aperture ratio deviation exceeding ±3% will cause solder bridging or insufficient solder. The core lies in balancing the solder paste release rate and the stencil demolding capability.
Published: 2016-11-09For the export of 5G equipment solder, a full set of inspection documents compliant with IEC 61190-1-1, JIS Z 3284 and RoHS 2.0 requirements must be provided simultaneously, covering solder composition reports, melting point curves, wettability tests, halogen content, intermetallic compound thickness and tin whisker growth assessment. All export batches of Jia Jinyuan are subject to full-item third-party testing by SGS or CTI in accordance with customer-specified standards, with original data attached.
Published: 2016-11-08
Wave soldering bar selection must closely align with actual production line performance. Sn99.3Cu0.7 solder bars are low-cost with acceptable oxidation resistance, but have weak wetting force. Silver-containing alloys improve fluidity and solder joint strength, but significantly increase costs. The differences between the two are particularly prominent in high-temperature continuous operation, fine-pitch through-hole soldering, and lead-free compatibility. Engineers must comprehensively determine the applicable boundaries of SnCu solders based on board thickness, component density, and rework rate.
Published: 2016-10-30When manually soldering wiring harness terminals, using large-size solder wire of 1.6mm or above with a soldering iron temperature of 350℃±10℃ can achieve full-formed solder joints at one time without cold soldering, sharp tips or dry joints, significantly improving the electrical connection reliability of the wiring harness under vibration conditions. This process has been batch verified on multiple new energy vehicle high-voltage wiring harness production lines of JJY.
Published: 2016-10-29Continuous oxidation on the surface of molten solder during wave soldering is the main cause of solder dross formation. High temperatures, air exposure, flux residues, and agitation of the solder bath collectively accelerate the rupture and agglomeration of the oxide film, leading to increased solder dross volume, higher solder consumption, and more frequent equipment maintenance. Field measurements on Jia Jinyuan production lines show that when the increase in solder dross per shift exceeds 1.2kg, solder costs rise by 8.6% year-on-year. Timely oxygen control and solder surface cleaning can reduce solder dross generation by more than 35%.
Published: 2016-09-07Adjusting solder paste process parameters under a nitrogen reflow environment can significantly reduce the solder paste void rate. It is necessary to simultaneously optimize the heating slope, peak temperature and atmospheric oxygen content of reflow soldering, and combine stencil aperture design with squeegee pressure to control printing accuracy, so as to avoid cold solder joints and poor wetting caused by uneven nitrogen displacement or hindered flux volatilization.
Published: 2016-08-11High tensile strength of connector solder joints directly improves the reliability of the whole machine. Jiajinyuan connector solder, by optimizing the ratio of tin-silver-copper and active flux components, achieves an average tensile strength ≥8.2N at a conventional reflow peak temperature of 235℃, with no solder joint detachment, no cold solder joint, and no solder joint cracks after 100 insertion and removal cycles. It is especially suitable for industrial control and automotive electronics production lines under high-frequency vibration conditions.
Published: 2016-08-02
The poor wettability of lead-free solder paste requires simultaneous examination of both material and process pathways. The activity of the flux, metal content, and particle distribution in the solder paste directly affect its wetting and spreading ability, while process variables such as printing parameters, reflow profile, and PCB surface condition cannot be ignored. In actual production lines, approximately 68% of wetting defects are jointly caused by improper stencil aperture design and low reflow peak temperature.
Published: 2016-07-19AOI inspection after SMT reflow soldering can efficiently identify appearance soldering defects such as solder joint bridging, tombstoning, solder beads, and misalignment, greatly reducing the missed inspection rate of manual visual inspection. With a pixel accuracy of 0.015mm and the capability of multi-angle light source switching, Jia Jinyuan's AOI inspection equipment stably controls the false alarm rate within 1.2% for solder joint judgment of components below 0603.
Published: 2016-07-14Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.