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Here you can find knowledge about Solder Paste Storage, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
Soldering of miniature components imposes stringent requirements on solder paste particle size and rheological properties. Fine-particle solder paste, with its 4-6μm spherical particles, viscosity of 320±30Pa·s at 25±2℃, and compatibility with 120-mesh stencils, significantly improves printing accuracy and solder joint consistency in the mounting of miniature components such as 0201 and 01005.
Published: 2026-08-27
The post-soldering corrosion risk of SMT solder paste is highly dependent on the chemical composition of the solder paste flux. Different systems, such as rosin-based, water-soluble, and no-clean, exhibit significant differences in ionic residue, halogen content, and activation temperature. The probability of post-soldering corrosion increases notably when the chloride ion concentration exceeds 0.5μg/cm2, the softening point of rosin resin is below 120℃, or the pKa value of organic acids is less than 4.2.
Published: 2026-08-27
For the selection of solder wire and solder bar alloys for equipment operating in high-temperature environments, this article directly addresses the real pain points of SMT production lines. Focusing on five core issues: melting point matching, thermal fatigue resistance, wettability degradation, flux residue corrosion, and oxide film suppression, it provides immediately actionable troubleshooting paths and process adjustment measures. All solutions are validated by 20 years of on-site commissioning data, with no theoretical explanations—only practical guidance.
Published: 2026-08-27
The metal content of solder paste directly affects the forming stability of solder joint thickness after SMT printing. For every 1% decrease in metal content, the solder joint thickness reduces by an average of 3.2～4.5μm. Excessively high metal content easily leads to collapse and bridging, while excessively low metal content causes cold solder joints and solder beads. In actual production lines, the solder joint thickness target needs to be dynamically matched in combination with squeegee pressure, stencil aperture ratio, and reflow parameters.
Published: 2026-08-27
A Practical Soldering Guide for Communication Motherboards for SMT Engineers, focusing on the material selection logic of solder paste and solder bars in high-frequency and high-speed signal scenarios. It covers hard parameters such as storage temperature and humidity, metal content, viscosity, particle size distribution, and reflow peak temperature. Combined with the stringent requirements for solder joint wettability and residual ion contamination of 0.3mm fine-pitch BGA and 10Gbps SerDes routing, it provides the specific application boundaries of IPC-J-STD-005 certified solder paste and Sn96.5Ag3.0Cu0.5 solder bars.
Published: 2026-08-27
Solder paste wettability is a key indicator affecting SMT soldering yield. Based on real production line failure cases, this paper outlines rapid SMT incoming inspection judgment methods corresponding to 5 typical poor wettability phenomena, covering root cause identification and on-site handling steps for common defects such as exposed copper on pads, cold solder joints, and tombstoning, providing process and procurement personnel with a ready-to-use practical path for solder paste wettability and SMT incoming inspection.
Published: 2026-08-27
Domestic solder paste replacing imported ones requires systematic verification of key points such as printing adaptability, reflow wettability, and solder joint reliability. Focus should be placed on changes in solder paste viscosity, differences in flux activity, and batch stability to avoid mass production anomalies such as cold solder joints, tombstoning, and solder beads caused by blind replacement. The verification of domestic solder paste replacement must run through the entire trial production cycle.
Published: 2026-08-27
When excessive voids occur in SMT soldering, simultaneously investigate the solder paste metal content, flux volatilization curve, and actual temperature deviations in each reflow oven zone. Focus on verifying whether the preheat ramp exceeds 2°C/s, whether the peak temperature is below 235°C or above 245°C, and whether the time above liquidus is less than 60 seconds or exceeds 90 seconds.
Published: 2026-08-27
After solder paste is returned to room temperature, solder balls and spattering are likely to occur. The main causes are uneven volatilization of flux due to temperature difference, aggravated oxidation of metal powder, and sudden viscosity change. Standardized operation requires strict control of temperature, standing, stirring, and management of the time limit after opening, to avoid repeated freezing and thawing and excessive exposure time.
Published: 2026-08-26
The flux residue of LFP-5RW1 series water-washable lead-free solder paste can be removed by water washing, providing high cleanliness, and is suitable for high-reliability electronic assembly.
Published: 2026-08-24Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.