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The solder for industrial control motherboards must maintain zero solder joint cracking under wide temperature range, high vibration and long-cycle operating conditions. Jiayuan's high-reliability halogen-free formula, by optimizing the SnAgCu alloy ratio and active flux system, keeps the IMC layer thickness stably at 3.2±0.4μm after 500 cycles of thermal shock from -40℃ to 85℃, completely avoids electromigration failure caused by halogen corrosion, and significantly improves the service life of industrial control motherboard solder in harsh scenarios such as rail transit and power monitoring.
Published: 2020-07-01In fine-pitch IC reflow soldering, the metal content, particle size distribution and flux activity of solder paste must match pad pitches below 0.4mm. Yield fluctuations exceeding 30% in reflow soldering often stem from uneven solder paste collapse or insufficient wetting after reflow. For Jiajinyuan JH-812A, the measured bridging rate on 0.35mm pitch QFN is below 0.12%. Its 25μm median particle size and 55% metal content work synergistically to suppress printing misalignment and reflow splattering.
Published: 2020-06-11
An intelligent vehicle is built on the basis of a conventional vehicle by adding devices such as sensors, controllers, and actuators, and realizes intelligent information exchange with people, other vehicles, and roads through an onboard sensing system and information terminals.
Published: 2020-06-09
After solder wire oxidizes, poor soldering wetting and frequent solder breakage during wire drawing occur. Production lines commonly use fine sandpaper for light grinding followed by wiping with anhydrous ethanol to quickly restore the active surface. Storing the solder wire in a constant-temperature moisture-proof cabinet can significantly delay the oxidation process.
Published: 2020-06-04This paper focuses on the practical application of sensor solders in the SMT process of electronic sensor PCBs, covering the solder selection logic for common sensors such as thermal sensors, pressure sensors, and acceleration sensors, key points for reflow profile adaptation, and production line-level troubleshooting paths for cold solder joints and missed solder joints. It emphasizes the differentiated performance of two sensor solders, Jiajinyuan SN100C and SN63Pb37, in terms of wettability, residue activity, and thermal shock resistance.
Published: 2020-05-08Standardized operations for solder paste replenishment and stirring in high-speed SMT printing production lines directly determine printing yield and equipment utilization. Based on the actual adaptability of Jiajinyuan solder paste at squeegee speeds above 300mm/s, this article details key control points such as replenishment frequency, temperature control window, and manual/automatic stirring parameter settings. All operations have been verified through 72 consecutive hours of production line testing.
Published: 2020-04-09To address whether solder paste can be reused after extended downtime on SMT production lines, this paper proposes criteria for determining the usability of downtime solder paste based on 20 years of measured production line data. It clarifies the critical points of solder paste activity decay under different temperature and humidity conditions, directly guiding on-site engineers to quickly decide whether the downtime solder paste can continue to be used or must be scrapped.
Published: 2020-04-09Syringe dispensing solder paste and stencil printing solder paste are often used interchangeably in actual production lines, but differences in their rheological properties can easily cause issues such as needle clogging, stringing, and printing misalignment. Based on JJY's 20 years of on-site SMT experience, this paper focuses on the interchangeability boundaries between dispensing solder paste and printing solder paste, key points for thixotropic index matching, and a coordinated improvement plan for needle clogging based on the three core elements of temperature control, pressure, and cleaning.
Published: 2020-03-22
The tightness of the solder wire winding directly affects the smoothness of solder wire feeding in automatic solder feeders. Excessive tightness easily causes drawing breakage and jamming alarms, while excessive looseness leads to wire jumping, deviation, and even solder breakage. Production line tests show that a winding tension deviation exceeding 15% significantly increases the nozzle clogging rate.
Published: 2020-03-21Solder OEM contract manufacturing services focus on the full-category private label production of solder paste, solder wire, and solder bar, supporting in-depth customization from alloy formulation and flux activity control to branded packaging. Relying on 20 years of measured data from SMT production lines, JJY continuously optimizes printability and reflow stability to ensure mass production delivery of zero clogging, low void rate, and strong wettability for clients' own brands in high-speed placement machines and nitrogen reflow ovens.
Published: 2020-03-11Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.